XC7Z045-1FFG676I

Xilinx Inc. XC7Z045-1FFG676I

Part Number:
XC7Z045-1FFG676I
Manufacturer:
Xilinx Inc.
Ventron No:
3669381-XC7Z045-1FFG676I
Description:
IC SOC CORTEX-A9 KINTEX7 676FBGA
ECAD Model:
Datasheet:
XC7Z045-1FFG676I

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Specifications
Xilinx Inc. XC7Z045-1FFG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FFG676I.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    676-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    676
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Other uPs/uCs/Peripheral ICs
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    667MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z045
  • Pin Count
    676
  • JESD-30 Code
    S-PBGA-B676
  • Operating Supply Voltage
    1V
  • Supply Voltage-Max (Vsup)
    1.05V
  • Power Supplies
    11.8V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Memory Type
    ROMless
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -1
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • UV Erasable
    N
  • Height Seated (Max)
    3.37mm
  • Length
    27mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.In total, there are 676 terminations, which makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Other uPs/uCs/Peripheral ICs will do.System on chip requires 11.8V power supplies.By searching XC7Z045, you can find system on chips with similar specs and purposes.A frequency of 667MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-1FFG676I System On Chip (SoC) applications.

Smart appliances
Microcontroller based SoC ( RISC-V, ARM)
Smartphones
Microprocessors
RISC-V
Robotics
Measurement testers
Print Special Issue Flyer
Temperature Sensors
Efficient hardware for inference of neural networks
XC7Z045-1FFG676I More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
Mpu, Arm Cortex-A9, 667Mhz Rohs Compliant: Yes |Amd Xilinx XC7Z045-1FFG676I
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Processors - Application Specialized
Product Comparison
The three parts on the right have similar specifications to XC7Z045-1FFG676I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    JESD-30 Code
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Power Supplies
    Interface
    Number of I/O
    RAM Size
    Memory Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    UV Erasable
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    Width
    Number of Pins
    View Compare
  • XC7Z045-1FFG676I
    XC7Z045-1FFG676I
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    yes
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    Other uPs/uCs/Peripheral ICs
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    667MHz
    30
    XC7Z045
    676
    S-PBGA-B676
    1V
    1.05V
    11.8V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    ROMless
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -1
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    N
    3.37mm
    27mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    -
    Active
    3 (168 Hours)
    676
    -
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    800MHz
    NOT SPECIFIED
    -
    -
    S-PBGA-B676
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    3
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    -
    2.54mm
    27mm
    -
    ROHS3 Compliant
    Surface Mount
    1.05V
    950mV
    110 ps
    343800
    27mm
    -
  • XC7Z035-1FBG676C
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    -
    Active
    3 (168 Hours)
    676
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    -
    -
    S-PBGA-B676
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    -
    2.54mm
    27mm
    -
    ROHS3 Compliant
    Surface Mount
    1.05V
    950mV
    120 ps
    343800
    27mm
    -
  • XC7Z035-1FFG900I
    10 Weeks
    -
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    -
    Active
    4 (72 Hours)
    900
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    667MHz
    30
    -
    -
    -
    1V
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    -
    3.35mm
    -
    -
    ROHS3 Compliant
    -
    -
    -
    130 ps
    343800
    -
    900
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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