Xilinx Inc. XC7Z045-2FFG900E
- Part Number:
- XC7Z045-2FFG900E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162930-XC7Z045-2FFG900E
- Description:
- IC SOC CORTEX-A9 KINTEX7 900FBGA
- Datasheet:
- XC7Z045-2FFG900E
Xilinx Inc. XC7Z045-2FFG900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FFG900E.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- JESD-30 CodeS-PBGA-B900
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-2
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.35mm
- Length31mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.130 I/Os are included in this SoC part.Use a power supply with a voltage of 1V if possible.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.system on a chip benefits from 900 terminations.Searching XC7Z045 will yield system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900E System On Chip (SoC) applications.
Smart appliances
Fitness
Smartphone accessories
Robotics
AC drive control module
AC-input BLDC motor drive
Measurement testers
Temperature
Apple smart watch
Cyber security for critical applications in the aerospace
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.130 I/Os are included in this SoC part.Use a power supply with a voltage of 1V if possible.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.system on a chip benefits from 900 terminations.Searching XC7Z045 will yield system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900E System On Chip (SoC) applications.
Smart appliances
Fitness
Smartphone accessories
Robotics
AC drive control module
AC-input BLDC motor drive
Measurement testers
Temperature
Apple smart watch
Cyber security for critical applications in the aerospace
XC7Z045-2FFG900E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 900-Pin FC-BGA
BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC 0C~100C TJ 256KB 800MHz 1V
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
Processors - Application Specialized XC7Z045-2FFG900E
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-2FFG900E
BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC 0C~100C TJ 256KB 800MHz 1V
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
Processors - Application Specialized XC7Z045-2FFG900E
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-2FFG900E
The three parts on the right have similar specifications to XC7Z045-2FFG900E.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusSpeedMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthNumber of PinsView Compare
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XC7Z045-2FFG900E10 WeeksCopper, Silver, Tin900-BBGA, FCBGAYES0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045S-PBGA-B9001V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mmNoROHS3 Compliant---------
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10 Weeks-676-BBGA, FCBGA-0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)-----------------130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-----Kintex™-7 FPGA, 350K Logic Cells----ROHS3 Compliant1GHz-------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIED-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant-Surface Mount1.05V950mV120 ps34380027mm-
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10 Weeks-900-BBGA, FCBGAYES-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)-CMOSBOTTOMBALL2451V-667MHz30--1V-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant----130 ps343800-900
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