Xilinx Inc. XC7Z030-1FBG484C
- Part Number:
- XC7Z030-1FBG484C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162306-XC7Z030-1FBG484C
- Description:
- IC SOC CORTEX-A9 KINTEX7 484FBGA
- Datasheet:
- XC7Z030-1FBG484C
Xilinx Inc. XC7Z030-1FBG484C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-1FBG484C.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case484-BBGA, FCBGA
- Surface MountYES
- Number of Pins484
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations484
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z030
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 125K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length23mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.According to the manufacturer, this system on a chip has a package of 484-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Ideally, a power supply with a voltage of 1V should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.A system on a chip benefits from having 484 terminations.You can get system on chips with similar specs and purposes by searching XC7Z030.There is 667MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.This is the version with 484 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG484C System On Chip (SoC) applications.
Published Paper
Cyberphysical system-on-chip
Sports
ARM
Functional safety for critical applications in the automotive
Microcontroller based SoC ( RISC-V, ARM)
Wireless sensor networks
Level
String inverter
Body control module
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.According to the manufacturer, this system on a chip has a package of 484-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Ideally, a power supply with a voltage of 1V should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.A system on a chip benefits from having 484 terminations.You can get system on chips with similar specs and purposes by searching XC7Z030.There is 667MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.This is the version with 484 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG484C System On Chip (SoC) applications.
Published Paper
Cyberphysical system-on-chip
Sports
ARM
Functional safety for critical applications in the automotive
Microcontroller based SoC ( RISC-V, ARM)
Wireless sensor networks
Level
String inverter
Body control module
XC7Z030-1FBG484C More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 484-Pin FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-484
Processors - Application Specialized XC7Z030-1FBG484C
Trans MOSFET N-CH 50V 16A 3-Pin(2 Tab) TO-252AA T/R
IC SOC CORTEX-A9 667MHZ 484FCBGA
IC SOC CORTEX-A9 866MHZ 484BGA
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1FBG484C
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-484
Processors - Application Specialized XC7Z030-1FBG484C
Trans MOSFET N-CH 50V 16A 3-Pin(2 Tab) TO-252AA T/R
IC SOC CORTEX-A9 667MHZ 484FCBGA
IC SOC CORTEX-A9 866MHZ 484BGA
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1FBG484C
The three parts on the right have similar specifications to XC7Z030-1FBG484C.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusPbfree CodeJESD-30 CodeSupply Voltage-Min (Vsup)SpeedClock FrequencyWidthMemory TypeMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersView Compare
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XC7Z030-1FBG484C10 WeeksCopper, Silver, Tin484-BBGA, FCBGAYES4840°C~85°C TJTray2009Zynq®-7000e1Active4 (72 Hours)484EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2501V1mm667MHz30XC7Z0301V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-1256000Kintex™-7 FPGA, 125K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm23mmNoROHS3 Compliant-------------
-
10 Weeks-484-LFBGA, CSPBGAYES--40°C~100°C TJTray2016Zynq®-7000e3Active3 (168 Hours)485-Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mm-NOT SPECIFIED--1.05V-150256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--YES-256000Artix™-7 FPGA, 55K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm-ROHS3 CompliantyesS-PBGA-B4850.95V766MHz800MHz19mm------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES676-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z0451V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant------ROMless-----
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA--0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676---CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES3256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant-S-PBGA-B676---27mm-Surface Mount1.05V950mV110 ps343800
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