Xilinx Inc. XC7Z030-1FBG676C
- Part Number:
- XC7Z030-1FBG676C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3828020-XC7Z030-1FBG676C
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z030-1FBG676C
Xilinx Inc. XC7Z030-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-1FBG676C.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Number of Pins676
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z030
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 125K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length27mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.The Zynq?-7000 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.It is recommended to use a 1V power supply.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.In total, there are 676 terminations, which makes system on a chip possible.XC7Z030 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is the 676-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG676C System On Chip (SoC) applications.
AC drive control module
Industrial AC-DC
Industrial automation devices
Functional safety for critical applications in the automotive
Medical Pressure
Functional safety for critical applications in the industrial sectors
Robotics
Defense
AC-input BLDC motor drive
Cyberphysical system-on-chip
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.The Zynq?-7000 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.It is recommended to use a 1V power supply.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.In total, there are 676 terminations, which makes system on a chip possible.XC7Z030 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is the 676-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG676C System On Chip (SoC) applications.
AC drive control module
Industrial AC-DC
Industrial automation devices
Functional safety for critical applications in the automotive
Medical Pressure
Functional safety for critical applications in the industrial sectors
Robotics
Defense
AC-input BLDC motor drive
Cyberphysical system-on-chip
XC7Z030-1FBG676C More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
Processors - Application Specialized XC7Z030-1FBG676C
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
French Electronic Distributor since 1988
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1FBG676C
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
Processors - Application Specialized XC7Z030-1FBG676C
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
French Electronic Distributor since 1988
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1FBG676C
The three parts on the right have similar specifications to XC7Z030-1FBG676C.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusSpeedMountAdditional FeatureMax Supply VoltageMin Supply VoltagePropagation DelayTurn On Delay TimeNumber of RegistersWidthView Compare
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XC7Z030-1FBG676C10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES6760°C~85°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm667MHz30XC7Z0301V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-1256000Kintex™-7 FPGA, 125K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant----------
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10 Weeks-676-BBGA, FCBGA--0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)----------------130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-----Kintex™-7 FPGA, 350K Logic Cells----ROHS3 Compliant1GHz--------
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10 WeeksCopper, Silver, Tin900-BBGA, FCBGA-900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES-256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm-ROHS3 Compliant-Surface MountPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY1.05V950mV120 ps120 ps55480031mm
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10 Weeks-900-BBGA, FCBGAYES900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900-Tin/Silver/Copper (Sn/Ag/Cu)-CMOSBOTTOMBALL2451V-667MHz30-1V-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 Compliant-----130 ps-343800-
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