Microsemi Corporation A2F500M3G-1FGG256

Name: A2F500M3G-1FGG256
Brand: Microsemi Corporation
SKU: 3162380-A2F500M3G-1FGG256
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F500M3G-1FGG256

Manufacturer:: Microsemi Corporation

Ventron No:: 3162380-A2F500M3G-1FGG256

Description:: IC FPGA 512K FLASH 256FBGA

ECAD Model:

Datasheet:: A2F500M3G-1FGG256

Specifications

Microsemi Corporation A2F500M3G-1FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1FGG256.

Mount
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Supplier Device Package
256-FPBGA (17x17)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
100MHz
Base Part Number
A2F500M3G
Operating Supply Voltage
1.5V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Memory Size
13.5kB
Operating Supply Current
16.5mA
Number of I/O
MCU - 25, FPGA - 66
Speed
100MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate
400 kbps
Architecture
MCU, FPGA
Number of Logic Elements/Cells
5500
Core Architecture
ARM
Number of Gates
500000
Max Frequency
120MHz
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size
512KB
Radiation Hardening
No
RoHS Status
RoHS Compliant
Lead Free
Lead Free

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The A2F500M3G is an active part with a package of 256-LBGA, making it a highly versatile and reliable option for various applications. With a minimum operating temperature of 0°C, it can withstand extreme environments while maintaining its functionality. Its frequency of 100MHz allows for efficient and fast processing, while its operating supply voltage of 1.5V ensures low power consumption. This powerful device also offers a memory size of 13.5kB, providing ample storage for data and programs. Its connectivity options, including EBI/EMI, Ethernet, I2C, SPI, and UART/USART, allow for seamless integration into different systems. With a data rate of 400 kbps and 5500 logic elements/cells, the A2F500M3G is a reliable and high-performing choice for any project.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-1FGG256 System On Chip (SoC) applications.

Embedded systems
Sports
Industrial robot
Functional safety for critical applications in the automotive
Deep learning hardware
Transmitters
ARM
Self-aware system-on-chip (SoC)
Industrial sectors
Wireless networking

A2F500M3G-1FGG256 More Descriptions

FPGA SmartFusion Family 500K Gates 6000 Cells 350MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
IC SOC CORTEX-M3 100MHZ 256FBGA
French Electronic Distributor since 1988

Product Comparison

The three parts on the right have similar specifications to A2F500M3G-1FGG256.

Image

Part Number

Manufacturer

Mount

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Data Rate

Architecture

Number of Logic Elements/Cells

Core Architecture

Number of Gates

Max Frequency

Primary Attributes

Flash Size

Radiation Hardening

RoHS Status

Lead Free

Factory Lead Time

Published

JESD-609 Code

Number of Terminations

Terminal Finish

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Number of Outputs

Qualification Status

Power Supplies

Programmable Logic Type

Height Seated (Max)

Length

Width

Speed Grade

Number of Registers

Number of Logic Blocks (LABs)

View Compare
A2F500M3G-1FGG256

Microsemi Corporation

Surface Mount

256-LBGA

256

256-FPBGA (17x17)

0°C~85°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

100MHz

A2F500M3G

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

13.5kB

16.5mA

MCU - 25, FPGA - 66

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

400 kbps

MCU, FPGA

5500

ARM

500000

120MHz

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

No

RoHS Compliant

Lead Free

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F500M3G-1FGG484I

Microsemi Corporation

Surface Mount

484-BGA

484

-

-40°C~100°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

-

-

100MHz

A2F500M3G

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

13.5kB

16.5mA

MCU - 41, FPGA - 128

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

400 kbps

MCU, FPGA

5500

ARM

500000

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

-

RoHS Compliant

-

12 Weeks

2015

e1

484

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

250

1.5V

1mm

30

128

Not Qualified

1.51.82.53.3V

FIELD PROGRAMMABLE GATE ARRAY

2.44mm

23mm

23mm

-

-

-

A2F500M3G-1FGG256 vs A2F500M3G-1FGG484I
A2F500M3G-1FGG484

Microsemi Corporation

Surface Mount

484-BGA

484

484-FPBGA (23x23)

0°C~85°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

100MHz

A2F500M3G

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

13.5kB

16.5mA

MCU - 41, FPGA - 128

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

400 kbps

MCU, FPGA

5500

ARM

500000

120MHz

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

No

RoHS Compliant

-

12 Weeks

2011

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1

11520

-

A2F500M3G-1FGG256 vs A2F500M3G-1FGG484
A2F500M3G-FG484

Microsemi Corporation

-

484-BGA

484

484-FPBGA (23x23)

0°C~85°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

80MHz

A2F500M3G

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

-

2mA

MCU - 41, FPGA - 128

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

500000

100MHz

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

-

Non-RoHS Compliant

Lead Free

16 Weeks

2015

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

24

A2F500M3G-1FGG256 vs A2F500M3G-FG484