Xilinx Inc. XC7Z045-2FBG676E
- Part Number:
- XC7Z045-2FBG676E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3163394-XC7Z045-2FBG676E
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z045-2FBG676E
Xilinx Inc. XC7Z045-2FBG676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FBG676E.
- Factory Lead Time10 Weeks
- Package / Case676-BBGA, FCBGA
- Supplier Device Package676-FCBGA (27x27)
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature0°C
- Frequency800MHz
- Base Part NumberXC7Z045
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- Speed800MHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Max Frequency733MHz
- Speed Grade-2
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Search XC7Z045 for system on chips with similar specs and purposes.800MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.It is just enough to start the SoC computing at 0°C.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FBG676E System On Chip (SoC) applications.
System-on-chip (SoC)
Robotics
Medical Pressure
Cyber security for critical applications in the aerospace
Optical drive
Healthcare
Vending machines
Functional safety for critical applications in the aerospace
Medical
Industrial transport
Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Search XC7Z045 for system on chips with similar specs and purposes.800MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.It is just enough to start the SoC computing at 0°C.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FBG676E System On Chip (SoC) applications.
System-on-chip (SoC)
Robotics
Medical Pressure
Cyber security for critical applications in the aerospace
Optical drive
Healthcare
Vending machines
Functional safety for critical applications in the aerospace
Medical
Industrial transport
XC7Z045-2FBG676E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 676-Pin FCBGA
Processors - Application Specialized XC7Z045-2FBG676E
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
SOC, 667GHZ, FCBGA-676; Product Range:Zynq Family 7000 Series Microprocessors; CPU Speed:800MHz; Core Architecture:ARM Cortex-A9; MPU Case Style:FCBGA; No. of Pins:676Pins RoHS Compliant: Yes
Processors - Application Specialized XC7Z045-2FBG676E
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
SOC, 667GHZ, FCBGA-676; Product Range:Zynq Family 7000 Series Microprocessors; CPU Speed:800MHz; Core Architecture:ARM Cortex-A9; MPU Case Style:FCBGA; No. of Pins:676Pins RoHS Compliant: Yes
The three parts on the right have similar specifications to XC7Z045-2FBG676E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureMax FrequencySpeed GradePrimary AttributesRadiation HardeningRoHS StatusSurface MountJESD-609 CodePbfree CodeNumber of TerminationsTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Clock FrequencyBoundary ScanRAM (words)Bus CompatibilityHeight Seated (Max)LengthWidthContact PlatingECCN CodeOperating Supply VoltageMemory TypeMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersView Compare
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XC7Z045-2FBG676E10 Weeks676-BBGA, FCBGA676-FCBGA (27x27)0°C~100°C TJTray2009Zynq®-7000Active3 (168 Hours)100°C0°C800MHzXC7Z045CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130800MHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARM733MHz-2Kintex™-7 FPGA, 350K Logic CellsNoROHS3 Compliant---------------------------------
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10 Weeks484-LFBGA, CSPBGA--40°C~100°C TJTray2016Zynq®-7000Active3 (168 Hours)-----150766MHz256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA----Artix™-7 FPGA, 55K Logic Cells-ROHS3 CompliantYESe3yes485Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mmNOT SPECIFIEDS-PBGA-B4851.05V0.95V800MHzYES256000CAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm19mm---------
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10 Weeks676-BBGA, FCBGA-0°C~100°C TJTray2009Zynq®-7000Active4 (72 Hours)--800MHzXC7Z045CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARM--2Kintex™-7 FPGA, 350K Logic CellsNoROHS3 CompliantYESe1-676Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm30S-PBGA-B6761.05V--YES256000CAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mm-Copper, Silver, Tin3A991.D1VROMless-----
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10 Weeks676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000Active3 (168 Hours)--667MHz-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARM-1Kintex™-7 FPGA, 275K Logic Cells-ROHS3 Compliant-e1-676Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-NOT SPECIFIEDS-PBGA-B676---YES256000CAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmCopper, Silver, Tin---Surface Mount1.05V950mV120 ps343800
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