Xilinx Inc. XC7Z045-2FF900I
- Part Number:
- XC7Z045-2FF900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162954-XC7Z045-2FF900I
- Description:
- XC7Z045-2FF900I
- Datasheet:
- XC7Z045-2FF900I
Xilinx Inc. XC7Z045-2FF900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FF900I.
- Factory Lead Time10 Weeks
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq®-7000
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- Additional FeatureGPIO WITH FOUR 32-BIT BANKS
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Reach Compliance Codecompliant
- JESD-30 CodeS-PBGA-B900
- Number of I/O130
- Speed800MHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- Clock Frequency800MHz
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN, ETHERNET, I2C, PCI, SPI, UART, USB
- RoHS StatusNon-RoHS Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Xilinx Inc. is the brand of this particular part, which falls under the Embedded - System On Chip (SoC) category. The package or case for this chip is 900-BBGA or FCBGA, and it is packaged in a tray. The technology used for this chip is CMOS, and the terminal position is at the bottom with a ball-shaped terminal form. It is compliant with Reach Compliance Code and has a total of 130 I/Os. This chip features a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ as its core processor and is designed with both MCU and FPGA architecture. Additionally, it has a RAM capacity of 256000 words.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
GPIO WITH FOUR 32-BIT BANKS
Clock Frequency: 800MHz
There are a lot of Xilinx Inc.
XC7Z045-2FF900I System On Chip (SoC) applications.
Communication network-on-Chip (cNoC)
Samsung galaxy gear
AC-input BLDC motor drive
Communication interfaces ( I2C, SPI )
Fitness
Optical drive
Body control module
DC-input BLDC motor drive
Remote control
Automated sorting equipment
Xilinx Inc. is the brand of this particular part, which falls under the Embedded - System On Chip (SoC) category. The package or case for this chip is 900-BBGA or FCBGA, and it is packaged in a tray. The technology used for this chip is CMOS, and the terminal position is at the bottom with a ball-shaped terminal form. It is compliant with Reach Compliance Code and has a total of 130 I/Os. This chip features a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ as its core processor and is designed with both MCU and FPGA architecture. Additionally, it has a RAM capacity of 256000 words.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
GPIO WITH FOUR 32-BIT BANKS
Clock Frequency: 800MHz
There are a lot of Xilinx Inc.
XC7Z045-2FF900I System On Chip (SoC) applications.
Communication network-on-Chip (cNoC)
Samsung galaxy gear
AC-input BLDC motor drive
Communication interfaces ( I2C, SPI )
Fitness
Optical drive
Body control module
DC-input BLDC motor drive
Remote control
Automated sorting equipment
XC7Z045-2FF900I More Descriptions
FPGA Zynq-7000 Family 350000 Cells 766MHz 28nm 1V 900-Pin FCBGA Tray
IC SOC CORTEX-A9 800MHZ 900FCBGA
Processors - Application Specialized
IC SOC CORTEX-A9 800MHZ 900FCBGA
Processors - Application Specialized
The three parts on the right have similar specifications to XC7Z045-2FF900I.
-
ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormReach Compliance CodeJESD-30 CodeNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsClock FrequencyConnectivityArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityRoHS StatusContact PlatingJESD-609 CodeECCN CodeTerminal FinishPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceMemory TypeData Bus WidthCore ArchitectureSpeed GradeHeight Seated (Max)LengthRadiation HardeningMountNumber of PinsMax Supply VoltageMin Supply VoltagePropagation DelayTurn On Delay TimeNumber of RegistersWidthView Compare
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XC7Z045-2FF900I10 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2016Zynq®-7000Active4 (72 Hours)900GPIO WITH FOUR 32-BIT BANKS8542.39.00.01CMOSBOTTOMBALLcompliantS-PBGA-B900130800MHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA800MHzCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 350K Logic CellsCAN, ETHERNET, I2C, PCI, SPI, UART, USBNon-RoHS Compliant-----------------------------
-
10 Weeks676-BBGA, FCBGAYES0°C~100°C TJTray2009Zynq®-7000Active4 (72 Hours)676-8542.39.00.01CMOSBOTTOMBALL-S-PBGA-B676130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USBROHS3 CompliantCopper, Silver, Tine13A991.DTin/Silver/Copper (Sn/Ag/Cu)2451V1mm800MHz30XC7Z0451V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USBROMless32bARM-23.37mm27mmNo--------
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10 Weeks676-BBGA, FCBGA-0°C~100°C TJBulk2009Zynq®-7000Active4 (72 Hours)--------1301GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--Kintex™-7 FPGA, 350K Logic Cells-ROHS3 Compliant----------------------------
-
10 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000Active4 (72 Hours)900PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALL--130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USBROHS3 CompliantCopper, Silver, Tine13A991.DTin/Silver/Copper (Sn/Ag/Cu)2451V1mm800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--ARM-3.35mm31mm-Surface Mount9001.05V950mV120 ps120 ps55480031mm
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