XC7Z045-2FF900I

Xilinx Inc. XC7Z045-2FF900I

Part Number:
XC7Z045-2FF900I
Manufacturer:
Xilinx Inc.
Ventron No:
3162954-XC7Z045-2FF900I
Description:
XC7Z045-2FF900I
ECAD Model:
Datasheet:
XC7Z045-2FF900I

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Specifications
Xilinx Inc. XC7Z045-2FF900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FF900I.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq®-7000
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • Additional Feature
    GPIO WITH FOUR 32-BIT BANKS
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    S-PBGA-B900
  • Number of I/O
    130
  • Speed
    800MHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Clock Frequency
    800MHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • Bus Compatibility
    CAN, ETHERNET, I2C, PCI, SPI, UART, USB
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Xilinx Inc. is the brand of this particular part, which falls under the Embedded - System On Chip (SoC) category. The package or case for this chip is 900-BBGA or FCBGA, and it is packaged in a tray. The technology used for this chip is CMOS, and the terminal position is at the bottom with a ball-shaped terminal form. It is compliant with Reach Compliance Code and has a total of 130 I/Os. This chip features a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ as its core processor and is designed with both MCU and FPGA architecture. Additionally, it has a RAM capacity of 256000 words.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
GPIO WITH FOUR 32-BIT BANKS
Clock Frequency: 800MHz

There are a lot of Xilinx Inc.
XC7Z045-2FF900I System On Chip (SoC) applications.

Communication network-on-Chip (cNoC)
Samsung galaxy gear
AC-input BLDC motor drive
Communication interfaces ( I2C, SPI )
Fitness
Optical drive
Body control module
DC-input BLDC motor drive
Remote control
Automated sorting equipment
XC7Z045-2FF900I More Descriptions
FPGA Zynq-7000 Family 350000 Cells 766MHz 28nm 1V 900-Pin FCBGA Tray
IC SOC CORTEX-A9 800MHZ 900FCBGA
Processors - Application Specialized
Product Comparison
The three parts on the right have similar specifications to XC7Z045-2FF900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Reach Compliance Code
    JESD-30 Code
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Clock Frequency
    Connectivity
    Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Bus Compatibility
    RoHS Status
    Contact Plating
    JESD-609 Code
    ECCN Code
    Terminal Finish
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Interface
    Memory Type
    Data Bus Width
    Core Architecture
    Speed Grade
    Height Seated (Max)
    Length
    Radiation Hardening
    Mount
    Number of Pins
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Turn On Delay Time
    Number of Registers
    Width
    View Compare
  • XC7Z045-2FF900I
    XC7Z045-2FF900I
    10 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    Active
    4 (72 Hours)
    900
    GPIO WITH FOUR 32-BIT BANKS
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    compliant
    S-PBGA-B900
    130
    800MHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    800MHz
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN, ETHERNET, I2C, PCI, SPI, UART, USB
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FFG676E
    10 Weeks
    676-BBGA, FCBGA
    YES
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    Active
    4 (72 Hours)
    676
    -
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    -
    S-PBGA-B676
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    ROHS3 Compliant
    Copper, Silver, Tin
    e1
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    245
    1V
    1mm
    800MHz
    30
    XC7Z045
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    ROMless
    32b
    ARM
    -2
    3.37mm
    27mm
    No
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-3FFV676E
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    130
    1GHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z100-L2FFG900I
    10 Weeks
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    Active
    4 (72 Hours)
    900
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    -
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    ROHS3 Compliant
    Copper, Silver, Tin
    e1
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    245
    1V
    1mm
    800MHz
    30
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    ARM
    -
    3.35mm
    31mm
    -
    Surface Mount
    900
    1.05V
    950mV
    120 ps
    120 ps
    554800
    31mm
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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