Xilinx Inc. XC7Z010-L1CLG400I

Name: XC7Z010-L1CLG400I
Brand: Xilinx Inc.
SKU: 3162500-XC7Z010-L1CLG400I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z010-L1CLG400I

Manufacturer:: Xilinx Inc.

Ventron No:: 3162500-XC7Z010-L1CLG400I

Description:: IC SOC CORTEX-A9 ARTIX7 400BGA

ECAD Model:

Datasheet:: XC7Z010-L1CLG400I

Specifications

Xilinx Inc. XC7Z010-L1CLG400I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z010-L1CLG400I.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Package / Case
400-LFBGA, CSPBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
400
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1V
Terminal Pitch
0.8mm
Frequency
667MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B400
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage
1.05V
Min Supply Voltage
950mV
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
RAM (words)
256000
Primary Attributes
Artix™-7 FPGA, 28K Logic Cells
Number of Registers
35200
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
1.6mm
Length
17mm
Width
17mm
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The product is available in a 400-LFBGA, CSPBGA package/case, ensuring durability and reliability. With a Moisture Sensitivity Level (MSL) of 3 (168 Hours), it guarantees safe handling and storage. The product falls under the ECCN Code EAR99, making it compliant with export regulations. It features a BALL terminal form and a terminal pitch of 0.8mm, facilitating easy integration into various applications. The maximum supply voltage of 1.05V ensures efficient power management. Equipped with DMA peripherals, the product offers enhanced data transfer capabilities. Its architecture combines MCU and FPGA, while the ARM core architecture provides high-performance processing. With a maximum seated height of 1.6mm, it offers compactness and space optimization.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z010-L1CLG400I System On Chip (SoC) applications.

Microprocessors
Industrial robot
Body control module
POS Terminals
ARM support modules
Automated sorting equipment
Microcontroller
Wireless sensor networks
Avionics
Sports

XC7Z010-L1CLG400I More Descriptions

FPGA Zynq-7000 28000 Cells 28nm Technology 1V 400-Pin CS-BGA
PSOC, ARM CORTEX-A9, 667MHZ, CSBGA-400
IC SOC CORTEX-A9 667MHZ 400BGA
4300 CLBs, 55000-Cell, PBGA485
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Csbga-400; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Csbga; No. Of Pins:400Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z010-L1CLG400I

Product Comparison

The three parts on the right have similar specifications to XC7Z010-L1CLG400I.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Package / Case

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

JESD-30 Code

Interface

Max Supply Voltage

Min Supply Voltage

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Boundary Scan

RAM (words)

Primary Attributes

Number of Registers

Bus Compatibility

Height Seated (Max)

Length

Width

RoHS Status

Surface Mount

Number of Pins

Base Part Number

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Memory Type

Data Bus Width

Speed Grade

Radiation Hardening

Propagation Delay

View Compare
XC7Z010-L1CLG400I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

400-LFBGA, CSPBGA

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

3 (168 Hours)

400

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

0.8mm

667MHz

NOT SPECIFIED

S-PBGA-B400

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Artix™-7 FPGA, 28K Logic Cells

35200

CAN; ETHERNET; I2C; SPI; UART; USB

1.6mm

17mm

17mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-
XC7Z045-2FBG676I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

-

676-BBGA, FCBGA

-40°C~100°C TJ

Tray

2009

Zynq®-7000

e1

Active

3 (168 Hours)

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

-

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

-

-

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 350K Logic Cells

-

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

-

ROHS3 Compliant

YES

676

XC7Z045

1V

1.05V

ROMless

32b

-2

No

-

XC7Z010-L1CLG400I vs XC7Z045-2FBG676I
XC7Z035-3FBG676E

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

676-BBGA, FCBGA

0°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

3 (168 Hours)

676

-

-

-

-

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

800MHz

NOT SPECIFIED

S-PBGA-B676

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 275K Logic Cells

343800

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

27mm

ROHS3 Compliant

-

-

-

-

-

-

-

3

-

110 ps

XC7Z010-L1CLG400I vs XC7Z035-3FBG676E
XC7Z035-1FFG900I

Xilinx Inc.

10 Weeks

-

-

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

CMOS

BOTTOM

BALL

245

1V

-

667MHz

30

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

-

-

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 275K Logic Cells

343800

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

-

-

ROHS3 Compliant

YES

900

-

1V

-

-

-

1

-

130 ps

XC7Z010-L1CLG400I vs XC7Z035-1FFG900I