Xilinx Inc. XC7Z045-1FFG900C

Name: XC7Z045-1FFG900C
Brand: Xilinx Inc.
SKU: 3668528-XC7Z045-1FFG900C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z045-1FFG900C

Manufacturer:: Xilinx Inc.

Ventron No:: 3668528-XC7Z045-1FFG900C

Description:: IC SOC CORTEX-A9 KINTEX7 900FBGA

ECAD Model:

Datasheet:: XC7Z045-1FFG900C

Specifications

Xilinx Inc. XC7Z045-1FFG900C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FFG900C.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
900-BBGA, FCBGA
Surface Mount
YES
Number of Pins
900
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
667MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z045
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage
3.3V
Min Supply Voltage
1.2V
Number of I/O
130
RAM Size
256KB
Memory Type
ROMless
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Number of Logic Elements/Cells
190000
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
3.35mm
Length
31mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Xilinx Inc. is the brand of this part, which is an Embedded - System On Chip (SoC) chip. It falls under the Embedded - System On Chip (SoC) category and has a Contact Plating of Copper, Silver, Tin. The Package / Case options for this chip are 900-BBGA and FCBGA, and it is Surface Mount compatible. The series of this chip is Zynq®-7000 and its Terminal Position is BOTTOM. The Terminal Form is BALL and its maximum Reflow Temperature (s) is 30. The Base Part Number is XC7Z045 and it has a RAM capacity of 256000 words. This part is also ROHS3 Compliant.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-1FFG900C System On Chip (SoC) applications.

Functional safety for critical applications in the automotive
Embedded systems
Measurement tools
Wireless networking
Cyberphysical system-on-chip
Networked sensors
Keywords
Networked sensors
Wireless sensor networks
Flow Sensors

XC7Z045-1FFG900C More Descriptions

MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 900-Pin FC-BGA
Processor Supervisor 3V to 5.5V 16-Pin SOIC W Tube
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-900
Processors - Application Specialized XC7Z045-1FFG900C
IC SOC CORTEX-A9 667MHZ 900FCBGA
P13 PLC ON A CHIP 10 PACK, LQFP-
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-1FFG900C

Product Comparison

The three parts on the right have similar specifications to XC7Z045-1FFG900C.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

Base Part Number

Interface

Max Supply Voltage

Min Supply Voltage

Number of I/O

RAM Size

Memory Type

Core Processor

Peripherals

Connectivity

Architecture

Data Bus Width

Number of Logic Elements/Cells

Core Architecture

Boundary Scan

Speed Grade

RAM (words)

Primary Attributes

Bus Compatibility

Height Seated (Max)

Length

Radiation Hardening

RoHS Status

Pbfree Code

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Speed

Clock Frequency

Width

Operating Supply Voltage

View Compare
XC7Z045-1FFG900C

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

900-BBGA, FCBGA

YES

900

0°C~85°C TJ

Tray

2009

Zynq®-7000

e1

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

667MHz

30

XC7Z045

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

3.3V

1.2V

130

256KB

ROMless

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

190000

ARM

YES

-1

256000

Kintex™-7 FPGA, 350K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

No

ROHS3 Compliant

-

-

-

-

-

-

-

-

-
XC7Z012S-2CLG485I

Xilinx Inc.

10 Weeks

-

484-LFBGA, CSPBGA

YES

-

-40°C~100°C TJ

Tray

2016

Zynq®-7000

e3

Active

3 (168 Hours)

485

-

Matte Tin (Sn)

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

0.8mm

-

NOT SPECIFIED

-

-

-

-

150

256KB

-

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

YES

-

256000

Artix™-7 FPGA, 55K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

1.6mm

19mm

-

ROHS3 Compliant

yes

S-PBGA-B485

1.05V

0.95V

766MHz

800MHz

19mm

-

XC7Z045-1FFG900C vs XC7Z012S-2CLG485I
XC7Z045-2FBG676I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

676-BBGA, FCBGA

YES

676

-40°C~100°C TJ

Tray

2009

Zynq®-7000

e1

Active

3 (168 Hours)

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

XC7Z045

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

-

-

130

256KB

ROMless

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

-

ARM

YES

-2

256000

Kintex™-7 FPGA, 350K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

No

ROHS3 Compliant

-

-

1.05V

-

-

-

-

1V

XC7Z045-1FFG900C vs XC7Z045-2FBG676I
XC7Z045-3FFV676E

Xilinx Inc.

10 Weeks

-

676-BBGA, FCBGA

-

-

0°C~100°C TJ

Bulk

2009

Zynq®-7000

-

Active

4 (72 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

130

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Kintex™-7 FPGA, 350K Logic Cells

-

-

-

-

ROHS3 Compliant

-

-

-

-

1GHz

-

-

-

XC7Z045-1FFG900C vs XC7Z045-3FFV676E