XC7Z030-1SB485I

Xilinx Inc. XC7Z030-1SB485I

Part Number:
XC7Z030-1SB485I
Manufacturer:
Xilinx Inc.
Ventron No:
3669325-XC7Z030-1SB485I
Description:
IC FPGA
ECAD Model:
Datasheet:
XC7Z030-1SB485I

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Specifications
Xilinx Inc. XC7Z030-1SB485I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-1SB485I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    484-FBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Bulk
  • Published
    2009
  • Series
    Zynq®-7000
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    2A (4 Weeks)
  • Number of Terminations
    485
  • Additional Feature
    GPIO WITH FOUR 32-BIT BANKS
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • JESD-30 Code
    S-PBGA-B485
  • Number of I/O
    130
  • Speed
    667MHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Clock Frequency
    667MHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 125K Logic Cells
  • Bus Compatibility
    CAN, ETHERNET, I2C, PCI, SPI, UART, USB
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).There is a 484-FBGA, FCBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Bulk package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.In total, there are 485 terminations, so system on a chip is really aided by this.Furthermore, this SoC processor also incorporates additional features similar to GPIO WITH FOUR 32-BIT BANKS which are available on other SoC processors also.There is 667MHz clock frequency for this SoC.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
GPIO WITH FOUR 32-BIT BANKS
Clock Frequency: 667MHz

There are a lot of Xilinx Inc.
XC7Z030-1SB485I System On Chip (SoC) applications.

Mobile computing
Flow Sensors
Medical
Fitness
POS Terminals
USB hard disk enclosure
POS Terminals
Special Issue Information
High-end PLC
Optical drive
XC7Z030-1SB485I More Descriptions
FPGA ZYNQ-7000 Family 125000 Cells 28nm Technology 1V 485-Pin FCBGA
IC SOC CORTEX-A9 667MHZ 485FCBGA
Processors - Application Specialized
Product Comparison
The three parts on the right have similar specifications to XC7Z030-1SB485I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    JESD-30 Code
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Clock Frequency
    Connectivity
    Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Bus Compatibility
    RoHS Status
    Contact Plating
    Number of Pins
    JESD-609 Code
    ECCN Code
    Terminal Finish
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Interface
    Memory Type
    Data Bus Width
    Core Architecture
    Speed Grade
    Height Seated (Max)
    Length
    Radiation Hardening
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    Width
    Turn On Delay Time
    View Compare
  • XC7Z030-1SB485I
    XC7Z030-1SB485I
    11 Weeks
    484-FBGA, FCBGA
    YES
    -40°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    no
    Active
    2A (4 Weeks)
    485
    GPIO WITH FOUR 32-BIT BANKS
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    S-PBGA-B485
    130
    667MHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    667MHz
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 125K Logic Cells
    CAN, ETHERNET, I2C, PCI, SPI, UART, USB
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FBG676I
    10 Weeks
    676-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    -
    Active
    3 (168 Hours)
    676
    -
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    ROHS3 Compliant
    Copper, Silver, Tin
    676
    e1
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    245
    1V
    1mm
    800MHz
    30
    XC7Z045
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    ROMless
    32b
    ARM
    -2
    2.54mm
    27mm
    No
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    -
    Active
    3 (168 Hours)
    676
    -
    -
    CMOS
    BOTTOM
    BALL
    S-PBGA-B676
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    ROHS3 Compliant
    Copper, Silver, Tin
    -
    e1
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    ARM
    1
    2.54mm
    27mm
    -
    Surface Mount
    1.05V
    950mV
    120 ps
    343800
    27mm
    -
  • XC7Z100-L2FFG900I
    10 Weeks
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    -
    Active
    4 (72 Hours)
    900
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    ROHS3 Compliant
    Copper, Silver, Tin
    900
    e1
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    245
    1V
    1mm
    800MHz
    30
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    ARM
    -
    3.35mm
    31mm
    -
    Surface Mount
    1.05V
    950mV
    120 ps
    554800
    31mm
    120 ps
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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