Fairchild/ON Semiconductor FDV302P
- Part Number:
- FDV302P
- Manufacturer:
- Fairchild/ON Semiconductor
- Ventron No:
- 2848361-FDV302P
- Description:
- MOSFET P-CH 25V 120MA SOT-23
- Datasheet:
- FDV302P
Fairchild/ON Semiconductor FDV302P technical specifications, attributes, parameters and parts with similar specifications to Fairchild/ON Semiconductor FDV302P.
- Lifecycle StatusACTIVE (Last Updated: 16 hours ago)
- Factory Lead Time10 Weeks
- Contact PlatingTin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CaseTO-236-3, SC-59, SOT-23-3
- Number of Pins3
- Weight30mg
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~150°C TJ
- PackagingTape & Reel (TR)
- Published1997
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations3
- ECCN CodeEAR99
- Resistance13Ohm
- Additional FeatureLOGIC LEVEL COMPATIBLE
- SubcategoryOther Transistors
- Voltage - Rated DC-25V
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionDUAL
- Terminal FormGULL WING
- Current Rating-120mA
- Number of Elements1
- Number of Channels1
- Power Dissipation-Max350mW Ta
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation350mW
- Turn On Delay Time5 ns
- FET TypeP-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs10 Ω @ 200mA, 4.5V
- Vgs(th) (Max) @ Id1.5V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds11pF @ 10V
- Current - Continuous Drain (Id) @ 25°C120mA Ta
- Gate Charge (Qg) (Max) @ Vgs0.31nC @ 4.5V
- Rise Time8ns
- Drain to Source Voltage (Vdss)25V
- Drive Voltage (Max Rds On,Min Rds On)2.7V 4.5V
- Vgs (Max)±8V
- Fall Time (Typ)8 ns
- Turn-Off Delay Time9 ns
- Continuous Drain Current (ID)120mA
- Threshold Voltage-1V
- Gate to Source Voltage (Vgs)-8V
- Drain to Source Breakdown Voltage-25V
- Dual Supply Voltage-25V
- Max Junction Temperature (Tj)150°C
- Nominal Vgs-1 V
- Height1.11mm
- Length2.92mm
- Width1.3mm
- REACH SVHCNo SVHC
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
FDV302P Description
Our exclusive high cell density DMOS technology is used to make the FDV302P transistor. This extremely dense technique is specifically designed to reduce on-state resistance. This device was created specifically to replace digital transistors in low-voltage applications. This single P-channel FET can replace numerous digital transistors with various bias resistors, such as the DTCx and DCDx series, because bias resistors are not required.
FDV302P Features
Gate drive needs are very minimal, allowing direct operation in 3V circuits. VGS(th) < 1.5V.
For ESD toughness, use a Gate-Source Zener.
Human Body Model >6kV
SOT-23 surface mount package is a compact industry standard.
One DMOS FET can replace multiple PNP digital transistors (DTCx and DCDx).
FDV302P Applications
FDV302P is intended for general use and can be used in a variety of situations.
Our exclusive high cell density DMOS technology is used to make the FDV302P transistor. This extremely dense technique is specifically designed to reduce on-state resistance. This device was created specifically to replace digital transistors in low-voltage applications. This single P-channel FET can replace numerous digital transistors with various bias resistors, such as the DTCx and DCDx series, because bias resistors are not required.
FDV302P Features
Gate drive needs are very minimal, allowing direct operation in 3V circuits. VGS(th) < 1.5V.
For ESD toughness, use a Gate-Source Zener.
Human Body Model >6kV
SOT-23 surface mount package is a compact industry standard.
One DMOS FET can replace multiple PNP digital transistors (DTCx and DCDx).
FDV302P Applications
FDV302P is intended for general use and can be used in a variety of situations.
FDV302P More Descriptions
Transistor MOSFET P-Channel 25V 125mA 350mW Surface Mount SOT-23
MOSFET Operating temperature: -55... 150 °C Housing type: SOT-23 Polarity: P Variants: Enhancement mode Power dissipation: 350 mW
This P-Channel logic level enhancement mode field effect transistor is produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. This device has been designed especially for low voltage applications as a replacement for digital transistors. Since bias resistors are not required, this one P-channel FET can replace several digital transistors with different bias resistors such as the DTCx and DCDx series.
MOSFET, P, -25V, 0.12A, DIGITAL, SOT-23; Transistor Polarity: P Channel; Continuous Drain Current Id: -120mA; Drain Source Voltage Vds: -25V; On Resistance Rds(on): 7.9ohm; Rds(on) Test Voltage Vgs: -4.5V; Threshold Voltage Vgs: -1V; Power Dissipation Pd: 350mW; Transistor Case Style: SOT-23; No. of Pins: 3Pins; Operating Temperature Max: 150°C; Product Range: -; Automotive Qualification Standard: -; MSL: MSL 1 - Unlimited; SVHC: No SVHC (27-Jun-2018); Current Temperature: 25°C; ESD HBM: 6kV; External Depth: 2.5mm; External Length / Height: 1.12mm; External Width: 3.05mm; Full Power Rating Temperature: 25°C; No. of Transistors: 1; Operating Temperature Min: -55°C; Operating Temperature Range: -55°C to 150°C; Pulse Current Idm: 500mA; SMD Marking: 302P; Tape Width: 8mm; Voltage Vds Typ: -25V; Voltage Vgs Max: -1V; Voltage Vgs Rds on Measurement: -4.5V; Voltage Vgs th Max: -1.5V
MOSFET Operating temperature: -55... 150 °C Housing type: SOT-23 Polarity: P Variants: Enhancement mode Power dissipation: 350 mW
This P-Channel logic level enhancement mode field effect transistor is produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. This device has been designed especially for low voltage applications as a replacement for digital transistors. Since bias resistors are not required, this one P-channel FET can replace several digital transistors with different bias resistors such as the DTCx and DCDx series.
MOSFET, P, -25V, 0.12A, DIGITAL, SOT-23; Transistor Polarity: P Channel; Continuous Drain Current Id: -120mA; Drain Source Voltage Vds: -25V; On Resistance Rds(on): 7.9ohm; Rds(on) Test Voltage Vgs: -4.5V; Threshold Voltage Vgs: -1V; Power Dissipation Pd: 350mW; Transistor Case Style: SOT-23; No. of Pins: 3Pins; Operating Temperature Max: 150°C; Product Range: -; Automotive Qualification Standard: -; MSL: MSL 1 - Unlimited; SVHC: No SVHC (27-Jun-2018); Current Temperature: 25°C; ESD HBM: 6kV; External Depth: 2.5mm; External Length / Height: 1.12mm; External Width: 3.05mm; Full Power Rating Temperature: 25°C; No. of Transistors: 1; Operating Temperature Min: -55°C; Operating Temperature Range: -55°C to 150°C; Pulse Current Idm: 500mA; SMD Marking: 302P; Tape Width: 8mm; Voltage Vds Typ: -25V; Voltage Vgs Max: -1V; Voltage Vgs Rds on Measurement: -4.5V; Voltage Vgs th Max: -1.5V
The three parts on the right have similar specifications to FDV302P.
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ImagePart NumberManufacturerLifecycle StatusFactory Lead TimeContact PlatingMountMounting TypePackage / CaseNumber of PinsWeightTransistor Element MaterialOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeResistanceAdditional FeatureSubcategoryVoltage - Rated DCTechnologyTerminal PositionTerminal FormCurrent RatingNumber of ElementsNumber of ChannelsPower Dissipation-MaxElement ConfigurationOperating ModePower DissipationTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Threshold VoltageGate to Source Voltage (Vgs)Drain to Source Breakdown VoltageDual Supply VoltageMax Junction Temperature (Tj)Nominal VgsHeightLengthWidthREACH SVHCRadiation HardeningRoHS StatusLead FreeVgs(th) (Max) @ Id:Technology:Supplier Device Package:Series:Rds On (Max) @ Id, Vgs:Power Dissipation (Max):Packaging:Package / Case:Operating Temperature:Mounting Type:Input Capacitance (Ciss) (Max) @ Vds:Gate Charge (Qg) (Max) @ Vgs:FET Type:FET Feature:Drain to Source Voltage (Vdss):Current - Continuous Drain (Id) @ 25°C:Continuous Drain Current (Id) @ 25°CView Compare
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FDV302PACTIVE (Last Updated: 16 hours ago)10 WeeksTinSurface MountSurface MountTO-236-3, SC-59, SOT-23-3330mgSILICON-55°C~150°C TJTape & Reel (TR)1997e3yesActive1 (Unlimited)3EAR9913OhmLOGIC LEVEL COMPATIBLEOther Transistors-25VMOSFET (Metal Oxide)DUALGULL WING-120mA11350mW TaSingleENHANCEMENT MODE350mW5 nsP-ChannelSWITCHING10 Ω @ 200mA, 4.5V1.5V @ 250μA11pF @ 10V120mA Ta0.31nC @ 4.5V8ns25V2.7V 4.5V±8V8 ns9 ns120mA-1V-8V-25V-25V150°C-1 V1.11mm2.92mm1.3mmNo SVHCNoROHS3 CompliantLead Free------------------
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-----SOT23-3----Tape & Reel (TR)-----------------------------------------------RoHS Compliant------------------
-
------------------------------------------------------------1.5V @ 250µAMOSFET (Metal Oxide)SOT-23-10 Ohm @ 200mA, 4.5V350mW (Ta)Cut Tape (CT)TO-236-3, SC-59, SOT-23-3-55°C ~ 150°C (TJ)Surface Mount11pF @ 10V0.31nC @ 4.5VP-Channel-25V120mA (Ta)-
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-----SOT-23----Tape & Reel (TR)----------------------N Channel-80mΩ @ 2A,4.5V1.3V @ 250uA----20V----------------RoHS Compliant-----------------2A
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