Xilinx Inc. XC7Z045-3FFG676E
- Part Number:
- XC7Z045-3FFG676E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3668929-XC7Z045-3FFG676E
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z045-3FFG676E
Xilinx Inc. XC7Z045-3FFG676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-3FFG676E.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency1GHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- JESD-30 CodeS-PBGA-B676
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-3
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.37mm
- Length27mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series Zynq?-7000.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V rating is recommended.There is no safe voltage for the SoCs wireless above 1.05V.Having 676 terminations in total makes system on a chip possible.XC7Z045 will give you system on chips with similar specifications and purposes.At 1GHz, the wireless SoC works.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-3FFG676E System On Chip (SoC) applications.
External USB hard disk/SSD
Functional safety for critical applications in the industrial sectors
Test and Measurement
Multiprocessor system-on-chips (MPSoCs)
Flow Sensors
RISC-V
Microcontroller
Measurement tools
PC peripherals
Personal Computers
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series Zynq?-7000.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V rating is recommended.There is no safe voltage for the SoCs wireless above 1.05V.Having 676 terminations in total makes system on a chip possible.XC7Z045 will give you system on chips with similar specifications and purposes.At 1GHz, the wireless SoC works.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-3FFG676E System On Chip (SoC) applications.
External USB hard disk/SSD
Functional safety for critical applications in the industrial sectors
Test and Measurement
Multiprocessor system-on-chips (MPSoCs)
Flow Sensors
RISC-V
Microcontroller
Measurement tools
PC peripherals
Personal Computers
XC7Z045-3FFG676E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-676
Processors - Application Specialized XC7Z045-3FFG676E
Diode Schottky 10V 3A Automotive 2-Pin SOD-323 T/R
IC SOC CORTEX-A9 1GHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z045-3FFG676E
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-676
Processors - Application Specialized XC7Z045-3FFG676E
Diode Schottky 10V 3A Automotive 2-Pin SOD-323 T/R
IC SOC CORTEX-A9 1GHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z045-3FFG676E
The three parts on the right have similar specifications to XC7Z045-3FFG676E.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusPbfree CodeSupply Voltage-Min (Vsup)SpeedClock FrequencyWidthMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersNumber of PinsAdditional FeatureTurn On Delay TimeView Compare
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XC7Z045-3FFG676E10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm1GHz30XC7Z045S-PBGA-B6761V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-3256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mmNoROHS3 Compliant--------------
-
10 Weeks-484-LFBGA, CSPBGAYES-40°C~100°C TJTray2016Zynq®-7000e3Active3 (168 Hours)485-Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mm-NOT SPECIFIED-S-PBGA-B485-1.05V-150256KB-Single ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--YES-256000Artix™-7 FPGA, 55K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm-ROHS3 Compliantyes0.95V766MHz800MHz19mm--------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA-0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676---CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES3256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant----27mmSurface Mount1.05V950mV110 ps343800---
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10 WeeksCopper, Silver, Tin900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30----CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES-256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm-ROHS3 Compliant----31mmSurface Mount1.05V950mV120 ps554800900PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY120 ps
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