Cypress Semiconductor Corp S72XS256RE0AHBH10
- Part Number:
- S72XS256RE0AHBH10
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3234156-S72XS256RE0AHBH10
- Description:
- IC FLASH NOR 133MCP
- ECAD Model:
-
- Datasheet:
- S72XS-R MCP
Cypress Semiconductor Corp S72XS256RE0AHBH10 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S72XS256RE0AHBH10.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case133-VFBGA
- Number of Pins133
- Operating Temperature-25°C~85°C TA
- PackagingTray
- Published2002
- SeriesXS-R
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations133
- ECCN Code3A991.B.1.A
- Additional FeatureDRAM IS ORGANISED AS 16M X 16
- HTS Code8542.32.00.71
- SubcategoryOther Memory ICs
- TechnologyFLASH, DRAM
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.5mm
- Operating Supply Voltage1.8V
- Supply Voltage-Max (Vsup)1.95V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size256Mbit Flash 2565Mbit DDR DRAM
- Memory TypeNon-Volatile
- Clock Frequency108MHz
- Memory FormatFLASH, RAM
- Memory InterfaceParallel
- Organization16MX16
- Memory Width16
- Memory Density268435456 bit
- Height Seated (Max)1mm
- Length8mm
- Width8mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
S72XS256RE0AHBH10 Overview
The mount for this particular electronic component is known as Surface Mount. It falls under the ECCN Code 3A991.B.1.A, indicating its classification for export purposes. The supply voltage required for this component is 1.8V, and it operates at the same voltage. Its memory format is FLASH and RAM, making it suitable for storing and retrieving data. The organization of this component is 16MX16, meaning it has 16 million addressable locations, each containing 16 bits of data. Its memory density is an impressive 268435456 bits, making it capable of storing large amounts of information. The component has a maximum seated height of 1mm and a length of 8mm. It is also compliant with the ROHS3 standards, making it a safe and environmentally friendly choice.
S72XS256RE0AHBH10 Features
Package / Case: 133-VFBGA
133 Pins
Operating Supply Voltage:1.8V
Additional Feature:DRAM IS ORGANISED AS 16M X 16
S72XS256RE0AHBH10 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBH10 Memory applications.
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
The mount for this particular electronic component is known as Surface Mount. It falls under the ECCN Code 3A991.B.1.A, indicating its classification for export purposes. The supply voltage required for this component is 1.8V, and it operates at the same voltage. Its memory format is FLASH and RAM, making it suitable for storing and retrieving data. The organization of this component is 16MX16, meaning it has 16 million addressable locations, each containing 16 bits of data. Its memory density is an impressive 268435456 bits, making it capable of storing large amounts of information. The component has a maximum seated height of 1mm and a length of 8mm. It is also compliant with the ROHS3 standards, making it a safe and environmentally friendly choice.
S72XS256RE0AHBH10 Features
Package / Case: 133-VFBGA
133 Pins
Operating Supply Voltage:1.8V
Additional Feature:DRAM IS ORGANISED AS 16M X 16
S72XS256RE0AHBH10 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBH10 Memory applications.
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
S72XS256RE0AHBH10 More Descriptions
Memory Circuit, Flash SDRAM, 16MX16, CMOS, PBGA133
IC FLASH RAM 256MBIT PAR 133FBGA
IC FLASH RAM 256MIT PARALLEL
IC FLASH NOR 133MCP
IC FLASH RAM 256MBIT PAR 133FBGA
IC FLASH RAM 256MIT PARALLEL
IC FLASH NOR 133MCP
The three parts on the right have similar specifications to S72XS256RE0AHBH10.
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ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureHTS CodeSubcategoryTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusFactory Lead TimeSurface MountJESD-30 CodeQualification StatusPower SuppliesOperating ModeView Compare
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S72XS256RE0AHBH10Surface MountSurface Mount133-VFBGA133-25°C~85°C TATray2002XS-RObsolete3 (168 Hours)1333A991.B.1.ADRAM IS ORGANISED AS 16M X 168542.32.00.71Other Memory ICsFLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mm1.8V1.95V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-Volatile108MHzFLASH, RAMParallel16MX1616268435456 bit1mm8mm8mmNoROHS3 Compliant------- -
-Surface Mount133-VFBGA--40°C~85°C TATray-XS-RActive3 (168 Hours)1333A991.B.1.A-8542.32.00.51Other Memory ICsFLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mm-1.95V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-Volatile108MHzFLASH, RAMParallel16MX1616268435456 bit1mm8mm8mm-ROHS3 Compliant16 WeeksYESS-PBGA-B133Not Qualified1.8VSYNCHRONOUS
-
-Surface Mount133-VFBGA--40°C~85°C TATray-XS-RActive3 (168 Hours)133--8542.32.00.71-FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mm-1.95V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-Volatile108MHzFLASH, RAMParallel16MX1616268435456 bit1mm8mm8mm-ROHS3 Compliant13 WeeksYESS-PBGA-B133--SYNCHRONOUS
-
-Surface Mount133-VFBGA--40°C~85°C TATape & Reel (TR)-XS-RActive3 (168 Hours)133--8542.32.00.71-FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mm-1.95V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-Volatile108MHzFLASH, RAMParallel16MX1616268435456 bit1mm8mm8mm-ROHS3 Compliant13 WeeksYESS-PBGA-B133--SYNCHRONOUS
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