Xilinx Inc. XC7Z030-2FBG676I

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells together.Tray package houses this SoC system on a chip.This SoC part contains a total of 130 I/Os in total.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.system on a chip benefits from 676 terminations.Search XC7Z030 for system on chips with similar specs and purposes.At 800MHz, the wireless SoC works.It uses ARM as its core architecture.In this computer SoC, there are 676 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z030-2FBG676I System On Chip (SoC) applications.

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