Xilinx Inc. XC7Z035-L2FFG676I
- Part Number:
- XC7Z035-L2FFG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669354-XC7Z035-L2FFG676I
- Description:
- IC SOC CORTEX-A9 KINTEX7 676BGA
- Datasheet:
- XC7Z035-L2FFG676I
Xilinx Inc. XC7Z035-L2FFG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-L2FFG676I.
- Factory Lead Time10 Weeks
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- Number of I/O130
- Speed800MHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- Clock Frequency800MHz
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 275K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.37mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 130 I/Os.A 1V power supply should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.There is a possibility that it can be powered by a power supply of at least 0.95V.In total, there are 676 terminations, which is great for system on a chip.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.A 800MHz clock frequency is followed by this SoC.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Clock Frequency: 800MHz
There are a lot of Xilinx Inc.
XC7Z035-L2FFG676I System On Chip (SoC) applications.
String inverter
Avionics
Personal Computers
Special Issue Information
Optical drive
Industrial Pressure
Transmitters
Healthcare
Remote control
ARM support modules
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 130 I/Os.A 1V power supply should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.There is a possibility that it can be powered by a power supply of at least 0.95V.In total, there are 676 terminations, which is great for system on a chip.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.A 800MHz clock frequency is followed by this SoC.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Clock Frequency: 800MHz
There are a lot of Xilinx Inc.
XC7Z035-L2FFG676I System On Chip (SoC) applications.
String inverter
Avionics
Personal Computers
Special Issue Information
Optical drive
Industrial Pressure
Transmitters
Healthcare
Remote control
ARM support modules
XC7Z035-L2FFG676I More Descriptions
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA Tray
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676
Thick Film Resistors - SMD 1/8watt 100Mohms 5% 500ppm
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Processors - Application Specialized
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-L2FFG676I
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676
Thick Film Resistors - SMD 1/8watt 100Mohms 5% 500ppm
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Processors - Application Specialized
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-L2FFG676I
The three parts on the right have similar specifications to XC7Z035-L2FFG676I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsClock FrequencyConnectivityArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthWidthRoHS StatusContact PlatingMountFrequencyInterfaceMax Supply VoltageMin Supply VoltagePropagation DelayCore ArchitectureSpeed GradeNumber of RegistersNumber of PinsTurn On Delay TimeOperating Supply VoltageView Compare
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XC7Z035-L2FFG676I10 Weeks676-BBGA, FCBGAYES-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALLNOT SPECIFIED1V1mmNOT SPECIFIEDS-PBGA-B6761.05V0.95V130800MHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA800MHzCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mm27mmROHS3 Compliant--------------
-
10 Weeks676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)--CMOSBOTTOMBALLNOT SPECIFIED1V-NOT SPECIFIEDS-PBGA-B676--130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 CompliantCopper, Silver, TinSurface Mount667MHzCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV120 psARM1343800---
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10 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALL2451V1mm30---130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm31mmROHS3 CompliantCopper, Silver, TinSurface Mount800MHzCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV120 psARM-554800900120 ps-
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10 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)--CMOSBOTTOMBALL2451V-30---130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant--667MHzCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--130 psARM1343800900-1V
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