Xilinx Inc. XC7Z030-2FFG676E

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series Zynq?-7000.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.In the SoCs wireless, voltages above 1.05V are considered unsafe.In total, there are 676 terminations, so system on a chip is really aided by this.By searching XC7Z030, you can find system on chips with similar specs and purposes.It operates at a frequency of 800MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.676 pins are present on this computer SoC.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z030-2FFG676E System On Chip (SoC) applications.

Automotive gateway
Digital Signal Processing
Industrial automation devices
Body control module
Self-aware system-on-chip (SoC)
Measurement tools
Servo drive control module
Smart appliances
RISC-V
Efficient hardware for inference of neural networks