Xilinx Inc. XCZU7EV-1FBVB900E

Name: XCZU7EV-1FBVB900E
Brand: Xilinx Inc.
SKU: 4544238-XCZU7EV-1FBVB900E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU7EV-1FBVB900E

Manufacturer:: Xilinx Inc.

Ventron No:: 4544238-XCZU7EV-1FBVB900E

Description:: IC FPGA 204 I/O 900FCBGA

ECAD Model:

Datasheet:: XCZU7EV-1FBVB900E

Specifications

Xilinx Inc. XCZU7EV-1FBVB900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU7EV-1FBVB900E.

Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EV
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
204
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 504K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this product is 900-BBGA or FCBGA. It was published in 2016 and belongs to the Zynq® UltraScale ™ MPSoC EV series. It has a Moisture Sensitivity Level (MSL) of 4, which means it can be exposed to ambient conditions for up to 72 hours without any negative effects. The peak reflow temperature is not specified, and neither is the maximum reflow temperature in seconds. It has a total of 204 I/Os and features a quad-core ARM® Cortex®-A53 MPCore™ processor with CoreSight™ technology, as well as dual ARM® Cortex™-R5 processors with CoreSight™ and an ARM Mali™-400 MP2 graphics processor. It also includes peripherals such as DMA and WDT, and has a combined architecture of both a microcontroller unit (MCU) and a field-programmable gate array (FPGA).

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU7EV-1FBVB900E System On Chip (SoC) applications.

Digital Media
String inverter
Self-aware system-on-chip (SoC)
Healthcare
Keyboard
POS Terminals
Wireless sensor networks
Apple smart watch
Industrial automation devices
Optical drive

XCZU7EV-1FBVB900E More Descriptions

FPGA Zynq UltraScale Family 504000 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
XILINX - XCZU7EV-1FBVB900E - MPSOC, ARM CORTEX-A53/R5, FCBGA-900
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 504K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-900; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU7EV-1FBVB900E

Product Comparison

The three parts on the right have similar specifications to XCZU7EV-1FBVB900E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

360

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

yes

-

-

-

-

-

-

-

-

-

-

-

XCZU7EV-1FBVB900E vs XCZU7CG-2FFVC1156E
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

180

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

-

YES

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU7EV-1FBVB900E vs XCZU2EG-L1SFVA625I
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

464

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

XCZU7EV-1FBVB900E vs XCZU7EV-2FFVF1517I