TH58NVG3S0HBAI6

Toshiba Semiconductor and Storage TH58NVG3S0HBAI6

Part Number:
TH58NVG3S0HBAI6
Manufacturer:
Toshiba Semiconductor and Storage
Ventron No:
7013686-TH58NVG3S0HBAI6
Description:
Memory IC 8mm mm
ECAD Model:
Datasheet:
TH58NVG3S0HBAI6

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Specifications
Toshiba Semiconductor and Storage TH58NVG3S0HBAI6 technical specifications, attributes, parameters and parts with similar specifications to Toshiba Semiconductor and Storage TH58NVG3S0HBAI6.
  • Mounting Type
    Surface Mount
  • Package / Case
    67-VFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    67
  • Technology
    FLASH - NAND (SLC)
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.8mm
  • JESD-30 Code
    R-PBGA-B67
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    8Gb 1G x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    1GX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    25ns
  • Memory Density
    8589934592 bit
  • Programming Voltage
    3V
  • Height Seated (Max)
    1mm
  • Length
    8mm
  • Width
    6.5mm
  • RoHS Status
    RoHS Compliant
Description
TH58NVG3S0HBAI6 Overview
This product was manufactured by Toshiba Semiconductor and Storage, is an advanced Memory electronic component belonging to the Memory category. It comes in a compact 67-VFBGA package/case with a single function. The terminal pitch stands at 0.8mm, ensuring optimal connectivity. The JESD-30 Code for this part is R-PBGA-B67, signifying its high quality and reliability. The minimum supply voltage stands at 2.7V, providing sufficient power for efficient operation. This device operates in asynchronous mode and features a parallel memory interface, making it suitable for various applications. The organization type is 1GX8, offering enhanced performance and efficiency. The write cycle time for word and page operations is 25ns, guaranteeing quick response times. Lastly, the length of the memory module is 8mm, providing ample space for other components.

TH58NVG3S0HBAI6 Features
Package / Case: 67-VFBGA


TH58NVG3S0HBAI6 Applications
There are a lot of Kioxia America, Inc.
TH58NVG3S0HBAI6 Memory applications.


personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
TH58NVG3S0HBAI6 More Descriptions
8GB SLC NAND 24NM BGA 6.5X8 3.3V (EEPROM) 4K PAGE
IC FLASH 8GBIT PARALLEL 67VFBGA
Product Comparison
The three parts on the right have similar specifications to TH58NVG3S0HBAI6.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Memory Density
    Programming Voltage
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Series
    Terminal Form
    Parallel/Serial
    View Compare
  • TH58NVG3S0HBAI6
    TH58NVG3S0HBAI6
    Surface Mount
    67-VFBGA
    YES
    -40°C~85°C TA
    Tray
    Active
    3 (168 Hours)
    67
    FLASH - NAND (SLC)
    2.7V~3.6V
    BOTTOM
    1
    3.3V
    0.8mm
    R-PBGA-B67
    3.6V
    2.7V
    8Gb 1G x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    1GX8
    8
    25ns
    8589934592 bit
    3V
    1mm
    8mm
    6.5mm
    RoHS Compliant
    -
    -
    -
    -
  • TH58NVG3S0HBAI4
    Surface Mount
    63-VFBGA
    YES
    -40°C~85°C TA
    Tray
    Active
    3 (168 Hours)
    63
    FLASH - NAND (SLC)
    2.7V~3.6V
    BOTTOM
    1
    3.3V
    0.8mm
    R-PBGA-B63
    3.6V
    2.7V
    8Gb 1G x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    1GX8
    8
    25ns
    8589934592 bit
    3.3V
    1mm
    11mm
    9mm
    RoHS Compliant
    -
    -
    -
  • TH58BYG3S0HBAI6
    Surface Mount
    67-VFBGA
    YES
    -40°C~85°C TA
    Tray
    Active
    3 (168 Hours)
    67
    FLASH - NAND (SLC)
    1.7V~1.95V
    BOTTOM
    1
    1.8V
    0.8mm
    R-PBGA-B67
    1.95V
    1.7V
    8Gb 1G x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    -
    1GX8
    8
    25ns
    8589934592 bit
    1.8V
    1mm
    8mm
    6.5mm
    RoHS Compliant
    Benand™
    BALL
    PARALLEL
  • TH58NVG2S3HBAI6
    Surface Mount
    63-BGA
    -
    -40°C~85°C TA
    Tray
    Active
    3 (168 Hours)
    -
    FLASH - NAND (SLC)
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    4Gb 512M x 8
    Non-Volatile
    -
    FLASH
    Parallel
    -
    -
    25ns
    -
    -
    -
    -
    -
    RoHS Compliant
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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