XC7Z030-1FBG484C

Xilinx Inc. XC7Z030-1FBG484C

Part Number:
XC7Z030-1FBG484C
Manufacturer:
Xilinx Inc.
Ventron No:
3162306-XC7Z030-1FBG484C
Description:
IC SOC CORTEX-A9 KINTEX7 484FBGA
ECAD Model:
Datasheet:
XC7Z030-1FBG484C

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Specifications
Xilinx Inc. XC7Z030-1FBG484C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-1FBG484C.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    484-BBGA, FCBGA
  • Surface Mount
    YES
  • Number of Pins
    484
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    484
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    667MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z030
  • Operating Supply Voltage
    1V
  • Supply Voltage-Max (Vsup)
    1.05V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -1
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 125K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    2.54mm
  • Length
    23mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.According to the manufacturer, this system on a chip has a package of 484-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Ideally, a power supply with a voltage of 1V should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.A system on a chip benefits from having 484 terminations.You can get system on chips with similar specs and purposes by searching XC7Z030.There is 667MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.This is the version with 484 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z030-1FBG484C System On Chip (SoC) applications.

Published Paper
Cyberphysical system-on-chip
Sports
ARM
Functional safety for critical applications in the automotive
Microcontroller based SoC ( RISC-V, ARM)
Wireless sensor networks
Level
String inverter
Body control module
XC7Z030-1FBG484C More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 484-Pin FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-484
Processors - Application Specialized XC7Z030-1FBG484C
Trans MOSFET N-CH 50V 16A 3-Pin(2 Tab) TO-252AA T/R
IC SOC CORTEX-A9 667MHZ 484FCBGA
IC SOC CORTEX-A9 866MHZ 484BGA
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1FBG484C
Product Comparison
The three parts on the right have similar specifications to XC7Z030-1FBG484C.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Pbfree Code
    JESD-30 Code
    Supply Voltage-Min (Vsup)
    Speed
    Clock Frequency
    Width
    Memory Type
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    View Compare
  • XC7Z030-1FBG484C
    XC7Z030-1FBG484C
    10 Weeks
    Copper, Silver, Tin
    484-BBGA, FCBGA
    YES
    484
    0°C~85°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    484
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    250
    1V
    1mm
    667MHz
    30
    XC7Z030
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -1
    256000
    Kintex™-7 FPGA, 125K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    23mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z012S-2CLG485I
    10 Weeks
    -
    484-LFBGA, CSPBGA
    YES
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    Active
    3 (168 Hours)
    485
    -
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    -
    NOT SPECIFIED
    -
    -
    1.05V
    -
    150
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    YES
    -
    256000
    Artix™-7 FPGA, 55K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    -
    ROHS3 Compliant
    yes
    S-PBGA-B485
    0.95V
    766MHz
    800MHz
    19mm
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FBG676I
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    YES
    676
    -40°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    XC7Z045
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -2
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    ROMless
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    -
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    800MHz
    NOT SPECIFIED
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    3
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    -
    ROHS3 Compliant
    -
    S-PBGA-B676
    -
    -
    -
    27mm
    -
    Surface Mount
    1.05V
    950mV
    110 ps
    343800
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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