XC7Z035-2FFG900I

Xilinx Inc. XC7Z035-2FFG900I

Part Number:
XC7Z035-2FFG900I
Manufacturer:
Xilinx Inc.
Ventron No:
3669357-XC7Z035-2FFG900I
Description:
IC SOC CORTEX-A9 KINTEX7 900BGA
ECAD Model:
Datasheet:
XC7Z035-2FFG900I

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Specifications
Xilinx Inc. XC7Z035-2FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-2FFG900I.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    800MHz
  • Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    S-PBGA-B900
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Max Supply Voltage
    1.05V
  • Min Supply Voltage
    950mV
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Propagation Delay
    100 ps
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    2
  • Primary Attributes
    Kintex™-7 FPGA, 275K Logic Cells
  • Number of Registers
    343800
  • Height Seated (Max)
    3.35mm
  • Length
    31mm
  • Width
    31mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.A system on chip SoC of this type belongs to the Zynq?-7000 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V rating is recommended.system on a chip benefits from 900 terminations.It operates at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The maximum supply voltage is rated as 1.05V.The SoC security is powered at least by 950mV.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z035-2FFG900I System On Chip (SoC) applications.

Measurement tools
Avionics
Wireless networking
POS Terminals
Mobile market
Smartphones
Keywords
Efficient hardware for training of neural networks
Healthcare
Multiprocessor system-on-chips (MPSoCs)
XC7Z035-2FFG900I More Descriptions
Quad 2-input positive-NAND buffers with open collector outputs 14-SOIC 0 to 70
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
Processors - Application Specialized XC7Z035-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900BGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-2FFG900I
Product Comparison
The three parts on the right have similar specifications to XC7Z035-2FFG900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    JESD-30 Code
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Propagation Delay
    Connectivity
    Architecture
    Core Architecture
    Boundary Scan
    Speed Grade
    Primary Attributes
    Number of Registers
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Surface Mount
    HTS Code
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Memory Type
    Data Bus Width
    RAM (words)
    Bus Compatibility
    Radiation Hardening
    Speed
    View Compare
  • XC7Z035-2FFG900I
    XC7Z035-2FFG900I
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    S-PBGA-B900
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    100 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    2
    Kintex™-7 FPGA, 275K Logic Cells
    343800
    3.35mm
    31mm
    31mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FFG676E
    10 Weeks
    Copper, Silver, Tin
    -
    676-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    S-PBGA-B676
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    -2
    Kintex™-7 FPGA, 350K Logic Cells
    -
    3.37mm
    27mm
    -
    ROHS3 Compliant
    YES
    8542.39.00.01
    XC7Z045
    1V
    1.05V
    ROMless
    32b
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    No
    -
  • XC7Z045-3FFV676E
    10 Weeks
    -
    -
    676-BBGA, FCBGA
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1GHz
  • XC7Z035-1FBG676C
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    676-BBGA, FCBGA
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    S-PBGA-B676
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    120 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    1
    Kintex™-7 FPGA, 275K Logic Cells
    343800
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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