Xilinx Inc. XC7Z045-1FFG900I
- Part Number:
- XC7Z045-1FFG900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3163399-XC7Z045-1FFG900I
- Description:
- IC SOC CORTEX-A9 KINTEX7 900FBGA
- Datasheet:
- XC7Z045-1FFG900I
Xilinx Inc. XC7Z045-1FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FFG900I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- JESD-30 CodeS-PBGA-B900
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.35mm
- Length31mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.In total, there are 900 terminations, so system on a chip is really aided by this.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.The wireless SoC works at a frequency of 667MHz.Core architecture of ARM underpins the SoC meaning.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG900I System On Chip (SoC) applications.
Three phase UPS
Functional safety for critical applications in the automotive
Central alarm system
Measurement tools
Fitness
Remote control
Industrial Pressure
RISC-V
ARM processors
ARM support modules
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.In total, there are 900 terminations, so system on a chip is really aided by this.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.The wireless SoC works at a frequency of 667MHz.Core architecture of ARM underpins the SoC meaning.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG900I System On Chip (SoC) applications.
Three phase UPS
Functional safety for critical applications in the automotive
Central alarm system
Measurement tools
Fitness
Remote control
Industrial Pressure
RISC-V
ARM processors
ARM support modules
XC7Z045-1FFG900I More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 900-Pin FC-BGA
BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC -40C~100C TJ 256KB 667MHz 1V
Processors - Application Specialized XC7Z045-1FFG900I
IC SOC CORTEX-A9 667MHZ 900FCBGA
Product Description Demo for Development.
SOC, 667GHZ, FCBGA-667; Product Range:Zynq Family 7000 Series Microprocessors; CPU Speed:667MHz; Core Architecture:ARM Cortex-A9; MPU Case Style:FCBGA; No. of Pins:900Pins RoHS Compliant: Yes
BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC -40C~100C TJ 256KB 667MHz 1V
Processors - Application Specialized XC7Z045-1FFG900I
IC SOC CORTEX-A9 667MHZ 900FCBGA
Product Description Demo for Development.
SOC, 667GHZ, FCBGA-667; Product Range:Zynq Family 7000 Series Microprocessors; CPU Speed:667MHz; Core Architecture:ARM Cortex-A9; MPU Case Style:FCBGA; No. of Pins:900Pins RoHS Compliant: Yes
The three parts on the right have similar specifications to XC7Z045-1FFG900I.
-
ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusNumber of PinsMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthView Compare
-
XC7Z045-1FFG900I10 WeeksCopper, Silver, Tin900-BBGA, FCBGAYES-40°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm667MHz30XC7Z045S-PBGA-B9001V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-1256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mmNoROHS3 Compliant--------
-
10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045-1V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant676------
-
10 WeeksCopper, Silver, Tin676-BBGA, FCBGA-0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676---CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES3256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant-Surface Mount1.05V950mV110 ps34380027mm
-
10 WeeksCopper, Silver, Tin676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIED-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant-Surface Mount1.05V950mV120 ps34380027mm
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
02 April 2024
L6599D Working Principle, Application, Common Faults and Solutions
Ⅰ. Overview of L6599DⅡ. Line sensing function of L6599DⅢ. Working principle of L6599DⅣ. Application of L6599DⅤ. Application circuit of L6599DⅥ. Common faults and solutions of L6599DⅦ. Typical electrical... -
03 April 2024
ADUM1201BRZ-RL7 Alternatives, Specifications, Application and More
Ⅰ. Overview of ADUM1201BRZ-RL7Ⅱ. Specifications of ADUM1201BRZ-RL7Ⅲ. Propagation delay-related parametersⅣ. Application of ADUM1201BRZ-RL7Ⅴ. How to evaluate the performance of ADUM1201BRZ-RL7?Ⅵ. Functional block diagram of ADUM1201BRZ-RL7Ⅶ. PCB layout of... -
03 April 2024
SG3525 PWM IC Characteristics, Internal Structure, Working Principle and SG3525 vs SG3524
Ⅰ. Description of SG3525Ⅱ. Characteristics of SG3525Ⅲ. Internal structure and working principle of SG3525Ⅳ. Representative block diagram of SG3525Ⅴ. Application circuit of SG3525Ⅵ. How to adjust the frequency... -
07 April 2024
ATMEGA16A-AU Microcontroller: Characteristics, Structure, Technical Parameters and Package
Ⅰ. ATMEGA16A-AU overviewⅡ. Characteristics of ATMEGA16A-AUⅢ. Structure and functions of ATMEGA16A-AUⅣ. Technical parameters of ATMEGA16A-AUⅤ. Power consumption management of ATMEGA16A-AUⅥ. Application of ATMEGA16A-AUⅦ. ATMEGA16A-AU packageⅧ. How to build...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.