XC7Z045-1FFG676C

Xilinx Inc. XC7Z045-1FFG676C

Part Number:
XC7Z045-1FFG676C
Manufacturer:
Xilinx Inc.
Ventron No:
3162336-XC7Z045-1FFG676C
Description:
IC SOC CORTEX-A9 KINTEX7 676FBGA
ECAD Model:
Datasheet:
XC7Z045-1FFG676C

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Specifications
Xilinx Inc. XC7Z045-1FFG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FFG676C.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    676-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    676
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    667MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z045
  • JESD-30 Code
    S-PBGA-B676
  • Operating Supply Voltage
    1V
  • Supply Voltage-Max (Vsup)
    1.05V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Memory Type
    ROMless
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -1
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    3.37mm
  • Length
    27mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Zynq?-7000 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.It is packaged in a state-of-the-art Tray package.This SoC part has a total of 130 I/Os.It is recommended to use a 1V power supply.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.Having 676 terminations in total makes system on a chip possible.You can get system on chips with similar specs and purposes by searching XC7Z045.In this wireless SoC, the frequency is set to 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-1FFG676C System On Chip (SoC) applications.

Communication network-on-Chip (cNoC)
Healthcare
String inverter
Smart appliances
Optical drive
ARM Cortex M4 microcontroller
Special Issue Editors
Central inverter
Sports
Networked Media Encode/Decode
XC7Z045-1FFG676C More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
Processors - Application Specialized XC7Z045-1FFG676C
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-1FFG676C
Product Comparison
The three parts on the right have similar specifications to XC7Z045-1FFG676C.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Interface
    Number of I/O
    RAM Size
    Memory Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Pbfree Code
    Supply Voltage-Min (Vsup)
    Speed
    Clock Frequency
    Width
    Number of Pins
    Propagation Delay
    Number of Registers
    View Compare
  • XC7Z045-1FFG676C
    XC7Z045-1FFG676C
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    667MHz
    30
    XC7Z045
    S-PBGA-B676
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    ROMless
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -1
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.37mm
    27mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z012S-2CLG485I
    10 Weeks
    -
    484-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    Active
    3 (168 Hours)
    485
    -
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    -
    NOT SPECIFIED
    -
    S-PBGA-B485
    -
    1.05V
    -
    150
    256KB
    -
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    YES
    -
    256000
    Artix™-7 FPGA, 55K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    -
    ROHS3 Compliant
    yes
    0.95V
    766MHz
    800MHz
    19mm
    -
    -
    -
  • XC7Z045-3FFV676E
    10 Weeks
    -
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    -
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    1GHz
    -
    -
    -
    -
    -
  • XC7Z035-1FFG900I
    10 Weeks
    -
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    667MHz
    30
    -
    -
    1V
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    900
    130 ps
    343800
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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