Xilinx Inc. XC7Z010-1CLG400I
- Part Number:
- XC7Z010-1CLG400I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3668397-XC7Z010-1CLG400I
- Description:
- IC SOC CORTEX-A9 ARTIX-7 400BGA
- Datasheet:
- XC7Z010-1CLG400I
Xilinx Inc. XC7Z010-1CLG400I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z010-1CLG400I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case400-LFBGA, CSPBGA
- Surface MountYES
- Number of Pins400
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2008
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations400
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1V
- Terminal Pitch0.8mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z010
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesArtix™-7 FPGA, 28K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)1.6mm
- Length17mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 400-LFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 28K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.A 1V power supply is recommended.There is no safe voltage for the SoCs wireless above 1.05V.In total, there are 400 terminations, so system on a chip is really aided by this.Search XC7Z010 for system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.It uses ARM as its core architecture.There is a 400-pin version of this computer SoC available.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-1CLG400I System On Chip (SoC) applications.
Microprocessors
Smartphone accessories
Test and Measurement
Networked sensors
Keyboard
Special Issue Editors
POS Terminals
Smart appliances
Fitness
Transmitters
Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 400-LFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 28K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.A 1V power supply is recommended.There is no safe voltage for the SoCs wireless above 1.05V.In total, there are 400 terminations, so system on a chip is really aided by this.Search XC7Z010 for system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.It uses ARM as its core architecture.There is a 400-pin version of this computer SoC available.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-1CLG400I System On Chip (SoC) applications.
Microprocessors
Smartphone accessories
Test and Measurement
Networked sensors
Keyboard
Special Issue Editors
POS Terminals
Smart appliances
Fitness
Transmitters
XC7Z010-1CLG400I More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 400-Pin CS-BGA
LFBGA-400 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
PSOC, ARM CORTEX-A9, 667MHZ, BGA-400
Processors - Application Specialized XC7Z010-1CLG400I
IC SOC CORTEX-A9 ARTIX-7 400BGA
IC DGTL SW 256X256 3.3V 64-TQFP
Product Description Demo for Development.
French Electronic Distributor since 1988
Psoc, Arm Cortex-A9, 667Mhz, Bga-400; Product Range:Zynq Family 7000S Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Bga; No. Of Pins:400Pins; Msl:-; Ic Case/Package:Bga Rohs Compliant: Yes |Amd Xilinx XC7Z010-1CLG400I
LFBGA-400 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
PSOC, ARM CORTEX-A9, 667MHZ, BGA-400
Processors - Application Specialized XC7Z010-1CLG400I
IC SOC CORTEX-A9 ARTIX-7 400BGA
IC DGTL SW 256X256 3.3V 64-TQFP
Product Description Demo for Development.
French Electronic Distributor since 1988
Psoc, Arm Cortex-A9, 667Mhz, Bga-400; Product Range:Zynq Family 7000S Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Bga; No. Of Pins:400Pins; Msl:-; Ic Case/Package:Bga Rohs Compliant: Yes |Amd Xilinx XC7Z010-1CLG400I
The three parts on the right have similar specifications to XC7Z010-1CLG400I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusPbfree CodeJESD-30 CodeSupply Voltage-Min (Vsup)SpeedClock FrequencyWidthMemory TypeView Compare
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XC7Z010-1CLG400I10 WeeksCopper, Silver, Tin400-LFBGA, CSPBGAYES400-40°C~100°C TJTray2008Zynq®-7000e1Active3 (168 Hours)400EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2601V0.8mm667MHz30XC7Z0101V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-1256000Artix™-7 FPGA, 28K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm17mmNoROHS3 Compliant--------
-
10 Weeks-484-LFBGA, CSPBGAYES--40°C~100°C TJTray2016Zynq®-7000e3Active3 (168 Hours)484-Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mm-NOT SPECIFIED--1.05V-200256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--YES-256000Artix™-7 FPGA, 65K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm-ROHS3 CompliantyesS-PBGA-B4840.95V667MHz667MHz19mm-
-
10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES676-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z0451V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant------ROMless
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10 Weeks-676-BBGA, FCBGA--0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)----------------130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-----Kintex™-7 FPGA, 350K Logic Cells----ROHS3 Compliant---1GHz---
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