Cypress Semiconductor Corp S72XS256RE0AHBHH0
- Part Number:
- S72XS256RE0AHBHH0
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 7372670-S72XS256RE0AHBHH0
- Description:
- 1.8V V XS-R Memory IC XS-R Series 8mm mm
- Datasheet:
- S72XS256RE0AHBHH0
Cypress Semiconductor Corp S72XS256RE0AHBHH0 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S72XS256RE0AHBHH0.
- Factory Lead Time16 Weeks
- Mounting TypeSurface Mount
- Package / Case133-VFBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTray
- SeriesXS-R
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations133
- ECCN Code3A991.B.1.A
- HTS Code8542.32.00.51
- SubcategoryOther Memory ICs
- TechnologyFLASH, DRAM
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.5mm
- JESD-30 CodeS-PBGA-B133
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.95V
- Power Supplies1.8V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size256Mbit Flash 2565Mbit DDR DRAM
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency108MHz
- Memory FormatFLASH, RAM
- Memory InterfaceParallel
- Organization16MX16
- Memory Width16
- Memory Density268435456 bit
- Length8mm
- Height Seated (Max)1mm
- Width8mm
- RoHS StatusROHS3 Compliant
S72XS256RE0AHBHH0 Overview
In this case, the memory type of the device can be classified as Non-Volatile. Case Tray is available. An embedded 133-VFBGA case surrounds memory ics. It is estimated that the memory size on the chip is 256Mbit Flash 2565Mbit DDR DRAM. As with most mainstream devices, this one uses FLASH, RAM-format memory. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. With 1.7V~1.95V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. It is planted on the chip with 133 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 1.8V to be supplied to this ic memory chip in order to operate. In order to operate effectively, the memory rotates at a clock frequency within a range of 108MHz. In terms of power requirements, this memory chip uses only 1.8V . This part, which belongs to the XS-R series of memory devices, plays an important role in its target applications. Other Memory ICs components are usually considered types of this component.
S72XS256RE0AHBHH0 Features
Package / Case: 133-VFBGA
S72XS256RE0AHBHH0 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBHH0 Memory applications.
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
In this case, the memory type of the device can be classified as Non-Volatile. Case Tray is available. An embedded 133-VFBGA case surrounds memory ics. It is estimated that the memory size on the chip is 256Mbit Flash 2565Mbit DDR DRAM. As with most mainstream devices, this one uses FLASH, RAM-format memory. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. With 1.7V~1.95V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. It is planted on the chip with 133 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 1.8V to be supplied to this ic memory chip in order to operate. In order to operate effectively, the memory rotates at a clock frequency within a range of 108MHz. In terms of power requirements, this memory chip uses only 1.8V . This part, which belongs to the XS-R series of memory devices, plays an important role in its target applications. Other Memory ICs components are usually considered types of this component.
S72XS256RE0AHBHH0 Features
Package / Case: 133-VFBGA
S72XS256RE0AHBHH0 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBHH0 Memory applications.
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
S72XS256RE0AHBHH0 More Descriptions
IC FLASH RAM 256MBIT PAR 133FBGA
IC FLASH RAM 256MIT PARALLEL
SPECIALTY MEMORY CIRCUIT PBGA133
NOR Flash Nor
IC FLASH RAM 256MIT PARALLEL
SPECIALTY MEMORY CIRCUIT PBGA133
NOR Flash Nor
The three parts on the right have similar specifications to S72XS256RE0AHBHH0.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeHTS CodeSubcategoryTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthMemory DensityLengthHeight Seated (Max)WidthRoHS StatusMountNumber of PinsPublishedAdditional FeatureOperating Supply VoltageRadiation HardeningView Compare
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S72XS256RE0AHBHH016 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATrayXS-RActive3 (168 Hours)1333A991.B.1.A8542.32.00.51Other Memory ICsFLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B133Not Qualified1.95V1.8V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit8mm1mm8mmROHS3 Compliant-------
-
13 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATape & Reel (TR)XS-RActive3 (168 Hours)133-8542.32.00.71-FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B133-1.95V-1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit8mm1mm8mmROHS3 Compliant------
-
-Surface Mount133-VFBGA--25°C~85°C TATrayXS-RObsolete3 (168 Hours)1333A991.B.1.A8542.32.00.71Other Memory ICsFLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mm--1.95V-1.7V256Mbit Flash 2565Mbit DDR DRAMNon-Volatile-108MHzFLASH, RAMParallel16MX1616268435456 bit8mm1mm8mmROHS3 CompliantSurface Mount1332002DRAM IS ORGANISED AS 16M X 161.8VNo
-
13 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATape & Reel (TR)XS-RActive3 (168 Hours)133-8542.32.00.71-FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B133-1.95V-1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit8mm1mm8mmROHS3 Compliant------
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