Xilinx Inc. XC7Z045-1FFG676I
- Part Number:
- XC7Z045-1FFG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669381-XC7Z045-1FFG676I
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z045-1FFG676I
Xilinx Inc. XC7Z045-1FFG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FFG676I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- SubcategoryOther uPs/uCs/Peripheral ICs
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- Pin Count676
- JESD-30 CodeS-PBGA-B676
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- Power Supplies11.8V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- UV ErasableN
- Height Seated (Max)3.37mm
- Length27mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.In total, there are 676 terminations, which makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Other uPs/uCs/Peripheral ICs will do.System on chip requires 11.8V power supplies.By searching XC7Z045, you can find system on chips with similar specs and purposes.A frequency of 667MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG676I System On Chip (SoC) applications.
Smart appliances
Microcontroller based SoC ( RISC-V, ARM)
Smartphones
Microprocessors
RISC-V
Robotics
Measurement testers
Print Special Issue Flyer
Temperature Sensors
Efficient hardware for inference of neural networks
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.In total, there are 676 terminations, which makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Other uPs/uCs/Peripheral ICs will do.System on chip requires 11.8V power supplies.By searching XC7Z045, you can find system on chips with similar specs and purposes.A frequency of 667MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG676I System On Chip (SoC) applications.
Smart appliances
Microcontroller based SoC ( RISC-V, ARM)
Smartphones
Microprocessors
RISC-V
Robotics
Measurement testers
Print Special Issue Flyer
Temperature Sensors
Efficient hardware for inference of neural networks
XC7Z045-1FFG676I More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
Mpu, Arm Cortex-A9, 667Mhz Rohs Compliant: Yes |Amd Xilinx XC7Z045-1FFG676I
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Processors - Application Specialized
Mpu, Arm Cortex-A9, 667Mhz Rohs Compliant: Yes |Amd Xilinx XC7Z045-1FFG676I
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Processors - Application Specialized
The three parts on the right have similar specifications to XC7Z045-1FFG676I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberPin CountJESD-30 CodeOperating Supply VoltageSupply Voltage-Max (Vsup)Power SuppliesInterfaceNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityUV ErasableHeight Seated (Max)LengthRadiation HardeningRoHS StatusMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthNumber of PinsView Compare
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XC7Z045-1FFG676I10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES-40°C~100°C TJTray2009Zynq®-7000e1yesActive4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01Other uPs/uCs/Peripheral ICsCMOSBOTTOMBALL2451V1mm667MHz30XC7Z045676S-PBGA-B6761V1.05V11.8VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-1256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USBN3.37mm27mmNoROHS3 Compliant--------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA-0°C~100°C TJTray2010Zynq®-7000e1-Active3 (168 Hours)676----CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED--S-PBGA-B676---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES3256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB-2.54mm27mm-ROHS3 CompliantSurface Mount1.05V950mV110 ps34380027mm-
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1-Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)--CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIED--S-PBGA-B676---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB-2.54mm27mm-ROHS3 CompliantSurface Mount1.05V950mV120 ps34380027mm-
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10 Weeks-900-BBGA, FCBGAYES-40°C~100°C TJTray2010Zynq®-7000e1-Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)--CMOSBOTTOMBALL2451V-667MHz30---1V--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB-3.35mm--ROHS3 Compliant---130 ps343800-900
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