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ISSI, Integrated Silicon Solution Inc IS43TR81024BL-125KBLI

Part Number:

IS43TR81024BL-125KBLI

Manufacturer:

ISSI, Integrated Silicon Solution Inc

Ventron No:

7695165-IS43TR81024BL-125KBLI

Description:

Memory IC 14mm mm

Datasheet:

IS43TR81024BL-125KBLI

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Specifications

ISSI, Integrated Silicon Solution Inc IS43TR81024BL-125KBLI technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS43TR81024BL-125KBLI.

  • Factory Lead Time
    2 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    78-TFBGA
  • Surface Mount
    YES
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~95°C TC
  • Packaging
    Tray
  • JESD-609 Code
    e1
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    78
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    AUTO/SELF REFRESH
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    SDRAM - DDR3L
  • Voltage - Supply
    1.283V~1.45V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    1.35V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    10
  • JESD-30 Code
    R-PBGA-B78
  • Supply Voltage-Max (Vsup)
    1.45V
  • Supply Voltage-Min (Vsup)
    1.283V
  • Memory Size
    8Gb 1G x 8
  • Number of Ports

    Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.

    1
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency

    Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

    800MHz
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    20ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    DRAM
  • Memory Interface
    Parallel
  • Organization
    1GX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    15ns
  • Memory Density
    8589934592 bit
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    14mm
  • Height Seated (Max)
    1.2mm
  • Width
    10mm
  • RoHS Status
    ROHS3 Compliant

Description

IS43TR81024BL-125KBLI Overview
As far as memory types are concerned, Volatile is considered to be its memory type. In addition, memory ics is available in a Tray case as well. In the case of 78-TFBGA, it is embedded within the case. A memory chip with a capacity of 8Gb 1G x 8 is used on this device. There is a mainstream memory format used by this device, which is called DRAM-format memory. This device has an extended operating temperature range of -40°C~95°C TC, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.283V~1.45V. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 78 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.35V. In the memory, there is a clock frequency rotation that ranges 800MHz. The memory chip also offers AUTO/SELF REFRESH to level up system performance despite its merits. The memory chip has 1 ports for granting read/write access to one memory address.

IS43TR81024BL-125KBLI Features
Package / Case: 78-TFBGA
Additional Feature:AUTO/SELF REFRESH


IS43TR81024BL-125KBLI Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS43TR81024BL-125KBLI Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
IS43TR81024BL-125KBLI More Descriptions
DRAM Chip DDR3L SDRAM 8Gbit 1Gx8 1.35V 78-Pin TW-BGA Tray
DRAM, DDR3L, 8 Gbit, 1G x 8bit, 800 MHz, 78 Pins, TWBGA
EAR99 Surface Mount Tray 1GX8 ic memory 800MHz 20ns 10mm 8589934592bit
DDR SDRAM, 1Gx8, 1.35V, 8K, BGA-78,RoHSISSI SCT
IC DRAM 8GBIT PARALLEL 78TWBGA
8G, 1.35V, DDR3L, 1GX8, 1600MT/S
8G, 1.35V, Ddr3L, 1Gx8, 1600Mt/S @ 11-11-11, 78 Ball Bga (10Mm X 14Mm) Rohs, It |Integrated Silicon Solution (Issi) IS43TR81024BL-125KBLI

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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