Xilinx Inc. XC7Z035-3FFG676E
- Part Number:
- XC7Z035-3FFG676E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669337-XC7Z035-3FFG676E
- Description:
- IC SOC CORTEX-A9 KINTEX7 676BGA
- Datasheet:
- XC7Z035-3FFG676E
Xilinx Inc. XC7Z035-3FFG676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-3FFG676E.
- Factory Lead Time10 Weeks
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 275K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.37mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.Zynq?-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.It is recommended to use a 1V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.05V.It can feed on a power supply of at least 0.95V.It is really beneficial to have system on a chip since there are 676 terminations in total.wireless SoCs operate at 800MHz.In this SoC meaning, ARM serves as the core architecture.Moreover, this SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY as its additional features.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-3FFG676E System On Chip (SoC) applications.
Mobile computing
Temperature Sensors
PC peripherals
Measurement tools
Robotics
Personal Computers
Central alarm system
Digital Media
Optical drive
CNC control
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.Zynq?-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.It is recommended to use a 1V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.05V.It can feed on a power supply of at least 0.95V.It is really beneficial to have system on a chip since there are 676 terminations in total.wireless SoCs operate at 800MHz.In this SoC meaning, ARM serves as the core architecture.Moreover, this SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY as its additional features.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-3FFG676E System On Chip (SoC) applications.
Mobile computing
Temperature Sensors
PC peripherals
Measurement tools
Robotics
Personal Computers
Central alarm system
Digital Media
Optical drive
CNC control
XC7Z035-3FFG676E More Descriptions
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA Tray
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Product Description Demo for Development.
Processors - Application Specialized
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Product Description Demo for Development.
Processors - Application Specialized
The three parts on the right have similar specifications to XC7Z035-3FFG676E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthWidthRoHS StatusSpeedContact PlatingMountMax Supply VoltageMin Supply VoltagePropagation DelaySpeed GradeNumber of RegistersNumber of PinsTurn On Delay TimeView Compare
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XC7Z035-3FFG676E10 Weeks676-BBGA, FCBGAYES0°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIEDS-PBGA-B6761.05V0.95VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mm27mmROHS3 Compliant-----------
-
10 Weeks676-BBGA, FCBGA-0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)-----------------130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA---Kintex™-7 FPGA, 350K Logic Cells----ROHS3 Compliant1GHz---------
-
10 Weeks676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)--CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIEDS-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 Compliant-Copper, Silver, TinSurface Mount1.05V950mV120 ps1343800--
-
10 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm31mmROHS3 Compliant-Copper, Silver, TinSurface Mount1.05V950mV120 ps-554800900120 ps
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