Xilinx Inc. XCZU9EG-1FFVC900I
- Part Number:
- XCZU9EG-1FFVC900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 4544201-XCZU9EG-1FFVC900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU9EG-1FFVC900I
Xilinx Inc. XCZU9EG-1FFVC900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU9EG-1FFVC900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2013
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 599K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this product is 900-BBGA, FCBGA, which refers to the type of packaging used to enclose the components. It is designed to operate within a temperature range of -40°C to 100°C TJ, ensuring its functionality in various environments. The packaging method for this product is tray packaging, which involves placing the components in trays for transportation and storage. This particular product belongs to the Zynq® UltraScale ™ MPSoC EG series, indicating its high-performance capabilities. It is currently an active part in the market, meaning it is readily available for purchase. The HTS code assigned to this product is 8542.31.00.01, which is used for customs purposes. It has a total of 204 input/output connections, allowing for versatile connectivity options. The RAM size for this product is 256KB, providing sufficient memory for data storage and processing. In terms of peripherals, it includes DMA (Direct Memory Access) and WDT (Watchdog Timer) for enhanced functionality. The architecture of this product is a combination of MCU (Microcontroller Unit) and FPGA (Field-Programmable Gate Array), offering a flexible and powerful computing platform.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9EG-1FFVC900I System On Chip (SoC) applications.
Published Paper
Communication network-on-Chip (cNoC)
CNC control
Automotive
Special Issue Editors
Microcontroller
Mouse
Central alarm system
Smart appliances
Industrial
The package or case for this product is 900-BBGA, FCBGA, which refers to the type of packaging used to enclose the components. It is designed to operate within a temperature range of -40°C to 100°C TJ, ensuring its functionality in various environments. The packaging method for this product is tray packaging, which involves placing the components in trays for transportation and storage. This particular product belongs to the Zynq® UltraScale ™ MPSoC EG series, indicating its high-performance capabilities. It is currently an active part in the market, meaning it is readily available for purchase. The HTS code assigned to this product is 8542.31.00.01, which is used for customs purposes. It has a total of 204 input/output connections, allowing for versatile connectivity options. The RAM size for this product is 256KB, providing sufficient memory for data storage and processing. In terms of peripherals, it includes DMA (Direct Memory Access) and WDT (Watchdog Timer) for enhanced functionality. The architecture of this product is a combination of MCU (Microcontroller Unit) and FPGA (Field-Programmable Gate Array), offering a flexible and powerful computing platform.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9EG-1FFVC900I System On Chip (SoC) applications.
Published Paper
Communication network-on-Chip (cNoC)
CNC control
Automotive
Special Issue Editors
Microcontroller
Mouse
Central alarm system
Smart appliances
Industrial
XCZU9EG-1FFVC900I More Descriptions
FPGA Zynq UltraScale Family 599550 Cells 20nm 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 600K, C900, RoHSXilinx SCT
Phase Comparator 16-Pin SOIC Tube
IC FPGA SOC ZU EV Q100 784SBGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 600K, C900, RoHSXilinx SCT
Phase Comparator 16-Pin SOIC Tube
IC FPGA SOC ZU EV Q100 784SBGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU9EG-1FFVC900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU9EG-1FFVC900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant-------------
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11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes-----------
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-YES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant------------
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