Xilinx Inc. XC7Z020-3CLG400E
- Part Number:
- XC7Z020-3CLG400E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669290-XC7Z020-3CLG400E
- Description:
- IC SOC CORTEX-A9 ARTIX-7 400BGA
- Datasheet:
- XC7Z020-3CLG400E
Xilinx Inc. XC7Z020-3CLG400E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z020-3CLG400E.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case400-LFBGA, CSPBGA
- Surface MountYES
- Number of Pins400
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations400
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1V
- Terminal Pitch0.8mm
- Frequency866MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z020
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-3
- RAM (words)256000
- Primary AttributesArtix™-7 FPGA, 85K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)1.6mm
- Length17mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.It has been assigned a package 400-LFBGA, CSPBGA by its manufacturer for this system on a chip.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.In addition, this SoC security combines Artix?-7 FPGA, 85K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.There is no safe voltage for the SoCs wireless above 1.05V.In total, there are 400 terminations, so system on a chip is really aided by this.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z020.During operation, the wireless SoC runs at a frequency of 866MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.The computer SoC is available in 400-pin form.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-3CLG400E System On Chip (SoC) applications.
POS Terminals
Optical drive
USB hard disk enclosure
CNC control
Flow Sensors
Fitness
Transmitters
Cyber security for critical applications in the aerospace
Industrial automation devices
ARM
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.It has been assigned a package 400-LFBGA, CSPBGA by its manufacturer for this system on a chip.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.In addition, this SoC security combines Artix?-7 FPGA, 85K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.There is no safe voltage for the SoCs wireless above 1.05V.In total, there are 400 terminations, so system on a chip is really aided by this.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z020.During operation, the wireless SoC runs at a frequency of 866MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.The computer SoC is available in 400-pin form.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-3CLG400E System On Chip (SoC) applications.
POS Terminals
Optical drive
USB hard disk enclosure
CNC control
Flow Sensors
Fitness
Transmitters
Cyber security for critical applications in the aerospace
Industrial automation devices
ARM
XC7Z020-3CLG400E More Descriptions
256KB ARM-ASeries 866MHz CSPBGA-400 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
MPU Zynq-7000 Thumb-2 32-Bit 800MHz 1.2V/3.3V 400-Pin CS-BGA
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 866MHz 1V
PSOC, ARM CORTEX-A9, 866MHZ, BGA-400
Processors - Application Specialized XC7Z020-3CLG400E
IC SOC CORTEX-A9 ARTIX-7 400BGA
Product Description Demo for Development.
IC SOC CORTEX-A9 667MHZ 484BGA
Psoc, Arm Cortex-A9, 866Mhz, Bga-400; Product Range:zynq Family 7000 Series Microprocessors; Cpu Speed:866Mhz; Core Architecture:arm Cortex-A9; Mpu Case Style:bga; No. Of Pins:400Pins; Automotive Qualification Standard:-; Msl:- Rohs Compliant: Yes
MPU Zynq-7000 Thumb-2 32-Bit 800MHz 1.2V/3.3V 400-Pin CS-BGA
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 866MHz 1V
PSOC, ARM CORTEX-A9, 866MHZ, BGA-400
Processors - Application Specialized XC7Z020-3CLG400E
IC SOC CORTEX-A9 ARTIX-7 400BGA
Product Description Demo for Development.
IC SOC CORTEX-A9 667MHZ 484BGA
Psoc, Arm Cortex-A9, 866Mhz, Bga-400; Product Range:zynq Family 7000 Series Microprocessors; Cpu Speed:866Mhz; Core Architecture:arm Cortex-A9; Mpu Case Style:bga; No. Of Pins:400Pins; Automotive Qualification Standard:-; Msl:- Rohs Compliant: Yes
The three parts on the right have similar specifications to XC7Z020-3CLG400E.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusPbfree CodeJESD-30 CodeSupply Voltage-Min (Vsup)SpeedClock FrequencyWidthMemory TypeMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersView Compare
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XC7Z020-3CLG400E10 WeeksCopper, Silver, Tin400-LFBGA, CSPBGAYES4000°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)400EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2601V0.8mm866MHz30XC7Z0201V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-3256000Artix™-7 FPGA, 85K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm17mmNoROHS3 Compliant-------------
-
10 Weeks-484-LFBGA, CSPBGAYES--40°C~100°C TJTray2016Zynq®-7000e3Active3 (168 Hours)484-Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mm-NOT SPECIFIED--1.05V-200256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--YES-256000Artix™-7 FPGA, 65K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm-ROHS3 CompliantyesS-PBGA-B4840.95V667MHz667MHz19mm------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES-0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z0451V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mmNoROHS3 Compliant-S-PBGA-B676----ROMless-----
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA--0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIED---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant-S-PBGA-B676---27mm-Surface Mount1.05V950mV120 ps343800
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