XC7Z010-1CLG400C

Xilinx Inc. XC7Z010-1CLG400C

Part Number:
XC7Z010-1CLG400C
Manufacturer:
Xilinx Inc.
Ventron No:
3668409-XC7Z010-1CLG400C
Description:
IC SOC CORTEX-A9 ARTIX-7 400BGA
ECAD Model:
Datasheet:
XC7Z010-1CLG400C

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Specifications
Xilinx Inc. XC7Z010-1CLG400C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z010-1CLG400C.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    400-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Number of Pins
    400
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    400
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1V
  • Terminal Pitch
    0.8mm
  • Frequency
    667MHz
  • Base Part Number
    XC7Z010
  • Operating Supply Voltage
    1V
  • Supply Voltage-Max (Vsup)
    1.05V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -1
  • RAM (words)
    256000
  • Primary Attributes
    Artix™-7 FPGA, 28K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    1.6mm
  • Length
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 400-LFBGA, CSPBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq?-7000 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 28K Logic Cells together.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.In the SoCs wireless, voltages above 1.05V are considered unsafe.The system on a chip uses 400 terminations in total.Searching XC7Z010 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 667MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 400.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z010-1CLG400C System On Chip (SoC) applications.

Communication network-on-Chip (cNoC)
AC-input BLDC motor drive
Medical
Self-aware system-on-chip (SoC)
Embedded systems
Industrial transport
Communication interfaces ( I2C, SPI )
Automotive
Digital Media
Test and Measurement
XC7Z010-1CLG400C More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 400-Pin CS-BGA
CSPBGA-400 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
EPCOS B59721A0090A062 THERMISTOR, PTC, 0805, 90C, 5C
PSOC, ARM CORTEX-A9, 667MHZ, BGA-400
Processors - Application Specialized XC7Z010-1CLG400C
IC SOC CORTEX-A9 ARTIX-7 400BGA
New and Oringinal with 360 days guarantee
Product Description Demo for Development.
French Electronic Distributor since 1988
Psoc, Arm Cortex-A9, 667Mhz, Bga-400; Product Range:zynq Family 7000S Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:arm Cortex-A9; Mpu Case Style:bga; No. Of Pins:400Pins; Automotive Qualification Standard:-; Msl:- Rohs Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to XC7Z010-1CLG400C.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Mount
    Reflow Temperature-Max (s)
    JESD-30 Code
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    Width
    Additional Feature
    Turn On Delay Time
    View Compare
  • XC7Z010-1CLG400C
    XC7Z010-1CLG400C
    10 Weeks
    Copper, Silver, Tin
    400-LFBGA, CSPBGA
    YES
    400
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    400
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    260
    1V
    0.8mm
    667MHz
    XC7Z010
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -1
    256000
    Artix™-7 FPGA, 28K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    17mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    -
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    800MHz
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    3
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    -
    ROHS3 Compliant
    Surface Mount
    NOT SPECIFIED
    S-PBGA-B676
    1.05V
    950mV
    110 ps
    343800
    27mm
    -
    -
  • XC7Z100-L2FFG900I
    10 Weeks
    Copper, Silver, Tin
    900-BBGA, FCBGA
    -
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    -
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    -
    ROHS3 Compliant
    Surface Mount
    30
    -
    1.05V
    950mV
    120 ps
    554800
    31mm
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    120 ps
  • XC7Z035-1FFG900I
    10 Weeks
    -
    900-BBGA, FCBGA
    YES
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    667MHz
    -
    1V
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    -
    -
    ROHS3 Compliant
    -
    30
    -
    -
    -
    130 ps
    343800
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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