Xilinx Inc. XC7Z045-1FFG900CES

Name: XC7Z045-1FFG900CES
Brand: Xilinx Inc.
SKU: 3162599-XC7Z045-1FFG900CES
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z045-1FFG900CES

Manufacturer:: Xilinx Inc.

Ventron No:: 3162599-XC7Z045-1FFG900CES

Description:: IC SOC CORTEX-A9 KINTEX7 900FBGA

ECAD Model:

Datasheet:: XC7Z045-1FFG900CES

Specifications

Xilinx Inc. XC7Z045-1FFG900CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FFG900CES.

Factory Lead Time
7 Weeks
Package / Case
900-BBGA, FCBGA
Supplier Device Package
900-FCBGA (31x31)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
667MHz
Base Part Number
XC7Z045
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
Speed
667MHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
RoHS Status
RoHS Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The Zynq®-7000 series, published in 2010, is a highly advanced product with a wide range of features and capabilities. It operates at a minimum temperature of 0°C and has a frequency of 667MHz, ensuring optimal performance in various environments. The product offers a versatile interface, including CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, and USB, allowing seamless connectivity with other devices. With 130 I/Os, the Zynq®-7000 series provides extensive input/output capabilities. It also features a RAM size of 256KB and utilizes the ARM core architecture, ensuring efficient processing and enhanced performance. Furthermore, this product is RoHS compliant, adhering to environmental regulations and promoting sustainability.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-1FFG900CES System On Chip (SoC) applications.

External USB hard disk/SSD
Flow Sensors
Wireless networking
Industrial sectors
Industrial automation devices
Digital Signal Processing
Efficient hardware for inference of neural networks
Test and Measurement
Central alarm system
Industrial Pressure

XC7Z045-1FFG900CES More Descriptions

IC SOC CORTEX-A9 667MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
IC SOC CORTEX-A9 766MHZ 484BGA

Product Comparison

The three parts on the right have similar specifications to XC7Z045-1FFG900CES.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Interface

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Primary Attributes

RoHS Status

Contact Plating

Surface Mount

JESD-609 Code

Number of Terminations

ECCN Code

Terminal Finish

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

JESD-30 Code

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Memory Type

Data Bus Width

Boundary Scan

Speed Grade

RAM (words)

Bus Compatibility

Height Seated (Max)

Length

Radiation Hardening

Number of Pins

View Compare
XC7Z045-1FFG900CES

Xilinx Inc.

7 Weeks

900-BBGA, FCBGA

900-FCBGA (31x31)

0°C~85°C TJ

Tray

2010

Zynq®-7000

Obsolete

4 (72 Hours)

85°C

0°C

667MHz

XC7Z045

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

Kintex™-7 FPGA, 350K Logic Cells

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC7Z045-2FFG676E

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2009

Zynq®-7000

Active

4 (72 Hours)

-

-

800MHz

XC7Z045

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

-

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

Kintex™-7 FPGA, 350K Logic Cells

ROHS3 Compliant

Copper, Silver, Tin

YES

e1

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

30

S-PBGA-B676

1V

1.05V

ROMless

32b

YES

-2

256000

CAN; ETHERNET; I2C; SPI; UART; USB

3.37mm

27mm

No

-

XC7Z045-1FFG900CES vs XC7Z045-2FFG676E
XC7Z045-2FBG676I

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2009

Zynq®-7000

Active

3 (168 Hours)

-

-

800MHz

XC7Z045

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

-

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

Kintex™-7 FPGA, 350K Logic Cells

ROHS3 Compliant

Copper, Silver, Tin

YES

e1

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

30

-

1V

1.05V

ROMless

32b

YES

-2

256000

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

No

676

XC7Z045-1FFG900CES vs XC7Z045-2FBG676I
XC7Z045-3FFV676E

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~100°C TJ

Bulk

2009

Zynq®-7000

Active

4 (72 Hours)

-

-

-

-

-

130

1GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Kintex™-7 FPGA, 350K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

XC7Z045-1FFG900CES vs XC7Z045-3FFV676E