Xilinx Inc. XC7Z045-1FBG676CES
- Part Number:
- XC7Z045-1FBG676CES
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162634-XC7Z045-1FBG676CES
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z045-1FBG676CES
Xilinx Inc. XC7Z045-1FBG676CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FBG676CES.
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Base Part NumberXC7Z045
- JESD-30 CodeS-PBGA-B676
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length27mm
- Width27mm
- RoHS StatusRoHS Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
In 2010, this particular part was published with the status of being obsolete. It has since been replaced by newer and more advanced technology. The number of terminations for this part is 676, indicating its complexity and capability. Its terminal form is BALL, which is a common form for electronic components. The RAM size for this part is 256KB, providing a decent amount of memory for storing data. The core processor is a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, which is known for its high performance and efficiency. This part also has various connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Its architecture is a combination of MCU and FPGA, making it versatile and adaptable for different applications. The width of this part is 27mm, making it compact and suitable for smaller devices. Lastly, it is important to note that this part is RoHS compliant, ensuring that it is environmentally friendly and safe for use.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676CES System On Chip (SoC) applications.
Microcontroller
Digital Media
Optical drive
Multiprocessor system-on-chips (MPSoCs)
USB hard disk enclosure
Automotive gateway
Avionics
Flow Sensors
Medical Pressure
Automated sorting equipment
In 2010, this particular part was published with the status of being obsolete. It has since been replaced by newer and more advanced technology. The number of terminations for this part is 676, indicating its complexity and capability. Its terminal form is BALL, which is a common form for electronic components. The RAM size for this part is 256KB, providing a decent amount of memory for storing data. The core processor is a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, which is known for its high performance and efficiency. This part also has various connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Its architecture is a combination of MCU and FPGA, making it versatile and adaptable for different applications. The width of this part is 27mm, making it compact and suitable for smaller devices. Lastly, it is important to note that this part is RoHS compliant, ensuring that it is environmentally friendly and safe for use.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676CES System On Chip (SoC) applications.
Microcontroller
Digital Media
Optical drive
Multiprocessor system-on-chips (MPSoCs)
USB hard disk enclosure
Automotive gateway
Avionics
Flow Sensors
Medical Pressure
Automated sorting equipment
XC7Z045-1FBG676CES More Descriptions
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
350000-Cell, PBGA900
IC SOC CORTEX-A9 KINTEX7 676FBGA
350000-Cell, PBGA900
The three parts on the right have similar specifications to XC7Z045-1FBG676CES.
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ImagePart NumberManufacturerPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyTerminal PositionTerminal FormSupply VoltageTerminal PitchFrequencyBase Part NumberJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthWidthRoHS StatusFactory Lead TimeJESD-609 CodePbfree CodeTerminal FinishHTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)SpeedClock FrequencyContact PlatingMountMax Supply VoltageMin Supply VoltagePropagation DelaySpeed GradeNumber of RegistersNumber of PinsECCN CodeAdditional FeatureTurn On Delay TimeView Compare
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XC7Z045-1FBG676CES676-BBGA, FCBGAYES0°C~85°C TJTray2010Zynq®-7000Obsolete4 (72 Hours)676CMOSBOTTOMBALL1V1mm667MHzXC7Z045S-PBGA-B6761.05V0.95VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmRoHS Compliant---------------------
-
484-LFBGA, CSPBGAYES-40°C~100°C TJTray2016Zynq®-7000Active3 (168 Hours)484CMOSBOTTOMBALL1V0.8mm--S-PBGA-B4841.05V0.95V-200256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-YES256000Artix™-7 FPGA, 65K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm19mmROHS3 Compliant10 Weekse3yesMatte Tin (Sn)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED667MHz667MHz-----------
-
676-BBGA, FCBGA-0°C~100°C TJTray2010Zynq®-7000Active3 (168 Hours)676CMOSBOTTOMBALL1V1mm800MHz-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 Compliant10 Weekse1---NOT SPECIFIEDNOT SPECIFIED--Copper, Silver, TinSurface Mount1.05V950mV110 ps3343800----
-
900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000Active4 (72 Hours)900CMOSBOTTOMBALL1V1mm800MHz----CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm31mmROHS3 Compliant10 Weekse1-Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.0124530--Copper, Silver, TinSurface Mount1.05V950mV120 ps-5548009003A991.DPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY120 ps
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