Xilinx Inc. XC7Z030-3FFG676E

Name: XC7Z030-3FFG676E
Brand: Xilinx Inc.
SKU: 3669280-XC7Z030-3FFG676E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z030-3FFG676E

Manufacturer:: Xilinx Inc.

Ventron No:: 3669280-XC7Z030-3FFG676E

Description:: IC SOC CORTEX-A9 KINTEX7 676FBGA

ECAD Model:

Datasheet:: XC7Z030-3FFG676E

Specifications

Xilinx Inc. XC7Z030-3FFG676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-3FFG676E.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Number of Pins
676
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
1GHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z030
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-3
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
3.24mm
Length
27mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The Embedded - System On Chip (SoC) chip from Xilinx Inc., belonging to the Embedded - System On Chip (SoC) category, has a JESD-609 Code of e1. It features a Terminal Finish of Tin/Silver/Copper (Sn/Ag/Cu) and a HTS Code of 8542.39.00.01. With a Terminal Pitch of 1mm and a Supply Voltage-Max (Vsup) of 1.05V, this chip offers 130 I/O options and a RAM Size of 256KB. Its architecture includes both MCU and FPGA capabilities, with a Data Bus Width of 32b and a Speed Grade of -3.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z030-3FFG676E System On Chip (SoC) applications.

AC-input BLDC motor drive
ARM
Level
Apple smart watch
Industrial automation devices
Vending machines
Industrial
Smart appliances
Remote control
AC drive control module

XC7Z030-3FFG676E More Descriptions

MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-676
IC SOC CORTEX-A9 KINTEX7 676FBGA
Processors - Application Specialized
RED ABRASIVE STIKIT DISC 01109 6
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z030-3FFG676E

Product Comparison

The three parts on the right have similar specifications to XC7Z030-3FFG676E.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

Base Part Number

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Interface

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Data Bus Width

Core Architecture

Boundary Scan

Speed Grade

RAM (words)

Primary Attributes

Bus Compatibility

Height Seated (Max)

Length

Radiation Hardening

RoHS Status

JESD-30 Code

Memory Type

Mount

Additional Feature

Max Supply Voltage

Min Supply Voltage

Propagation Delay

Turn On Delay Time

Number of Registers

Width

View Compare
XC7Z030-3FFG676E

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

676-BBGA, FCBGA

YES

676

0°C~100°C TJ

Tray

2009

Zynq®-7000

e1

Active

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

1GHz

30

XC7Z030

1V

1.05V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

ARM

YES

-3

256000

Kintex™-7 FPGA, 125K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.24mm

27mm

No

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-
XC7Z045-2FFG676E

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

676-BBGA, FCBGA

YES

-

0°C~100°C TJ

Tray

2009

Zynq®-7000

e1

Active

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

XC7Z045

1V

1.05V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

ARM

YES

-2

256000

Kintex™-7 FPGA, 350K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.37mm

27mm

No

ROHS3 Compliant

S-PBGA-B676

ROMless

-

-

-

-

-

-

-

-

XC7Z030-3FFG676E vs XC7Z045-2FFG676E
XC7Z100-L2FFG900I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

900-BBGA, FCBGA

-

900

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

-

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

ARM

YES

-

256000

Kintex™-7 FPGA, 444K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

-

ROHS3 Compliant

-

-

Surface Mount

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

1.05V

950mV

120 ps

120 ps

554800

31mm

XC7Z030-3FFG676E vs XC7Z100-L2FFG900I
XC7Z035-1FFG900I

Xilinx Inc.

10 Weeks

-

900-BBGA, FCBGA

YES

900

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

CMOS

BOTTOM

BALL

245

1V

-

667MHz

30

-

1V

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

ARM

YES

1

256000

Kintex™-7 FPGA, 275K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

-

-

ROHS3 Compliant

-

-

-

-

-

-

130 ps

-

343800

-

XC7Z030-3FFG676E vs XC7Z035-1FFG900I