Cypress Semiconductor Corp S72XS256RE0AHBH23
- Part Number:
- S72XS256RE0AHBH23
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3233948-S72XS256RE0AHBH23
- Description:
- IC FLASH NOR 133MCP
- Datasheet:
- S72XS256RE0AHBH23
Cypress Semiconductor Corp S72XS256RE0AHBH23 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S72XS256RE0AHBH23.
- Factory Lead Time13 Weeks
- Mounting TypeSurface Mount
- Package / Case133-VFBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- SeriesXS-R
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations133
- HTS Code8542.32.00.71
- TechnologyFLASH, DRAM
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.5mm
- JESD-30 CodeS-PBGA-B133
- Supply Voltage-Max (Vsup)1.95V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size256Mbit Flash 2565Mbit DDR DRAM
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency108MHz
- Memory FormatFLASH, RAM
- Memory InterfaceParallel
- Organization16MX16
- Memory Width16
- Memory Density268435456 bit
- Height Seated (Max)1mm
- Length8mm
- Width8mm
- RoHS StatusROHS3 Compliant
S72XS256RE0AHBH23 Overview
The XS-R series is a high-quality and reliable product line, currently in active production. With 133 terminations, this product offers a wide range of connection options for various applications. Its HTS code is 8542.32.00.71, ensuring compliance with international trade regulations. Utilizing FLASH and DRAM technology, this product provides fast and efficient data storage capabilities. Its terminal position is located at the bottom, allowing for easy installation and connection. The JESD-30 code for this product is S-PBGA-B133, indicating its surface mount packaging and 133-ball grid array. With a parallel memory interface, this product offers seamless data transfer. Its compact size, measuring at 8mm in length and width, makes it suitable for various devices and systems.
S72XS256RE0AHBH23 Features
Package / Case: 133-VFBGA
S72XS256RE0AHBH23 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBH23 Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
The XS-R series is a high-quality and reliable product line, currently in active production. With 133 terminations, this product offers a wide range of connection options for various applications. Its HTS code is 8542.32.00.71, ensuring compliance with international trade regulations. Utilizing FLASH and DRAM technology, this product provides fast and efficient data storage capabilities. Its terminal position is located at the bottom, allowing for easy installation and connection. The JESD-30 code for this product is S-PBGA-B133, indicating its surface mount packaging and 133-ball grid array. With a parallel memory interface, this product offers seamless data transfer. Its compact size, measuring at 8mm in length and width, makes it suitable for various devices and systems.
S72XS256RE0AHBH23 Features
Package / Case: 133-VFBGA
S72XS256RE0AHBH23 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBH23 Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
S72XS256RE0AHBH23 More Descriptions
FLASH, DRAM Memory IC 256Mb Flash, 256Mb DDR DRAM Parallel 108 MHz 133-FBGA (8x8)
Memory Circuit, 16MX16, CMOS, PBGA133
IC FLASH RAM 256MBIT PAR 133FBGA
IC 65NM CMOS 1.8VOLT FLASH AND LPDDR MCP
Memory Circuit, 16MX16, CMOS, PBGA133
IC FLASH RAM 256MBIT PAR 133FBGA
IC 65NM CMOS 1.8VOLT FLASH AND LPDDR MCP
The three parts on the right have similar specifications to S72XS256RE0AHBH23.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthRoHS StatusECCN CodeSubcategoryQualification StatusPower SuppliesMountNumber of PinsPublishedAdditional FeatureOperating Supply VoltageRadiation HardeningView Compare
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S72XS256RE0AHBH2313 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATape & Reel (TR)XS-RActive3 (168 Hours)1338542.32.00.71FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B1331.95V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit1mm8mm8mmROHS3 Compliant-----------
-
16 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATrayXS-RActive3 (168 Hours)1338542.32.00.51FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B1331.95V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit1mm8mm8mmROHS3 Compliant3A991.B.1.AOther Memory ICsNot Qualified1.8V------
-
16 WeeksSurface Mount133-VFBGAYES-40°C~85°C TATape & Reel (TR)XS-RActive3 (168 Hours)1338542.32.00.51FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mmS-PBGA-B1331.95V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-VolatileSYNCHRONOUS108MHzFLASH, RAMParallel16MX1616268435456 bit1mm8mm8mmROHS3 Compliant3A991.B.1.AOther Memory ICsNot Qualified1.8V------
-
-Surface Mount133-VFBGA--25°C~85°C TATrayXS-RObsolete3 (168 Hours)1338542.32.00.71FLASH, DRAM1.7V~1.95VBOTTOM11.8V0.5mm-1.95V1.7V256Mbit Flash 2565Mbit DDR DRAMNon-Volatile-108MHzFLASH, RAMParallel16MX1616268435456 bit1mm8mm8mmROHS3 Compliant3A991.B.1.AOther Memory ICs--Surface Mount1332002DRAM IS ORGANISED AS 16M X 161.8VNo
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