XC7Z045-1FBG676CES

Xilinx Inc. XC7Z045-1FBG676CES

Part Number:
XC7Z045-1FBG676CES
Manufacturer:
Xilinx Inc.
Ventron No:
3162634-XC7Z045-1FBG676CES
Description:
IC SOC CORTEX-A9 KINTEX7 676FBGA
ECAD Model:
Datasheet:
XC7Z045-1FBG676CES

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Specifications
Xilinx Inc. XC7Z045-1FBG676CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-1FBG676CES.
  • Package / Case
    676-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    676
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    667MHz
  • Base Part Number
    XC7Z045
  • JESD-30 Code
    S-PBGA-B676
  • Supply Voltage-Max (Vsup)
    1.05V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    2.54mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
In 2010, this particular part was published with the status of being obsolete. It has since been replaced by newer and more advanced technology. The number of terminations for this part is 676, indicating its complexity and capability. Its terminal form is BALL, which is a common form for electronic components. The RAM size for this part is 256KB, providing a decent amount of memory for storing data. The core processor is a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, which is known for its high performance and efficiency. This part also has various connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Its architecture is a combination of MCU and FPGA, making it versatile and adaptable for different applications. The width of this part is 27mm, making it compact and suitable for smaller devices. Lastly, it is important to note that this part is RoHS compliant, ensuring that it is environmentally friendly and safe for use.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-1FBG676CES System On Chip (SoC) applications.

Microcontroller
Digital Media
Optical drive
Multiprocessor system-on-chips (MPSoCs)
USB hard disk enclosure
Automotive gateway
Avionics
Flow Sensors
Medical Pressure
Automated sorting equipment
XC7Z045-1FBG676CES More Descriptions
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
350000-Cell, PBGA900
Product Comparison
The three parts on the right have similar specifications to XC7Z045-1FBG676CES.
  • Image
    Part Number
    Manufacturer
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    Frequency
    Base Part Number
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Core Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Factory Lead Time
    JESD-609 Code
    Pbfree Code
    Terminal Finish
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Speed
    Clock Frequency
    Contact Plating
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Speed Grade
    Number of Registers
    Number of Pins
    ECCN Code
    Additional Feature
    Turn On Delay Time
    View Compare
  • XC7Z045-1FBG676CES
    XC7Z045-1FBG676CES
    676-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    Obsolete
    4 (72 Hours)
    676
    CMOS
    BOTTOM
    BALL
    1V
    1mm
    667MHz
    XC7Z045
    S-PBGA-B676
    1.05V
    0.95V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z014S-1CLG484I
    484-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    Active
    3 (168 Hours)
    484
    CMOS
    BOTTOM
    BALL
    1V
    0.8mm
    -
    -
    S-PBGA-B484
    1.05V
    0.95V
    -
    200
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    YES
    256000
    Artix™-7 FPGA, 65K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    19mm
    ROHS3 Compliant
    10 Weeks
    e3
    yes
    Matte Tin (Sn)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    667MHz
    667MHz
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    Active
    3 (168 Hours)
    676
    CMOS
    BOTTOM
    BALL
    1V
    1mm
    800MHz
    -
    S-PBGA-B676
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    10 Weeks
    e1
    -
    -
    -
    NOT SPECIFIED
    NOT SPECIFIED
    -
    -
    Copper, Silver, Tin
    Surface Mount
    1.05V
    950mV
    110 ps
    3
    343800
    -
    -
    -
    -
  • XC7Z100-L2FFG900I
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    Active
    4 (72 Hours)
    900
    CMOS
    BOTTOM
    BALL
    1V
    1mm
    800MHz
    -
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    31mm
    ROHS3 Compliant
    10 Weeks
    e1
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    245
    30
    -
    -
    Copper, Silver, Tin
    Surface Mount
    1.05V
    950mV
    120 ps
    -
    554800
    900
    3A991.D
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    120 ps
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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