Xilinx Inc. XC7Z035-1FBG676I
- Part Number:
- XC7Z035-1FBG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3163348-XC7Z035-1FBG676I
- Description:
- IC SOC CORTEX-A9 KINTEX7 676BGA
- Datasheet:
- XC7Z035-1FBG676I
Xilinx Inc. XC7Z035-1FBG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-1FBG676I.
- Factory Lead Time10 Weeks
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 275K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.A key point to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.In the SoCs wireless, voltages above 1.05V are considered unsafe.In order to run it, it must be fed by at least 0.95V of power.Having 676 terminations in total makes system on a chip possible.There is 667MHz frequency associated with the wireless SoC.The SoC meaning is based on the core architecture of ARM.Furthermore, this SoC processor also incorporates additional features similar to PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY which are available on other SoC processors also.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-1FBG676I System On Chip (SoC) applications.
POS Terminals
CNC control
DC-input BLDC motor drive
Avionics
Functional safety for critical applications in the automotive
Efficient hardware for training of neural networks
System-on-chip (SoC)
Keyboard
Microcontroller
Functional safety for critical applications in the industrial sectors
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.A key point to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.In the SoCs wireless, voltages above 1.05V are considered unsafe.In order to run it, it must be fed by at least 0.95V of power.Having 676 terminations in total makes system on a chip possible.There is 667MHz frequency associated with the wireless SoC.The SoC meaning is based on the core architecture of ARM.Furthermore, this SoC processor also incorporates additional features similar to PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY which are available on other SoC processors also.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-1FBG676I System On Chip (SoC) applications.
POS Terminals
CNC control
DC-input BLDC motor drive
Avionics
Functional safety for critical applications in the automotive
Efficient hardware for training of neural networks
System-on-chip (SoC)
Keyboard
Microcontroller
Functional safety for critical applications in the industrial sectors
XC7Z035-1FBG676I More Descriptions
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Product Description Demo for Development.
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-1FBG676I
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Product Description Demo for Development.
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-1FBG676I
The three parts on the right have similar specifications to XC7Z035-1FBG676I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthWidthRoHS StatusContact PlatingMountMax Supply VoltageMin Supply VoltagePropagation DelaySpeed GradeNumber of RegistersNumber of PinsOperating Supply VoltageView Compare
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XC7Z035-1FBG676I10 Weeks676-BBGA, FCBGAYES-40°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALLNOT SPECIFIED1V1mm667MHzNOT SPECIFIEDS-PBGA-B6761.05V0.95VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 Compliant----------
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10 Weeks676-BBGA, FCBGA-0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676----CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIEDS-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 CompliantCopper, Silver, TinSurface Mount1.05V950mV110 ps3343800--
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10 Weeks676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)--CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIEDS-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 CompliantCopper, Silver, TinSurface Mount1.05V950mV120 ps1343800--
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10 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)--CMOSBOTTOMBALL2451V-667MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant----130 ps13438009001V
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