XC7Z030-L2FFG676I

Xilinx Inc. XC7Z030-L2FFG676I

Part Number:
XC7Z030-L2FFG676I
Manufacturer:
Xilinx Inc.
Ventron No:
3669378-XC7Z030-L2FFG676I
Description:
IC SOC CORTEX-A9 KINTEX7 676BGA
ECAD Model:
Datasheet:
XC7Z030-L2FFG676I

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Specifications
Xilinx Inc. XC7Z030-L2FFG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-L2FFG676I.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    676
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    800MHz
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B676
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Max Supply Voltage
    1.05V
  • Min Supply Voltage
    950mV
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Propagation Delay
    100 ps
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 125K Logic Cells
  • Number of Registers
    157200
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    3.24mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Its package is 676-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 125K Logic Cells.Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 130.A 1V power supply should be used.A system on a chip benefits from having 676 terminations.In this wireless SoC, the frequency is set to 800MHz.In terms of core architecture, the SoC meaning relies on ARM.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.It has a maximum supply voltage of 1.05V rated for it.At least 950mV power is delivered to it.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z030-L2FFG676I System On Chip (SoC) applications.

Central alarm system
Medical
Print Special Issue Flyer
Keywords
Digital Media
Avionics
High-end PLC
Automated sorting equipment
Embedded systems
Central inverter
XC7Z030-L2FFG676I More Descriptions
FPGA Zynq-7000 125000 Cells 28nm Technology 1V 676-Pin FCBGA Tray
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676BGA
Processors - Application Specialized
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-L2FFG676I
Product Comparison
The three parts on the right have similar specifications to XC7Z030-L2FFG676I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    JESD-30 Code
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Propagation Delay
    Connectivity
    Architecture
    Core Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Number of Registers
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Speed
    Speed Grade
    Surface Mount
    Number of Pins
    Operating Supply Voltage
    View Compare
  • XC7Z030-L2FFG676I
    XC7Z030-L2FFG676I
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    676-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    800MHz
    NOT SPECIFIED
    S-PBGA-B676
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    100 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 125K Logic Cells
    157200
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.24mm
    27mm
    27mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
  • XC7Z045-3FFV676E
    10 Weeks
    -
    -
    676-BBGA, FCBGA
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    -
    -
    -
    -
    ROHS3 Compliant
    1GHz
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    676-BBGA, FCBGA
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    S-PBGA-B676
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    120 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    343800
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    -
    1
    -
    -
    -
  • XC7Z035-1FFG900I
    10 Weeks
    -
    -
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    667MHz
    30
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    130 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    343800
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    -
    -
    ROHS3 Compliant
    -
    1
    YES
    900
    1V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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