Xilinx Inc. XCZU3CG-2SFVC784I

Name: XCZU3CG-2SFVC784I
Brand: Xilinx Inc.
SKU: 3669288-XCZU3CG-2SFVC784I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU3CG-2SFVC784I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669288-XCZU3CG-2SFVC784I

Description:: XCZU3CG-2SFVC784I

ECAD Model:

Datasheet:: XCZU3CG-2SFVC784I

Specifications

Xilinx Inc. XCZU3CG-2SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3CG-2SFVC784I.

Factory Lead Time
11 Weeks
Package / Case
784-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Bulk
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
784
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B784
Number of I/O
252
Speed
533MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 154K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
This product is packaged in a 784-BFBGA or FCBGA case and has an operating temperature range of -40°C to 100°C. It is packaged in bulk and uses CMOS technology. The terminal form is BALL and the peak reflow temperature is not specified. The supply voltage is 0.85V and it has a RAM size of 256KB. It offers connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This product is designed with an architecture of both MCU and FPGA.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.
XCZU3CG-2SFVC784I System On Chip (SoC) applications.

Fitness
Central alarm system
Samsung galaxy gear
Healthcare
Cyber security for critical applications in the aerospace
Medical
Keywords
Robotics
Industrial automation devices
CNC control

XCZU3CG-2SFVC784I More Descriptions

FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 154K, C784, RoHSXilinx SCT
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU3CG-2SFVC784I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

View Compare
XCZU3CG-2SFVC784I

Xilinx Inc.

11 Weeks

784-BFBGA, FCBGA

YES

-40°C~100°C TJ

Bulk

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

784

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.85V

NOT SPECIFIED

S-PBGA-B784

252

533MHz, 1.3GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 154K Logic Cells

ROHS3 Compliant

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

360

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

yes

XCZU3CG-2SFVC784I vs XCZU7CG-2FFVC1156E
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

XCZU3CG-2SFVC784I vs XCZU7EV-1FBVB900E
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

XCZU3CG-2SFVC784I vs XCZU9EG-1FFVC900I