Xilinx Inc. XC7Z045-L2FBG676I

Name: XC7Z045-L2FBG676I
Brand: Xilinx Inc.
SKU: 3163402-XC7Z045-L2FBG676I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z045-L2FBG676I

Manufacturer:: Xilinx Inc.

Ventron No:: 3163402-XC7Z045-L2FBG676I

Description:: IC SOC CORTEX-A9 KINTEX7 676BGA

ECAD Model:

Datasheet:: XC7Z045-L2FBG676I

Specifications

Xilinx Inc. XC7Z045-L2FBG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-L2FBG676I.

Factory Lead Time
10 Weeks
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
800MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B676
Supply Voltage-Max (Vsup)
1.05V
Supply Voltage-Min (Vsup)
0.95V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
2.54mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Xilinx Inc. is the brand of this part, which falls under the Embedded - System On Chip (SoC) category. This particular chip, with a package/case of 676-BBGA or FCBGA, comes packaged in a tray. The terminal pitch is 1mm and it operates at a frequency of 800MHz. The reflow temperature-max (s) for this chip is not specified, while the minimum supply voltage (Vsup) is 0.95V. The core processor is a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ technology. It has a RAM size of 256000 words and a maximum seated height of 2.54mm. This chip is also compliant with ROHS3 standards.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z045-L2FBG676I System On Chip (SoC) applications.

Level
Self-aware system-on-chip (SoC)
Deep learning hardware
AC-input BLDC motor drive
Embedded systems
Central alarm system
Robotics
Mobile market
Remote control
Optical drive

XC7Z045-L2FBG676I More Descriptions

FPGA Zynq-7000 350000 Cells 28nm Technology 1V 676-Pin FCBGA
Processors - Application Specialized XC7Z045-L2FBG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
Automotive Connectors STD-POW-TIM KONTAKT
IC SOC CORTEX-A9 KINTEX7 676BGA

Product Comparison

The three parts on the right have similar specifications to XC7Z045-L2FBG676I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Interface

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Boundary Scan

RAM (words)

Primary Attributes

Bus Compatibility

Height Seated (Max)

Length

Width

RoHS Status

Contact Plating

Number of Pins

Base Part Number

Operating Supply Voltage

Memory Type

Data Bus Width

Speed Grade

Radiation Hardening

Mount

Max Supply Voltage

Min Supply Voltage

Propagation Delay

Number of Registers

Turn On Delay Time

View Compare
XC7Z045-L2FBG676I

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

3 (168 Hours)

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

800MHz

NOT SPECIFIED

S-PBGA-B676

1.05V

0.95V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 350K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

27mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC7Z045-2FBG676I

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2009

Zynq®-7000

e1

Active

3 (168 Hours)

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

-

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

-

1.05V

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 350K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

-

ROHS3 Compliant

Copper, Silver, Tin

676

XC7Z045

1V

ROMless

32b

-2

No

-

-

-

-

-

-

XC7Z045-L2FBG676I vs XC7Z045-2FBG676I
XC7Z035-3FBG676E

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

3 (168 Hours)

676

-

-

-

-

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

800MHz

NOT SPECIFIED

S-PBGA-B676

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 275K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

27mm

ROHS3 Compliant

Copper, Silver, Tin

-

-

-

-

-

3

-

Surface Mount

1.05V

950mV

110 ps

343800

-

XC7Z045-L2FBG676I vs XC7Z035-3FBG676E
XC7Z100-L2FFG900I

Xilinx Inc.

10 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

-

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 444K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

31mm

ROHS3 Compliant

Copper, Silver, Tin

900

-

-

-

-

-

-

Surface Mount

1.05V

950mV

120 ps

554800

120 ps

XC7Z045-L2FBG676I vs XC7Z100-L2FFG900I