Xilinx Inc. XC7Z035-1FFG676C

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.Tray package houses this SoC system on a chip.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.05V.There is a possibility that it can be powered by a power supply of at least 0.95V.In total, there are 676 terminations, which is great for system on a chip.667MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z035-1FFG676C System On Chip (SoC) applications.

Servo drive control module
Fitness
Efficient hardware for training of neural networks
Self-aware system-on-chip (SoC)
Apple smart watch
Automotive gateway
Remote control
RISC-V
CNC control
Mouse