Xilinx Inc. XC7Z035-2FFG900I
- Part Number:
- XC7Z035-2FFG900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669357-XC7Z035-2FFG900I
- Description:
- IC SOC CORTEX-A9 KINTEX7 900BGA
- Datasheet:
- XC7Z035-2FFG900I
Xilinx Inc. XC7Z035-2FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-2FFG900I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)30
- JESD-30 CodeS-PBGA-B900
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Max Supply Voltage1.05V
- Min Supply Voltage950mV
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- Propagation Delay100 ps
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade2
- Primary AttributesKintex™-7 FPGA, 275K Logic Cells
- Number of Registers343800
- Height Seated (Max)3.35mm
- Length31mm
- Width31mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.A system on chip SoC of this type belongs to the Zynq?-7000 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V rating is recommended.system on a chip benefits from 900 terminations.It operates at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The maximum supply voltage is rated as 1.05V.The SoC security is powered at least by 950mV.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-2FFG900I System On Chip (SoC) applications.
Measurement tools
Avionics
Wireless networking
POS Terminals
Mobile market
Smartphones
Keywords
Efficient hardware for training of neural networks
Healthcare
Multiprocessor system-on-chips (MPSoCs)
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.A system on chip SoC of this type belongs to the Zynq?-7000 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V rating is recommended.system on a chip benefits from 900 terminations.It operates at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The maximum supply voltage is rated as 1.05V.The SoC security is powered at least by 950mV.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-2FFG900I System On Chip (SoC) applications.
Measurement tools
Avionics
Wireless networking
POS Terminals
Mobile market
Smartphones
Keywords
Efficient hardware for training of neural networks
Healthcare
Multiprocessor system-on-chips (MPSoCs)
XC7Z035-2FFG900I More Descriptions
Quad 2-input positive-NAND buffers with open collector outputs 14-SOIC 0 to 70
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
Processors - Application Specialized XC7Z035-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900BGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-2FFG900I
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
Processors - Application Specialized XC7Z035-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900BGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-2FFG900I
The three parts on the right have similar specifications to XC7Z035-2FFG900I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountPackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)JESD-30 CodeInterfaceMax Supply VoltageMin Supply VoltageNumber of I/ORAM SizeCore ProcessorPeripheralsPropagation DelayConnectivityArchitectureCore ArchitectureBoundary ScanSpeed GradePrimary AttributesNumber of RegistersHeight Seated (Max)LengthWidthRoHS StatusSurface MountHTS CodeBase Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)Memory TypeData Bus WidthRAM (words)Bus CompatibilityRadiation HardeningSpeedView Compare
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XC7Z035-2FFG900I10 WeeksCopper, Silver, TinSurface Mount900-BBGA, FCBGA-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLYCMOSBOTTOMBALL2451V1mm800MHz30S-PBGA-B900CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA100 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES2Kintex™-7 FPGA, 275K Logic Cells3438003.35mm31mm31mmROHS3 Compliant------------
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10 WeeksCopper, Silver, Tin-676-BBGA, FCBGA0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)-CMOSBOTTOMBALL2451V1mm800MHz30S-PBGA-B676CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES-2Kintex™-7 FPGA, 350K Logic Cells-3.37mm27mm-ROHS3 CompliantYES8542.39.00.01XC7Z0451V1.05VROMless32b256000CAN; ETHERNET; I2C; SPI; UART; USBNo-
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10 Weeks--676-BBGA, FCBGA0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)----------------130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA---Kintex™-7 FPGA, 350K Logic Cells----ROHS3 Compliant----------1GHz
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10 WeeksCopper, Silver, TinSurface Mount676-BBGA, FCBGA0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIEDS-PBGA-B676CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA120 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES1Kintex™-7 FPGA, 275K Logic Cells3438002.54mm27mm27mmROHS3 Compliant-------256000CAN; ETHERNET; I2C; SPI; UART; USB--
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