Infineon Technologies IRF6216TRPBF
- Part Number:
- IRF6216TRPBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 3070110-IRF6216TRPBF
- Description:
- MOSFET P-CH 150V 2.2A 8-SOIC
- Datasheet:
- IRF6216TRPBF
Infineon Technologies IRF6216TRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF6216TRPBF.
- Factory Lead Time14 Weeks
- Contact PlatingTin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case8-SOIC (0.154, 3.90mm Width)
- Number of Pins8
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~150°C TJ
- PackagingTape & Reel (TR)
- SeriesHEXFET®
- Published2005
- JESD-609 Codee3
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- TerminationSMD/SMT
- ECCN CodeEAR99
- Resistance240mOhm
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Time@Peak Reflow Temperature-Max (s)30
- Number of Elements1
- Number of Channels1
- Power Dissipation-Max2.5W Ta
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation2.5W
- Turn On Delay Time18 ns
- FET TypeP-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs240m Ω @ 1.3A, 10V
- Vgs(th) (Max) @ Id5V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds1280pF @ 25V
- Current - Continuous Drain (Id) @ 25°C2.2A Ta
- Gate Charge (Qg) (Max) @ Vgs49nC @ 10V
- Rise Time15ns
- Drive Voltage (Max Rds On,Min Rds On)10V
- Vgs (Max)±20V
- Fall Time (Typ)26 ns
- Turn-Off Delay Time33 ns
- Continuous Drain Current (ID)-2.2A
- Threshold Voltage-5V
- Gate to Source Voltage (Vgs)20V
- Drain to Source Breakdown Voltage-150V
- Dual Supply Voltage150V
- Recovery Time120 ns
- Max Junction Temperature (Tj)150°C
- Nominal Vgs5 V
- Height1.75mm
- Length4.9784mm
- Width3.9878mm
- REACH SVHCNo SVHC
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
IRF6216TRPBF Description
Stripe Planar MOSFETs from IRF6216TRPBF use cutting-edge manufacturing techniques to provide extremely low on-resistance per silicon area. The current and voltage of an avalanche are fully characterized. This MOSFET has the following features:, Switching Losses, and Effective COSS for Design Simplification.
IRF6216TRPBF Features
To reduce the drain charge, set the gate to a low value.
Losses in Switching
Capacitance that has been fully characterized, including
Effective COSS for Design Simplification (See
Avalanche Voltage and Current are fully characterized.
IRF6216TRPBF Applications
Reset the Active Clamp Switch Reset
Converters from DC to DC
Lead-Free
Stripe Planar MOSFETs from IRF6216TRPBF use cutting-edge manufacturing techniques to provide extremely low on-resistance per silicon area. The current and voltage of an avalanche are fully characterized. This MOSFET has the following features:, Switching Losses, and Effective COSS for Design Simplification.
IRF6216TRPBF Features
To reduce the drain charge, set the gate to a low value.
Losses in Switching
Capacitance that has been fully characterized, including
Effective COSS for Design Simplification (See
Avalanche Voltage and Current are fully characterized.
IRF6216TRPBF Applications
Reset the Active Clamp Switch Reset
Converters from DC to DC
Lead-Free
IRF6216TRPBF More Descriptions
MOSFET, Power;P-Ch;VDSS -150V;RDS(ON) 0.24Ohm;ID -2.2A;SO-8;PD 2.5W;VGS /-20V
Single P-Channel 150 V 240 mOhm 33 nC HEXFET® Power Mosfet - SOIC-8
-150V Single P-Channel HEXFET Power MOSFET in a SO-8 package, SO8, RoHSInfineon SCT
Benefits: RoHS Compliant; Low RDS(on); Industry-leading quality; Dynamic dv/dt Rating; Fast Switching; Fully Avalanche Rated; 175C Operating Temperature; P-Channel MOSFET
MOSFET; Transistor Type:MOSFET; Transistor Polarity:P Channel; Drain Source Voltage, Vds:-150V; Continuous Drain Current, Id:-2.2A; On Resistance, Rds(on):240mohm; Rds(on) Test Voltage, Vgs:-10V; Leaded Process Compatible:Yes RoHS Compliant: Yes
Single P-Channel 150 V 240 mOhm 33 nC HEXFET® Power Mosfet - SOIC-8
-150V Single P-Channel HEXFET Power MOSFET in a SO-8 package, SO8, RoHSInfineon SCT
Benefits: RoHS Compliant; Low RDS(on); Industry-leading quality; Dynamic dv/dt Rating; Fast Switching; Fully Avalanche Rated; 175C Operating Temperature; P-Channel MOSFET
MOSFET; Transistor Type:MOSFET; Transistor Polarity:P Channel; Drain Source Voltage, Vds:-150V; Continuous Drain Current, Id:-2.2A; On Resistance, Rds(on):240mohm; Rds(on) Test Voltage, Vgs:-10V; Leaded Process Compatible:Yes RoHS Compliant: Yes
The three parts on the right have similar specifications to IRF6216TRPBF.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminationECCN CodeResistanceTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Number of ElementsNumber of ChannelsPower Dissipation-MaxElement ConfigurationOperating ModePower DissipationTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Threshold VoltageGate to Source Voltage (Vgs)Drain to Source Breakdown VoltageDual Supply VoltageRecovery TimeMax Junction Temperature (Tj)Nominal VgsHeightLengthWidthREACH SVHCRadiation HardeningRoHS StatusLead FreeSurface MountTerminal FinishAdditional FeatureSubcategoryJESD-30 CodeQualification StatusConfigurationCase ConnectionDrain to Source Voltage (Vdss)Drain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinAvalanche Energy Rating (Eas)Supplier Device PackageInput CapacitanceRds On MaxView Compare
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IRF6216TRPBF14 WeeksTinSurface MountSurface Mount8-SOIC (0.154, 3.90mm Width)8SILICON-55°C~150°C TJTape & Reel (TR)HEXFET®2005e3Not For New Designs1 (Unlimited)8SMD/SMTEAR99240mOhmMOSFET (Metal Oxide)DUALGULL WING26030112.5W TaSingleENHANCEMENT MODE2.5W18 nsP-ChannelSWITCHING240m Ω @ 1.3A, 10V5V @ 250μA1280pF @ 25V2.2A Ta49nC @ 10V15ns10V±20V26 ns33 ns-2.2A-5V20V-150V150V120 ns150°C5 V1.75mm4.9784mm3.9878mmNo SVHCNoROHS3 CompliantLead Free------------------
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---Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB-SILICON-55°C~175°C TJTape & Reel (TR)HEXFET®1998e3Obsolete1 (Unlimited)2-EAR99-MOSFET (Metal Oxide)SINGLEGULL WING260301-3.8W Ta 110W Tc-ENHANCEMENT MODE--P-ChannelSWITCHING290m Ω @ 6.6A, 10V4V @ 250μA860pF @ 25V13A Tc66nC @ 10V-10V±20V---------------Non-RoHS Compliant-YESMatte Tin (Sn) - with Nickel (Ni) barrierAVALANCHE RATED, HIGH RELIABILITYOther TransistorsR-PSSO-G2Not QualifiedSINGLE WITH BUILT-IN DIODEDRAIN150V13A0.29Ohm44A150V310 mJ---
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--Through HoleThrough HoleTO-262-3 Long Leads, I2Pak, TO-262AA3--55°C~150°C TJTube-2016-Obsolete1 (Unlimited)----MOSFET (Metal Oxide)------3.1W Ta 130W Tc----N-Channel-180mOhm @ 11A, 10V4V @ 250μA1300pF @ 25V18A Tc70nC @ 10V-10V±20V--18A------------Non-RoHS Compliant---------200V-----I2PAK1.3nF180 mΩ
-
--Surface MountSurface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB---55°C~150°C TJTape & Reel (TR)-2016-Obsolete1 (Unlimited)----MOSFET (Metal Oxide)------3.1W Ta 74W Tc----N-Channel-450mOhm @ 5.1A, 10V4V @ 250μA770pF @ 25V8.1A Tc41nC @ 10V-10V±20V--8.1A------------Non-RoHS Compliant---------250V-----D2PAK770pF450 mΩ
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