Xilinx Inc. XC7Z030-3FBG484E
- Part Number:
- XC7Z030-3FBG484E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669302-XC7Z030-3FBG484E
- Description:
- IC SOC CORTEX-A9 KINTEX7 484FBGA
- Datasheet:
- XC7Z030-3FBG484E
Xilinx Inc. XC7Z030-3FBG484E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-3FBG484E.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case484-BBGA, FCBGA
- Surface MountYES
- Number of Pins484
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency1GHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z030
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-3
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 125K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length23mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Its package is 484-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.Having 484 terminations in total makes system on a chip possible.You can get system on chips with similar specs and purposes by searching XC7Z030.In this wireless SoC, the frequency is set to 1GHz.The SoC meaning is based on the core architecture of ARM.This is the version with 484 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-3FBG484E System On Chip (SoC) applications.
sequence controllers
Keyboard
Industrial sectors
Automotive gateway
Robotics
Video Imaging
RISC-V
Flow Sensors
Communication interfaces ( I2C, SPI )
POS Terminals
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Its package is 484-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.Having 484 terminations in total makes system on a chip possible.You can get system on chips with similar specs and purposes by searching XC7Z030.In this wireless SoC, the frequency is set to 1GHz.The SoC meaning is based on the core architecture of ARM.This is the version with 484 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-3FBG484E System On Chip (SoC) applications.
sequence controllers
Keyboard
Industrial sectors
Automotive gateway
Robotics
Video Imaging
RISC-V
Flow Sensors
Communication interfaces ( I2C, SPI )
POS Terminals
XC7Z030-3FBG484E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 484-Pin FCBGA
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 1GHz 1V
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-484
Processors - Application Specialized XC7Z030-3FBG484E
IC SOC CORTEX-A9 1GHZ 484FCBGA
IC SOC CORTEX-A9 KINTEX7 484FBGA
IC SOC CORTEX-A9 667MHZ 485FCBGA
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z030-3FBG484E
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 1GHz 1V
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-484
Processors - Application Specialized XC7Z030-3FBG484E
IC SOC CORTEX-A9 1GHZ 484FCBGA
IC SOC CORTEX-A9 KINTEX7 484FBGA
IC SOC CORTEX-A9 667MHZ 485FCBGA
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z030-3FBG484E
The three parts on the right have similar specifications to XC7Z030-3FBG484E.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusMountJESD-30 CodeMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthAdditional FeatureTurn On Delay TimeView Compare
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XC7Z030-3FBG484E10 WeeksCopper, Silver, Tin484-BBGA, FCBGAYES4840°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)484EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2501V1mm1GHz30XC7Z0301V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-3256000Kintex™-7 FPGA, 125K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm23mmNoROHS3 Compliant----------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA--0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676---CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES3256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 CompliantSurface MountS-PBGA-B6761.05V950mV110 ps34380027mm--
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10 WeeksCopper, Silver, Tin900-BBGA, FCBGA-900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES-256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm-ROHS3 CompliantSurface Mount-1.05V950mV120 ps55480031mmPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY120 ps
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10 Weeks-900-BBGA, FCBGAYES900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)-CMOSBOTTOMBALL2451V-667MHz30-1V-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant----130 ps343800---
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