XC7Z045-1FBG676C

Xilinx Inc. XC7Z045-1FBG676C

Part Number:
XC7Z045-1FBG676C
Manufacturer:
Xilinx Inc.
Ventron No:
3669298-XC7Z045-1FBG676C
Description:
IC SOC CORTEX-A9 KINTEX7 676FBGA
ECAD Model:
Datasheet:
XC7Z045-1FBG676C

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Specifications
Xilinx Inc. XC7Z045-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FBG676C.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    676-BBGA, FCBGA
  • Surface Mount
    YES
  • Number of Pins
    676
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    667MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z045
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Max Supply Voltage
    3.3V
  • Min Supply Voltage
    1.2V
  • Number of I/O
    130
  • RAM Size
    256KB
  • Memory Type
    ROMless
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Number of Logic Elements/Cells
    190000
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -1
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    2.54mm
  • Length
    27mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.It is really beneficial to have system on a chip since there are 676 terminations in total.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.In this wireless SoC, the frequency is set to 667MHz.In terms of core architecture, the SoC meaning relies on ARM.This is the 676-pin version of the computer SoC.Voltage of maximum supply is 3.3V.A minimum of 1.2V are supplied to it.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-1FBG676C System On Chip (SoC) applications.

Special Issue Editors
String inverter
Digital Media
Industrial sectors
POS Terminals
PC peripherals
Networked sensors
Measurement testers
Medical Pressure
Automated sorting equipment
XC7Z045-1FBG676C More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
FPGA Kintex-7 Family 350000 Cells 28nm Technology Automotive 676-Pin Lidless FCBGA
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-1FBG676C
Product Comparison
The three parts on the right have similar specifications to XC7Z045-1FBG676C.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Number of I/O
    RAM Size
    Memory Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Number of Logic Elements/Cells
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Mount
    JESD-30 Code
    Propagation Delay
    Number of Registers
    Width
    View Compare
  • XC7Z045-1FBG676C
    XC7Z045-1FBG676C
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    YES
    676
    0°C~85°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    667MHz
    30
    XC7Z045
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    3.3V
    1.2V
    130
    256KB
    ROMless
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    190000
    ARM
    YES
    -1
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FBG676I
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    YES
    676
    -40°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    XC7Z045
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    130
    256KB
    ROMless
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    -
    ARM
    YES
    -2
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    No
    ROHS3 Compliant
    1V
    1.05V
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    -
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    800MHz
    NOT SPECIFIED
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    ARM
    YES
    3
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    -
    ROHS3 Compliant
    -
    -
    Surface Mount
    S-PBGA-B676
    110 ps
    343800
    27mm
  • XC7Z035-1FFG900I
    10 Weeks
    -
    900-BBGA, FCBGA
    YES
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    667MHz
    30
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    -
    -
    ROHS3 Compliant
    1V
    -
    -
    -
    130 ps
    343800
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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