Xilinx Inc. XC7Z045-1FBG676I
- Part Number:
- XC7Z045-1FBG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669311-XC7Z045-1FBG676I
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z045-1FBG676I
Xilinx Inc. XC7Z045-1FBG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FBG676I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- JESD-30 CodeS-PBGA-B676
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length27mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Its package is 676-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.In the state-of-the-art Tray package, this SoC system on a chip is housed.130 I/Os in total are included in this SoC part.It is recommended to use a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.Having 676 terminations in total makes system on a chip possible.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.It operates at a frequency of 667MHz.In terms of core architecture, the SoC meaning relies on ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676I System On Chip (SoC) applications.
Avionics
Remote control
Vending machines
Medical
Vending machines
Efficient hardware for training of neural networks
Automated sorting equipment
Networked sensors
ARM Cortex M4 microcontroller
Industrial AC-DC
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Its package is 676-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.In the state-of-the-art Tray package, this SoC system on a chip is housed.130 I/Os in total are included in this SoC part.It is recommended to use a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.Having 676 terminations in total makes system on a chip possible.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.It operates at a frequency of 667MHz.In terms of core architecture, the SoC meaning relies on ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676I System On Chip (SoC) applications.
Avionics
Remote control
Vending machines
Medical
Vending machines
Efficient hardware for training of neural networks
Automated sorting equipment
Networked sensors
ARM Cortex M4 microcontroller
Industrial AC-DC
XC7Z045-1FBG676I More Descriptions
FPGA Kintex-7 Family 350000 Cells 28nm Technology 1V Automotive 676-Pin Lidless FCBGA
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Product Description Demo for Development.
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-1FBG676I
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Product Description Demo for Development.
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-1FBG676I
The three parts on the right have similar specifications to XC7Z045-1FBG676I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusNumber of PinsMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthView Compare
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XC7Z045-1FBG676I10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm667MHz30XC7Z045S-PBGA-B6761V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-1256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant--------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045-1V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant676------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA-0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676---CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES3256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant-Surface Mount1.05V950mV110 ps34380027mm
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10 Weeks-900-BBGA, FCBGAYES-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)-CMOSBOTTOMBALL2451V-667MHz30--1V-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant900---130 ps343800-
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