XCZU5CG-2FBVB900I

Xilinx Inc. XCZU5CG-2FBVB900I

Part Number:
XCZU5CG-2FBVB900I
Manufacturer:
Xilinx Inc.
Ventron No:
3828040-XCZU5CG-2FBVB900I
Description:
IC FPGA 204 I/O 900FCBGA
ECAD Model:
Datasheet:
XCZU5CG-2FBVB900I

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Specifications
Xilinx Inc. XCZU5CG-2FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5CG-2FBVB900I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.85V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B900
  • Supply Voltage-Max (Vsup)
    0.876V
  • Supply Voltage-Min (Vsup)
    0.825V
  • Number of I/O
    204
  • Speed
    533MHz, 1.3GHz
  • RAM Size
    256KB
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - System On Chip (SoC) chips. These chips are highly sought after for their advanced capabilities and performance in various electronic devices. As an Active part, this Xilinx Inc. chip is readily available for use in various applications. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand up to 72 hours of exposure to moisture without any adverse effects. This makes it a reliable and durable choice for electronic devices that may be exposed to varying environmental conditions. With a Supply Voltage of 0.85V and a JESD-30 Code of R-PBGA-B900, this chip is designed to operate efficiently and effectively in a range of devices. Its Supply Voltage-Min (Vsup) of 0.825V ensures that it can function reliably even at lower voltage levels. With 204 I/Os, this chip offers a high level of connectivity, making it suitable for a wide range of applications. It falls under the category of uPs/uCs/Peripheral ICs Type, specifically MICROPROCESSOR CIRCUIT, making it a versatile and adaptable choice for various devices. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, providing flexibility for designers and engineers. The primary attribute of this chip is its Zynq®UltraScale ™ FPGA, which offers 256K Logic Cells. This allows for high-speed processing and advanced functionality in electronic devices. Additionally, this chip is also ROHS3 Compliant, meaning it adheres to strict environmental standards, making it a sustainable and environmentally-friendly choice. In conclusion, the Xilinx Inc. chip is a top-of-the-line Embedded - System On Chip (SoC) that offers advanced capabilities, reliability, and sustainability, making it a preferred choice for various electronic devices.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.
XCZU5CG-2FBVB900I System On Chip (SoC) applications.

Mobile market
CNC control
Temperature
Automated sorting equipment
Special Issue Editors
Sports
Digital Signal Processing
Industrial AC-DC
Digital Media
ARM processors
XCZU5CG-2FBVB900I More Descriptions
FPGA Zynq UltraScale Family 256200 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 256K, B900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU5CG-2FBVB900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Pbfree Code
    View Compare
  • XCZU5CG-2FBVB900I
    XCZU5CG-2FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    900
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.85V
    NOT SPECIFIED
    R-PBGA-B900
    0.876V
    0.825V
    204
    533MHz, 1.3GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    -
  • XCZU7CG-2FFVC1156E
    11 Weeks
    1156-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    360
    533MHz, 1.3GHz
    256KB
    -
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    yes
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    -
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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