XC7Z020-3CLG400E

Xilinx Inc. XC7Z020-3CLG400E

Part Number:
XC7Z020-3CLG400E
Manufacturer:
Xilinx Inc.
Ventron No:
3669290-XC7Z020-3CLG400E
Description:
IC SOC CORTEX-A9 ARTIX-7 400BGA
ECAD Model:
Datasheet:
XC7Z020-3CLG400E

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Specifications
Xilinx Inc. XC7Z020-3CLG400E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z020-3CLG400E.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    400-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Number of Pins
    400
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    400
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1V
  • Terminal Pitch
    0.8mm
  • Frequency
    866MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z020
  • Operating Supply Voltage
    1V
  • Supply Voltage-Max (Vsup)
    1.05V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -3
  • RAM (words)
    256000
  • Primary Attributes
    Artix™-7 FPGA, 85K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    1.6mm
  • Length
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.It has been assigned a package 400-LFBGA, CSPBGA by its manufacturer for this system on a chip.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.In addition, this SoC security combines Artix?-7 FPGA, 85K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.There is no safe voltage for the SoCs wireless above 1.05V.In total, there are 400 terminations, so system on a chip is really aided by this.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z020.During operation, the wireless SoC runs at a frequency of 866MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.The computer SoC is available in 400-pin form.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z020-3CLG400E System On Chip (SoC) applications.

POS Terminals
Optical drive
USB hard disk enclosure
CNC control
Flow Sensors
Fitness
Transmitters
Cyber security for critical applications in the aerospace
Industrial automation devices
ARM
XC7Z020-3CLG400E More Descriptions
256KB ARM-ASeries 866MHz CSPBGA-400 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
MPU Zynq-7000 Thumb-2 32-Bit 800MHz 1.2V/3.3V 400-Pin CS-BGA
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 866MHz 1V
PSOC, ARM CORTEX-A9, 866MHZ, BGA-400
Processors - Application Specialized XC7Z020-3CLG400E
IC SOC CORTEX-A9 ARTIX-7 400BGA
Product Description Demo for Development.
IC SOC CORTEX-A9 667MHZ 484BGA
Psoc, Arm Cortex-A9, 866Mhz, Bga-400; Product Range:zynq Family 7000 Series Microprocessors; Cpu Speed:866Mhz; Core Architecture:arm Cortex-A9; Mpu Case Style:bga; No. Of Pins:400Pins; Automotive Qualification Standard:-; Msl:- Rohs Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to XC7Z020-3CLG400E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Pbfree Code
    JESD-30 Code
    Supply Voltage-Min (Vsup)
    Speed
    Clock Frequency
    Width
    Memory Type
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    View Compare
  • XC7Z020-3CLG400E
    XC7Z020-3CLG400E
    10 Weeks
    Copper, Silver, Tin
    400-LFBGA, CSPBGA
    YES
    400
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    400
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    260
    1V
    0.8mm
    866MHz
    30
    XC7Z020
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -3
    256000
    Artix™-7 FPGA, 85K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    17mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z014S-1CLG484I
    10 Weeks
    -
    484-LFBGA, CSPBGA
    YES
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    Active
    3 (168 Hours)
    484
    -
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    -
    NOT SPECIFIED
    -
    -
    1.05V
    -
    200
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    YES
    -
    256000
    Artix™-7 FPGA, 65K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    -
    ROHS3 Compliant
    yes
    S-PBGA-B484
    0.95V
    667MHz
    667MHz
    19mm
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FFG676E
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    YES
    -
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    XC7Z045
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -2
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.37mm
    27mm
    No
    ROHS3 Compliant
    -
    S-PBGA-B676
    -
    -
    -
    -
    ROMless
    -
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    -
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    -
    ROHS3 Compliant
    -
    S-PBGA-B676
    -
    -
    -
    27mm
    -
    Surface Mount
    1.05V
    950mV
    120 ps
    343800
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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