Xilinx Inc. XC7Z030-L2FFG676I
- Part Number:
- XC7Z030-L2FFG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669378-XC7Z030-L2FFG676I
- Description:
- IC SOC CORTEX-A9 KINTEX7 676BGA
- Datasheet:
- XC7Z030-L2FFG676I
Xilinx Inc. XC7Z030-L2FFG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-L2FFG676I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Package / Case676-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Max Supply Voltage1.05V
- Min Supply Voltage950mV
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- Propagation Delay100 ps
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 125K Logic Cells
- Number of Registers157200
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.24mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Its package is 676-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 125K Logic Cells.Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 130.A 1V power supply should be used.A system on a chip benefits from having 676 terminations.In this wireless SoC, the frequency is set to 800MHz.In terms of core architecture, the SoC meaning relies on ARM.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.It has a maximum supply voltage of 1.05V rated for it.At least 950mV power is delivered to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-L2FFG676I System On Chip (SoC) applications.
Central alarm system
Medical
Print Special Issue Flyer
Keywords
Digital Media
Avionics
High-end PLC
Automated sorting equipment
Embedded systems
Central inverter
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Its package is 676-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 125K Logic Cells.Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 130.A 1V power supply should be used.A system on a chip benefits from having 676 terminations.In this wireless SoC, the frequency is set to 800MHz.In terms of core architecture, the SoC meaning relies on ARM.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.It has a maximum supply voltage of 1.05V rated for it.At least 950mV power is delivered to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-L2FFG676I System On Chip (SoC) applications.
Central alarm system
Medical
Print Special Issue Flyer
Keywords
Digital Media
Avionics
High-end PLC
Automated sorting equipment
Embedded systems
Central inverter
XC7Z030-L2FFG676I More Descriptions
FPGA Zynq-7000 125000 Cells 28nm Technology 1V 676-Pin FCBGA Tray
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Processors - Application Specialized
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-L2FFG676I
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Processors - Application Specialized
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-L2FFG676I
The three parts on the right have similar specifications to XC7Z030-L2FFG676I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountPackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)JESD-30 CodeInterfaceMax Supply VoltageMin Supply VoltageNumber of I/ORAM SizeCore ProcessorPeripheralsPropagation DelayConnectivityArchitectureCore ArchitectureBoundary ScanRAM (words)Primary AttributesNumber of RegistersBus CompatibilityHeight Seated (Max)LengthWidthRoHS StatusSpeedSpeed GradeSurface MountNumber of PinsOperating Supply VoltageView Compare
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XC7Z030-L2FFG676I10 WeeksCopper, Silver, TinSurface Mount676-BBGA, FCBGA-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIEDS-PBGA-B676CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA100 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 125K Logic Cells157200CAN; ETHERNET; I2C; SPI; UART; USB3.24mm27mm27mmROHS3 Compliant------
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10 Weeks--676-BBGA, FCBGA0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)-----------------130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA---Kintex™-7 FPGA, 350K Logic Cells-----ROHS3 Compliant1GHz----
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10 WeeksCopper, Silver, TinSurface Mount676-BBGA, FCBGA0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)--CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIEDS-PBGA-B676CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA120 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic Cells343800CAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 Compliant-1---
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10 Weeks--900-BBGA, FCBGA-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)--CMOSBOTTOMBALL2451V-667MHz30-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA130 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic Cells343800CAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant-1YES9001V
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