S72XS256RE0AHBJ20

Cypress Semiconductor Corp S72XS256RE0AHBJ20

Part Number:
S72XS256RE0AHBJ20
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
7372163-S72XS256RE0AHBJ20
Description:
XS-R Memory IC XS-R Series 8mm mm
ECAD Model:
Datasheet:
S72XS256RE0AHBJ20

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Specifications
Cypress Semiconductor Corp S72XS256RE0AHBJ20 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S72XS256RE0AHBJ20.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    133-VFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    XS-R
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    133
  • HTS Code
    8542.32.00.71
  • Technology
    FLASH, DRAM
  • Voltage - Supply
    1.7V~1.95V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.5mm
  • JESD-30 Code
    S-PBGA-B133
  • Supply Voltage-Max (Vsup)
    1.95V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Memory Size
    256Mbit Flash 2565Mbit DDR DRAM
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    108MHz
  • Memory Format
    FLASH, RAM
  • Memory Interface
    Parallel
  • Organization
    16MX16
  • Memory Width
    16
  • Memory Density
    268435456 bit
  • Length
    8mm
  • Height Seated (Max)
    1mm
  • Width
    8mm
  • RoHS Status
    ROHS3 Compliant
Description
S72XS256RE0AHBJ20 Overview
In this case, the memory type of the device can be classified as Non-Volatile. Case Tray is available. An embedded 133-VFBGA case surrounds memory ics. It is estimated that the memory size on the chip is 256Mbit Flash 2565Mbit DDR DRAM. As with most mainstream devices, this one uses FLASH, RAM-format memory. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. With 1.7V~1.95V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. It is planted on the chip with 133 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 1.8V to be supplied to this ic memory chip in order to operate. In order to operate effectively, the memory rotates at a clock frequency within a range of 108MHz. This part, which belongs to the XS-R series of memory devices, plays an important role in its target applications.

S72XS256RE0AHBJ20 Features
Package / Case: 133-VFBGA


S72XS256RE0AHBJ20 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBJ20 Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
S72XS256RE0AHBJ20 More Descriptions
IC FLASH RAM 256MBIT PAR 133FBGA
Memory Circuit, 16MX16, CMOS, PBGA133
IC FLASH RAM 256MIT PARALLEL
IC SRAM 2M PARALLEL 48FBGA
OEMs, CMs ONLY (NO BROKERS)
NOR Flash Nor
Product Comparison
The three parts on the right have similar specifications to S72XS256RE0AHBJ20.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Memory Density
    Length
    Height Seated (Max)
    Width
    RoHS Status
    ECCN Code
    Subcategory
    Qualification Status
    Power Supplies
    View Compare
  • S72XS256RE0AHBJ20
    S72XS256RE0AHBJ20
    13 Weeks
    Surface Mount
    133-VFBGA
    YES
    -40°C~85°C TA
    Tray
    XS-R
    Active
    3 (168 Hours)
    133
    8542.32.00.71
    FLASH, DRAM
    1.7V~1.95V
    BOTTOM
    1
    1.8V
    0.5mm
    S-PBGA-B133
    1.95V
    1.7V
    256Mbit Flash 2565Mbit DDR DRAM
    Non-Volatile
    SYNCHRONOUS
    108MHz
    FLASH, RAM
    Parallel
    16MX16
    16
    268435456 bit
    8mm
    1mm
    8mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
  • S72XS256RE0AHBJH0
    16 Weeks
    Surface Mount
    133-VFBGA
    YES
    -40°C~85°C TA
    Tray
    XS-R
    Active
    3 (168 Hours)
    133
    8542.32.00.51
    FLASH, DRAM
    1.7V~1.95V
    BOTTOM
    1
    1.8V
    0.5mm
    S-PBGA-B133
    1.95V
    1.7V
    256Mbit Flash 2565Mbit DDR DRAM
    Non-Volatile
    SYNCHRONOUS
    108MHz
    FLASH, RAM
    Parallel
    16MX16
    16
    268435456 bit
    8mm
    1mm
    8mm
    ROHS3 Compliant
    3A991.B.1.A
    Other Memory ICs
    Not Qualified
    1.8V
  • S72XS256RE0AHBJ23
    13 Weeks
    Surface Mount
    133-VFBGA
    YES
    -40°C~85°C TA
    Tape & Reel (TR)
    XS-R
    Active
    3 (168 Hours)
    133
    8542.32.00.71
    FLASH, DRAM
    1.7V~1.95V
    BOTTOM
    1
    1.8V
    0.5mm
    S-PBGA-B133
    1.95V
    1.7V
    256Mbit Flash 2565Mbit DDR DRAM
    Non-Volatile
    SYNCHRONOUS
    108MHz
    FLASH, RAM
    Parallel
    16MX16
    16
    268435456 bit
    8mm
    1mm
    8mm
    ROHS3 Compliant
    -
    -
    -
    -
  • S72XS256RE0AHBJ13
    26 Weeks
    Surface Mount
    133-VFBGA
    YES
    -25°C~85°C TA
    Tape & Reel (TR)
    XS-R
    Active
    3 (168 Hours)
    133
    8542.32.00.71
    FLASH, DRAM
    1.7V~1.95V
    BOTTOM
    1
    1.8V
    0.5mm
    S-PBGA-B133
    1.95V
    1.7V
    256Mbit Flash 2565Mbit DDR DRAM
    Non-Volatile
    SYNCHRONOUS
    108MHz
    FLASH, RAM
    Parallel
    16MX16
    16
    268435456 bit
    8mm
    1mm
    8mm
    ROHS3 Compliant
    -
    Other Memory ICs
    Not Qualified
    1.8V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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