Xilinx Inc. XC7Z035-1FFG676I

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Its package is 676-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.The Zynq?-7000 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.In addition, this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.A power supply with a 1V rating is recommended.In total, there are 676 terminations, which makes system on a chip possible.wireless SoCs operate at 667MHz.The SoC meaning is based on the core architecture of ARM.This power supply is rated with a maximum voltage of 1.05V.A minimum of 950mV are supplied to it.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z035-1FFG676I System On Chip (SoC) applications.

Functional safety for critical applications in the industrial sectors
Industrial robot
USB hard disk enclosure
Vending machines
Digital Media
Smart appliances
CNC control
Transmitters
Industrial sectors
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