Cypress Semiconductor Corp S72XS256RE0AHBJH3
- Part Number:
- S72XS256RE0AHBJH3
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 7372714-S72XS256RE0AHBJH3
- Description:
- 1.8V V XS-R Memory IC XS-R Series 8mm mm
- Datasheet:
- S72XS256RE0AHBJH3
Cypress Semiconductor Corp S72XS256RE0AHBJH3 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S72XS256RE0AHBJH3.
- Factory Lead Time16 Weeks
- Mounting TypeSurface Mount
- Package / Case133-VFBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- SeriesXS-R
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations133
- ECCN Code3A991.B.1.A
- HTS Code8542.32.00.51
- SubcategoryOther Memory ICs
- TechnologyFLASH, DRAM
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.5mm
- JESD-30 CodeS-PBGA-B133
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.95V
- Power Supplies1.8V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size256Mbit Flash 2565Mbit DDR DRAM
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency108MHz
- Memory FormatFLASH, RAM
- Memory InterfaceParallel
- Organization16MX16
- Memory Width16
- Memory Density268435456 bit
- Length8mm
- Height Seated (Max)1mm
- Width8mm
- RoHS StatusROHS3 Compliant
S72XS256RE0AHBJH3 Overview
A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tape & Reel (TR) case as well. Embedded in the 133-VFBGA case, memory ics is a single file. On the chip, there is an 256Mbit Flash 2565Mbit DDR DRAM memory, which is the size of the chip's memory. There is a FLASH, RAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.7V~1.95V volts. The recommended mounting type for memory ics is Surface Mount. A total of 133 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 1.8V will be necessary. A clock frequency rotation within 108MHz is used for the ic memory chip to rotate data. As for power supplies, this memory chip requires just 1.8V . It is an important component of the XS-R series memory devices used in a variety of applications. Usually, this memory ics falls under the Other Memory ICs component category.
S72XS256RE0AHBJH3 Features
Package / Case: 133-VFBGA
S72XS256RE0AHBJH3 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBJH3 Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tape & Reel (TR) case as well. Embedded in the 133-VFBGA case, memory ics is a single file. On the chip, there is an 256Mbit Flash 2565Mbit DDR DRAM memory, which is the size of the chip's memory. There is a FLASH, RAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.7V~1.95V volts. The recommended mounting type for memory ics is Surface Mount. A total of 133 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 1.8V will be necessary. A clock frequency rotation within 108MHz is used for the ic memory chip to rotate data. As for power supplies, this memory chip requires just 1.8V . It is an important component of the XS-R series memory devices used in a variety of applications. Usually, this memory ics falls under the Other Memory ICs component category.
S72XS256RE0AHBJH3 Features
Package / Case: 133-VFBGA
S72XS256RE0AHBJH3 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBJH3 Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
S72XS256RE0AHBJH3 More Descriptions
IC FLASH RAM 256MBIT PAR 133FBGA
IC FLASH RAM 256MIT PARALLEL
IC DRAM 256M PARALLEL 90TFBGA
NOR Flash Nor
IC FLASH RAM 256MIT PARALLEL
IC DRAM 256M PARALLEL 90TFBGA
NOR Flash Nor
The three parts on the right have similar specifications to S72XS256RE0AHBJH3.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeHTS CodeSubcategoryTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthMemory DensityLengthHeight Seated (Max)WidthRoHS StatusView Compare
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S72XS256RE0AHBJH316 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATape & Reel (TR)XS-RActive3 (168 Hours)1333A991.B.1.A8542.32.00.51Other Memory ICsFLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B133Not Qualified1.95V1.8V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit8mm1mm8mmROHS3 Compliant-
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13 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATape & Reel (TR)XS-RActive3 (168 Hours)133-8542.32.00.71-FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B133-1.95V-1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit8mm1mm8mmROHS3 Compliant
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16 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATape & Reel (TR)XS-RActive3 (168 Hours)1333A991.B.1.A8542.32.00.51Other Memory ICsFLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B133Not Qualified1.95V1.8V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit8mm1mm8mmROHS3 Compliant
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26 WeeksSurface Mount133-VFBGAYES-25°C~85°C TATape & Reel (TR)XS-RActive3 (168 Hours)133-8542.32.00.71Other Memory ICsFLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B133Not Qualified1.95V1.8V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit8mm1mm8mmROHS3 Compliant
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