XCZU2EG-L1SFVA625I

Xilinx Inc. XCZU2EG-L1SFVA625I

Part Number:
XCZU2EG-L1SFVA625I
Manufacturer:
Xilinx Inc.
Ventron No:
4544245-XCZU2EG-L1SFVA625I
Description:
IC FPGA 180 I/O 625FCBGA
ECAD Model:
Datasheet:
XCZU2EG-L1SFVA625I

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Specifications
Xilinx Inc. XCZU2EG-L1SFVA625I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2EG-L1SFVA625I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    625-BFBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    625
  • Additional Feature
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.72V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B625
  • Supply Voltage-Max (Vsup)
    0.742V
  • Supply Voltage-Min (Vsup)
    0.698V
  • Number of I/O
    180
  • Speed
    500MHz, 600MHz, 1.2GHz
  • RAM Size
    256KB
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The packaging for the product is in a tray, and its part status is active, meaning it is currently available. The moisture sensitivity level (MSL) for the product is 4, which means it can withstand exposure to ambient air for up to 72 hours without suffering any damage. The terminal position for the product is at the bottom, and the terminal form is in the shape of a ball. The maximum supply voltage (Vsup) for the product is 0.742V. The core processor for the product is a quad ARM Cortex-A53 MPCore with CoreSight, along with dual ARM Cortex-R5 with CoreSight and ARM Mali-400 MP2. The product offers various connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The architecture of the product is a combination of MCU and FPGA. Lastly, the product is ROHS3 compliant, adhering to the Restriction of Hazardous Substances directive.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU2EG-L1SFVA625I System On Chip (SoC) applications.

Robotics
Industrial AC-DC
Cyberphysical system-on-chip
USB hard disk enclosure
AC-input BLDC motor drive
AC drive control module
Servo drive control module
Special Issue Information
Mobile computing
PC peripherals
XCZU2EG-L1SFVA625I More Descriptions
Zynq UltraScale RFSoC, Speed Grade-L1, Logic Cells 103K, A625, RoHSXilinx SCT
IC SOC CORTEX-A9 800MHZ 484FCBGA
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU2EG-L1SFVA625I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Published
    View Compare
  • XCZU2EG-L1SFVA625I
    XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B625
    0.742V
    0.698V
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    -
    -
  • XCZU5EV-L1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    900
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B900
    0.742V
    0.698V
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    2016
  • XCZU7EV-1FBVB900E
    11 Weeks
    900-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    2016
  • XCZU9EG-1FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    2013
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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