XC7Z030-3FBG484E

Xilinx Inc. XC7Z030-3FBG484E

Part Number:
XC7Z030-3FBG484E
Manufacturer:
Xilinx Inc.
Ventron No:
3669302-XC7Z030-3FBG484E
Description:
IC SOC CORTEX-A9 KINTEX7 484FBGA
ECAD Model:
Datasheet:
XC7Z030-3FBG484E

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Specifications
Xilinx Inc. XC7Z030-3FBG484E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-3FBG484E.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    484-BBGA, FCBGA
  • Surface Mount
    YES
  • Number of Pins
    484
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    1GHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z030
  • Operating Supply Voltage
    1V
  • Supply Voltage-Max (Vsup)
    1.05V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -3
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 125K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    2.54mm
  • Length
    23mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Its package is 484-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.Having 484 terminations in total makes system on a chip possible.You can get system on chips with similar specs and purposes by searching XC7Z030.In this wireless SoC, the frequency is set to 1GHz.The SoC meaning is based on the core architecture of ARM.This is the version with 484 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z030-3FBG484E System On Chip (SoC) applications.

sequence controllers
Keyboard
Industrial sectors
Automotive gateway
Robotics
Video Imaging
RISC-V
Flow Sensors
Communication interfaces ( I2C, SPI )
POS Terminals
XC7Z030-3FBG484E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 484-Pin FCBGA
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 1GHz 1V
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-484
Processors - Application Specialized XC7Z030-3FBG484E
IC SOC CORTEX-A9 1GHZ 484FCBGA
IC SOC CORTEX-A9 KINTEX7 484FBGA
IC SOC CORTEX-A9 667MHZ 485FCBGA
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z030-3FBG484E
Product Comparison
The three parts on the right have similar specifications to XC7Z030-3FBG484E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Mount
    JESD-30 Code
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    Width
    Additional Feature
    Turn On Delay Time
    View Compare
  • XC7Z030-3FBG484E
    XC7Z030-3FBG484E
    10 Weeks
    Copper, Silver, Tin
    484-BBGA, FCBGA
    YES
    484
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    484
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    250
    1V
    1mm
    1GHz
    30
    XC7Z030
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -3
    256000
    Kintex™-7 FPGA, 125K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    23mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    -
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    800MHz
    NOT SPECIFIED
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    3
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    -
    ROHS3 Compliant
    Surface Mount
    S-PBGA-B676
    1.05V
    950mV
    110 ps
    343800
    27mm
    -
    -
  • XC7Z100-L2FFG900I
    10 Weeks
    Copper, Silver, Tin
    900-BBGA, FCBGA
    -
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    -
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    -
    ROHS3 Compliant
    Surface Mount
    -
    1.05V
    950mV
    120 ps
    554800
    31mm
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    120 ps
  • XC7Z035-1FFG900I
    10 Weeks
    -
    900-BBGA, FCBGA
    YES
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    667MHz
    30
    -
    1V
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    130 ps
    343800
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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