Xilinx Inc. XC7Z045-1FBG676C
- Part Number:
- XC7Z045-1FBG676C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669298-XC7Z045-1FBG676C
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z045-1FBG676C
Xilinx Inc. XC7Z045-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FBG676C.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Number of Pins676
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Max Supply Voltage3.3V
- Min Supply Voltage1.2V
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Number of Logic Elements/Cells190000
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length27mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.It is really beneficial to have system on a chip since there are 676 terminations in total.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.In this wireless SoC, the frequency is set to 667MHz.In terms of core architecture, the SoC meaning relies on ARM.This is the 676-pin version of the computer SoC.Voltage of maximum supply is 3.3V.A minimum of 1.2V are supplied to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676C System On Chip (SoC) applications.
Special Issue Editors
String inverter
Digital Media
Industrial sectors
POS Terminals
PC peripherals
Networked sensors
Measurement testers
Medical Pressure
Automated sorting equipment
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.It is really beneficial to have system on a chip since there are 676 terminations in total.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.In this wireless SoC, the frequency is set to 667MHz.In terms of core architecture, the SoC meaning relies on ARM.This is the 676-pin version of the computer SoC.Voltage of maximum supply is 3.3V.A minimum of 1.2V are supplied to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676C System On Chip (SoC) applications.
Special Issue Editors
String inverter
Digital Media
Industrial sectors
POS Terminals
PC peripherals
Networked sensors
Measurement testers
Medical Pressure
Automated sorting equipment
XC7Z045-1FBG676C More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
FPGA Kintex-7 Family 350000 Cells 28nm Technology Automotive 676-Pin Lidless FCBGA
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-1FBG676C
FPGA Kintex-7 Family 350000 Cells 28nm Technology Automotive 676-Pin Lidless FCBGA
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-1FBG676C
The three parts on the right have similar specifications to XC7Z045-1FBG676C.
-
ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberInterfaceMax Supply VoltageMin Supply VoltageNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthNumber of Logic Elements/CellsCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusOperating Supply VoltageSupply Voltage-Max (Vsup)MountJESD-30 CodePropagation DelayNumber of RegistersWidthView Compare
-
XC7Z045-1FBG676C10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES6760°C~85°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm667MHz30XC7Z045CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB3.3V1.2V130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32b190000ARMYES-1256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant--------
-
10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES676-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32b-ARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant1V1.05V-----
-
10 WeeksCopper, Silver, Tin676-BBGA, FCBGA--0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676---CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--ARMYES3256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant--Surface MountS-PBGA-B676110 ps34380027mm
-
10 Weeks-900-BBGA, FCBGAYES900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)-CMOSBOTTOMBALL2451V-667MHz30-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant1V---130 ps343800-
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
12 December 2023
What is 74LS74 Dual D Flip Flop?
Ⅰ. What is a D flip-flop?Ⅱ. Overview of 74LS74Ⅲ. Pin configuration and functions of 74LS74Ⅳ. What are the features of 74LS74?Ⅴ. Structure and working principle of 74LS74Ⅵ. Technical... -
12 December 2023
TM1650 LED Driver IC Features, Working Principle, Applications, Usage and More
Ⅰ. Overview of TM1650Ⅱ. Symbol, footprint and pin configuration of TM1650Ⅲ. Features of TM1650 LED driverⅣ. Technical parameters of TM1650 LED driverⅤ. How does the TM1650 LED driver... -
13 December 2023
74HC00 Pin Configuration, Replacements, Applications and Other Details
Ⅰ. Overview of 74HC00Ⅱ. Pin configuration and functions of 74HC00Ⅲ. What are the features of 74HC00?Ⅳ. Technical parameters of 74HC00Ⅴ. Working principle of 74HC00Ⅵ. Absolute maximum ratings of... -
13 December 2023
2N2222A NPN Transistor Features, Technical Parameters, Working Principle, Applications and Usage
Ⅰ. Overview of 2N2222A transistorⅡ. Symbol, footprint and pin configuration of 2N2222A transistorⅢ. What are the features of 2N2222A transistor?Ⅳ. Technical parameters of 2N2222A transistorⅤ. How does the...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.