Xilinx Inc. XC7Z035-2FFG900E

Name: XC7Z035-2FFG900E
Brand: Xilinx Inc.
SKU: 3828107-XC7Z035-2FFG900E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z035-2FFG900E

Manufacturer:: Xilinx Inc.

Ventron No:: 3828107-XC7Z035-2FFG900E

Description:: IC SOC CORTEX-A9 KINTEX7 900BGA

ECAD Model:

Datasheet:: XC7Z035-2FFG900E

Specifications

Xilinx Inc. XC7Z035-2FFG900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-2FFG900E.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Package / Case
900-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
800MHz
Reflow Temperature-Max (s)
30
JESD-30 Code
S-PBGA-B900
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage
1.05V
Min Supply Voltage
950mV
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Propagation Delay
100 ps
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
2
Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
Number of Registers
343800
Height Seated (Max)
3.35mm
Length
31mm
Width
31mm
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Xilinx Inc. is the brand of this part, which is an Embedded - System On Chip (SoC) chip in the Embedded - System On Chip (SoC) category. It has a Moisture Sensitivity Level (MSL) of 4 (72 Hours) and an additional feature of PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY. The terminal form is BALL and the supply voltage is 1V with a terminal pitch of 1mm. Its JESD-30 Code is S-PBGA-B900 and it has interfaces such as CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, and USART. The minimum supply voltage is 950mV and it has connectivity options for CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Its width is 31mm.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z035-2FFG900E System On Chip (SoC) applications.

Temperature
POS Terminals
Networked sensors
Digital Media
Avionics
Servo drive control module
Transmitters
Mobile computing
Mouse
Industrial sectors

XC7Z035-2FFG900E More Descriptions

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900BGA
Processors - Application Specialized
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-2FFG900E

Product Comparison

The three parts on the right have similar specifications to XC7Z035-2FFG900E.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Package / Case

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Additional Feature

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

JESD-30 Code

Interface

Max Supply Voltage

Min Supply Voltage

Number of I/O

RAM Size

Core Processor

Peripherals

Propagation Delay

Connectivity

Architecture

Core Architecture

Boundary Scan

Speed Grade

Primary Attributes

Number of Registers

Height Seated (Max)

Length

Width

RoHS Status

Surface Mount

Pbfree Code

HTS Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Speed

Clock Frequency

RAM (words)

Bus Compatibility

Number of Pins

Base Part Number

Operating Supply Voltage

Memory Type

Data Bus Width

Radiation Hardening

View Compare
XC7Z035-2FFG900E

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

S-PBGA-B900

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

100 ps

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

2

Kintex™-7 FPGA, 275K Logic Cells

343800

3.35mm

31mm

31mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC7Z012S-2CLG485I

Xilinx Inc.

10 Weeks

-

-

484-LFBGA, CSPBGA

-40°C~100°C TJ

Tray

2016

Zynq®-7000

e3

Active

3 (168 Hours)

485

-

Matte Tin (Sn)

-

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

0.8mm

-

NOT SPECIFIED

S-PBGA-B485

-

-

-

150

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

YES

-

Artix™-7 FPGA, 55K Logic Cells

-

1.6mm

19mm

19mm

ROHS3 Compliant

YES

yes

8542.31.00.01

1.05V

0.95V

766MHz

800MHz

256000

CAN; ETHERNET; I2C; SPI; UART; USB

-

-

-

-

-

-

XC7Z035-2FFG900E vs XC7Z012S-2CLG485I
XC7Z045-2FBG676I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

-

676-BBGA, FCBGA

-40°C~100°C TJ

Tray

2009

Zynq®-7000

e1

Active

3 (168 Hours)

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

-

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

-

-

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

-2

Kintex™-7 FPGA, 350K Logic Cells

-

2.54mm

27mm

-

ROHS3 Compliant

YES

-

8542.39.00.01

1.05V

-

-

-

256000

CAN; ETHERNET; I2C; SPI; UART; USB

676

XC7Z045

1V

ROMless

32b

No

XC7Z035-2FFG900E vs XC7Z045-2FBG676I
XC7Z045-3FFV676E

Xilinx Inc.

10 Weeks

-

-

676-BBGA, FCBGA

0°C~100°C TJ

Bulk

2009

Zynq®-7000

-

Active

4 (72 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

Kintex™-7 FPGA, 350K Logic Cells

-

-

-

-

ROHS3 Compliant

-

-

-

-

-

1GHz

-

-

-

-

-

-

-

-

-

XC7Z035-2FFG900E vs XC7Z045-3FFV676E