XC7Z035-1FBG676I

Xilinx Inc. XC7Z035-1FBG676I

Part Number:
XC7Z035-1FBG676I
Manufacturer:
Xilinx Inc.
Ventron No:
3163348-XC7Z035-1FBG676I
Description:
IC SOC CORTEX-A9 KINTEX7 676BGA
ECAD Model:
Datasheet:
XC7Z035-1FBG676I

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Specifications
Xilinx Inc. XC7Z035-1FBG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-1FBG676I.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    676-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Additional Feature
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    667MHz
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B676
  • Supply Voltage-Max (Vsup)
    1.05V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 275K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    2.54mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.A key point to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.In the SoCs wireless, voltages above 1.05V are considered unsafe.In order to run it, it must be fed by at least 0.95V of power.Having 676 terminations in total makes system on a chip possible.There is 667MHz frequency associated with the wireless SoC.The SoC meaning is based on the core architecture of ARM.Furthermore, this SoC processor also incorporates additional features similar to PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY which are available on other SoC processors also.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z035-1FBG676I System On Chip (SoC) applications.

POS Terminals
CNC control
DC-input BLDC motor drive
Avionics
Functional safety for critical applications in the automotive
Efficient hardware for training of neural networks
System-on-chip (SoC)
Keyboard
Microcontroller
Functional safety for critical applications in the industrial sectors
XC7Z035-1FBG676I More Descriptions
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Product Description Demo for Development.
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-1FBG676I
Product Comparison
The three parts on the right have similar specifications to XC7Z035-1FBG676I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Core Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Contact Plating
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Speed Grade
    Number of Registers
    Number of Pins
    Operating Supply Voltage
    View Compare
  • XC7Z035-1FBG676I
    XC7Z035-1FBG676I
    10 Weeks
    676-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    667MHz
    NOT SPECIFIED
    S-PBGA-B676
    1.05V
    0.95V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    800MHz
    NOT SPECIFIED
    S-PBGA-B676
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    1.05V
    950mV
    110 ps
    3
    343800
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    S-PBGA-B676
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    1.05V
    950mV
    120 ps
    1
    343800
    -
    -
  • XC7Z035-1FFG900I
    10 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    667MHz
    30
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    130 ps
    1
    343800
    900
    1V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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