XC7Z035-L2FFG900I

Xilinx Inc. XC7Z035-L2FFG900I

Part Number:
XC7Z035-L2FFG900I
Manufacturer:
Xilinx Inc.
Ventron No:
3669061-XC7Z035-L2FFG900I
Description:
IC SOC CORTEX-A9 KINTEX7 900BGA
ECAD Model:
Datasheet:
XC7Z035-L2FFG900I

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Specifications
Xilinx Inc. XC7Z035-L2FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-L2FFG900I.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    800MHz
  • Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    S-PBGA-B900
  • Supply Voltage-Max (Vsup)
    1.05V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 275K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    3.35mm
  • Length
    31mm
  • Width
    31mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is part of the Zynq?-7000 series of system on a chips.The average operating temps for this SoC meaning should be -40°C~100°C TJ.A key point to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.130 I/Os are included in this SoC part.It is advised to utilize a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.In order to run it, it must be fed by at least 0.95V of power.In total, there are 900 terminations, which is great for system on a chip.A frequency of 800MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z035-L2FFG900I System On Chip (SoC) applications.

Cyber security for critical applications in the aerospace
AC drive control module
Samsung galaxy gear
ARM Cortex M4 microcontroller
System-on-chip (SoC)
Automotive gateway
DC-input BLDC motor drive
Print Special Issue Flyer
Deep learning hardware
Central alarm system
XC7Z035-L2FFG900I More Descriptions
FPGA Zynq-7000 Family 275000 Cells 28nm Technology 1V 900-Pin FC-BGA
IC SOC CORTEX-A9 800MHZ 900FCBGA
Product Description Demo for Development.
IC SOC CORTEX-A9 KINTEX7 900BGA
Processors - Application Specialized
Product Comparison
The three parts on the right have similar specifications to XC7Z035-L2FFG900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Core Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Contact Plating
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Speed Grade
    Number of Registers
    Number of Pins
    Turn On Delay Time
    View Compare
  • XC7Z035-L2FFG900I
    XC7Z035-L2FFG900I
    10 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    S-PBGA-B900
    1.05V
    0.95V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    31mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    800MHz
    NOT SPECIFIED
    S-PBGA-B676
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    1.05V
    950mV
    110 ps
    3
    343800
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    S-PBGA-B676
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    1.05V
    950mV
    120 ps
    1
    343800
    -
    -
  • XC7Z100-L2FFG900I
    10 Weeks
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    31mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    1.05V
    950mV
    120 ps
    -
    554800
    900
    120 ps
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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