Xilinx Inc. XC7Z030-1FBG676I
- Part Number:
- XC7Z030-1FBG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669275-XC7Z030-1FBG676I
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z030-1FBG676I
Xilinx Inc. XC7Z030-1FBG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-1FBG676I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Number of Pins676
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z030
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 125K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length27mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.As a result, there are 676 terminations in total, which does really benefit system on a chip.Search XC7Z030 for system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In order to operate the SoC meaning, it must be based on the core architecture of ARM.There is a 676-pin version of this computer SoC available.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG676I System On Chip (SoC) applications.
Microcontroller
Communication interfaces ( I2C, SPI )
Medical
Efficient hardware for training of neural networks
Central alarm system
Functional safety for critical applications in the automotive
USB hard disk enclosure
Apple smart watch
PC peripherals
System-on-chip (SoC)
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.As a result, there are 676 terminations in total, which does really benefit system on a chip.Search XC7Z030 for system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In order to operate the SoC meaning, it must be based on the core architecture of ARM.There is a 676-pin version of this computer SoC available.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG676I System On Chip (SoC) applications.
Microcontroller
Communication interfaces ( I2C, SPI )
Medical
Efficient hardware for training of neural networks
Central alarm system
Functional safety for critical applications in the automotive
USB hard disk enclosure
Apple smart watch
PC peripherals
System-on-chip (SoC)
XC7Z030-1FBG676I More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 667MHz 1V
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
Processors - Application Specialized XC7Z030-1FBG676I
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1FBG676I
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 667MHz 1V
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
Processors - Application Specialized XC7Z030-1FBG676I
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1FBG676I
The three parts on the right have similar specifications to XC7Z030-1FBG676I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusMountJESD-30 CodeMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthAdditional FeatureTurn On Delay TimeView Compare
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XC7Z030-1FBG676I10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES676-40°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm667MHz30XC7Z0301V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-1256000Kintex™-7 FPGA, 125K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant----------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA--0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIED---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 CompliantSurface MountS-PBGA-B6761.05V950mV120 ps34380027mm--
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10 WeeksCopper, Silver, Tin900-BBGA, FCBGA-900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES-256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm-ROHS3 CompliantSurface Mount-1.05V950mV120 ps55480031mmPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY120 ps
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10 Weeks-900-BBGA, FCBGAYES900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)-CMOSBOTTOMBALL2451V-667MHz30-1V-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant----130 ps343800---
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