Xilinx Inc. XC7Z030-1SB485I
- Part Number:
- XC7Z030-1SB485I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669325-XC7Z030-1SB485I
- Description:
- IC FPGA
- Datasheet:
- XC7Z030-1SB485I
Xilinx Inc. XC7Z030-1SB485I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-1SB485I.
- Factory Lead Time11 Weeks
- Package / Case484-FBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingBulk
- Published2009
- SeriesZynq®-7000
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)2A (4 Weeks)
- Number of Terminations485
- Additional FeatureGPIO WITH FOUR 32-BIT BANKS
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- JESD-30 CodeS-PBGA-B485
- Number of I/O130
- Speed667MHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- Clock Frequency667MHz
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 125K Logic Cells
- Bus CompatibilityCAN, ETHERNET, I2C, PCI, SPI, UART, USB
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).There is a 484-FBGA, FCBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Bulk package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.In total, there are 485 terminations, so system on a chip is really aided by this.Furthermore, this SoC processor also incorporates additional features similar to GPIO WITH FOUR 32-BIT BANKS which are available on other SoC processors also.There is 667MHz clock frequency for this SoC.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
GPIO WITH FOUR 32-BIT BANKS
Clock Frequency: 667MHz
There are a lot of Xilinx Inc.
XC7Z030-1SB485I System On Chip (SoC) applications.
Mobile computing
Flow Sensors
Medical
Fitness
POS Terminals
USB hard disk enclosure
POS Terminals
Special Issue Information
High-end PLC
Optical drive
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).There is a 484-FBGA, FCBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Bulk package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.In total, there are 485 terminations, so system on a chip is really aided by this.Furthermore, this SoC processor also incorporates additional features similar to GPIO WITH FOUR 32-BIT BANKS which are available on other SoC processors also.There is 667MHz clock frequency for this SoC.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
GPIO WITH FOUR 32-BIT BANKS
Clock Frequency: 667MHz
There are a lot of Xilinx Inc.
XC7Z030-1SB485I System On Chip (SoC) applications.
Mobile computing
Flow Sensors
Medical
Fitness
POS Terminals
USB hard disk enclosure
POS Terminals
Special Issue Information
High-end PLC
Optical drive
XC7Z030-1SB485I More Descriptions
FPGA ZYNQ-7000 Family 125000 Cells 28nm Technology 1V 485-Pin FCBGA
IC SOC CORTEX-A9 667MHZ 485FCBGA
Processors - Application Specialized
IC SOC CORTEX-A9 667MHZ 485FCBGA
Processors - Application Specialized
The three parts on the right have similar specifications to XC7Z030-1SB485I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormJESD-30 CodeNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsClock FrequencyConnectivityArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityRoHS StatusContact PlatingNumber of PinsJESD-609 CodeECCN CodeTerminal FinishPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceMemory TypeData Bus WidthCore ArchitectureSpeed GradeHeight Seated (Max)LengthRadiation HardeningMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthTurn On Delay TimeView Compare
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XC7Z030-1SB485I11 Weeks484-FBGA, FCBGAYES-40°C~100°C TJBulk2009Zynq®-7000noActive2A (4 Weeks)485GPIO WITH FOUR 32-BIT BANKS8542.39.00.01CMOSBOTTOMBALLS-PBGA-B485130667MHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA667MHzCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 125K Logic CellsCAN, ETHERNET, I2C, PCI, SPI, UART, USBROHS3 Compliant-----------------------------
-
10 Weeks676-BBGA, FCBGAYES-40°C~100°C TJTray2009Zynq®-7000-Active3 (168 Hours)676-8542.39.00.01CMOSBOTTOMBALL-130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USBROHS3 CompliantCopper, Silver, Tin676e13A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)2451V1mm800MHz30XC7Z0451V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USBROMless32bARM-22.54mm27mmNo-------
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10 Weeks676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000-Active3 (168 Hours)676--CMOSBOTTOMBALLS-PBGA-B676130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USBROHS3 CompliantCopper, Silver, Tin-e1-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)NOT SPECIFIED1V-667MHzNOT SPECIFIED---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--ARM12.54mm27mm-Surface Mount1.05V950mV120 ps34380027mm-
-
10 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000-Active4 (72 Hours)900PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.01CMOSBOTTOMBALL-130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USBROHS3 CompliantCopper, Silver, Tin900e13A991.DTin/Silver/Copper (Sn/Ag/Cu)2451V1mm800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--ARM-3.35mm31mm-Surface Mount1.05V950mV120 ps55480031mm120 ps
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