Xilinx Inc. XC7Z035-L2FFG900I
- Part Number:
- XC7Z035-L2FFG900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669061-XC7Z035-L2FFG900I
- Description:
- IC SOC CORTEX-A9 KINTEX7 900BGA
- Datasheet:
- XC7Z035-L2FFG900I
Xilinx Inc. XC7Z035-L2FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-L2FFG900I.
- Factory Lead Time10 Weeks
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)30
- JESD-30 CodeS-PBGA-B900
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 275K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.35mm
- Length31mm
- Width31mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is part of the Zynq?-7000 series of system on a chips.The average operating temps for this SoC meaning should be -40°C~100°C TJ.A key point to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.130 I/Os are included in this SoC part.It is advised to utilize a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.In order to run it, it must be fed by at least 0.95V of power.In total, there are 900 terminations, which is great for system on a chip.A frequency of 800MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-L2FFG900I System On Chip (SoC) applications.
Cyber security for critical applications in the aerospace
AC drive control module
Samsung galaxy gear
ARM Cortex M4 microcontroller
System-on-chip (SoC)
Automotive gateway
DC-input BLDC motor drive
Print Special Issue Flyer
Deep learning hardware
Central alarm system
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is part of the Zynq?-7000 series of system on a chips.The average operating temps for this SoC meaning should be -40°C~100°C TJ.A key point to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.130 I/Os are included in this SoC part.It is advised to utilize a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.In order to run it, it must be fed by at least 0.95V of power.In total, there are 900 terminations, which is great for system on a chip.A frequency of 800MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-L2FFG900I System On Chip (SoC) applications.
Cyber security for critical applications in the aerospace
AC drive control module
Samsung galaxy gear
ARM Cortex M4 microcontroller
System-on-chip (SoC)
Automotive gateway
DC-input BLDC motor drive
Print Special Issue Flyer
Deep learning hardware
Central alarm system
XC7Z035-L2FFG900I More Descriptions
FPGA Zynq-7000 Family 275000 Cells 28nm Technology 1V 900-Pin FC-BGA
IC SOC CORTEX-A9 800MHZ 900FCBGA
Product Description Demo for Development.
IC SOC CORTEX-A9 KINTEX7 900BGA
Processors - Application Specialized
IC SOC CORTEX-A9 800MHZ 900FCBGA
Product Description Demo for Development.
IC SOC CORTEX-A9 KINTEX7 900BGA
Processors - Application Specialized
The three parts on the right have similar specifications to XC7Z035-L2FFG900I.
-
ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthWidthRoHS StatusContact PlatingMountMax Supply VoltageMin Supply VoltagePropagation DelaySpeed GradeNumber of RegistersNumber of PinsTurn On Delay TimeView Compare
-
XC7Z035-L2FFG900I10 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30S-PBGA-B9001.05V0.95VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm31mmROHS3 Compliant----------
-
10 Weeks676-BBGA, FCBGA-0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676----CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIEDS-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 CompliantCopper, Silver, TinSurface Mount1.05V950mV110 ps3343800--
-
10 Weeks676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)--CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIEDS-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 CompliantCopper, Silver, TinSurface Mount1.05V950mV120 ps1343800--
-
10 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm31mmROHS3 CompliantCopper, Silver, TinSurface Mount1.05V950mV120 ps-554800900120 ps
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
28 September 2023
TIP35C Footprint, Package, Application and Other Details
Ⅰ. Overview of TIP35CⅡ. Symbol and footprint of TIP35CⅢ. Technical parametersⅣ. Features of TIP35CⅤ. Pinout and package of TIP35CⅥ. Working principle of TIP35C audio power amplifierⅦ. Application of... -
07 October 2023
An Introduction to TDA7266SA Dual Bridge Amplifier
Ⅰ. What is TDA7266SA?Ⅱ. Symbol, footprint and pin connection of TDA7266SAⅢ. Technical parametersⅣ. Features of TDA7266SAⅤ. How to configure the gain of TDA7266SA?Ⅵ. How is the short circuit... -
07 October 2023
How does IRF640 differ from IRF740?
Ⅰ. What is MOSFET?Ⅱ. Overview of IRF640Ⅲ. Overview of IRF740Ⅳ. IRF640 vs IRF740: SymbolⅤ. IRF640 vs IRF740: Technical parametersⅥ. IRF640 vs IRF740: FeaturesⅦ. IRF640 vs IRF740: Working principleⅧ.... -
08 October 2023
2N3773 Transistor Equivalent, Features and Applications
Ⅰ. 2N3773 transistor overviewⅡ. Symbol and pin connection of 2N3773Ⅲ. Technical parametersⅣ. What are the features of 2N3773?Ⅴ. How does the 2N3773 achieve amplification and switching functions in...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.