XC7Z007S-2CLG225I

Xilinx Inc. XC7Z007S-2CLG225I

Part Number:
XC7Z007S-2CLG225I
Manufacturer:
Xilinx Inc.
Ventron No:
3828074-XC7Z007S-2CLG225I
Description:
IC FPGA SOC 100I/O 225BGA
ECAD Model:
Datasheet:
XC7Z007S-2CLG225I

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Specifications
Xilinx Inc. XC7Z007S-2CLG225I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z007S-2CLG225I.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    225-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    225
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    S-PBGA-B225
  • Supply Voltage-Max (Vsup)
    1.05V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Number of I/O
    54
  • Speed
    766MHz
  • RAM Size
    256KB
  • Core Processor
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Clock Frequency
    800MHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Artix™-7 FPGA, 23K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    1.5mm
  • Length
    13mm
  • Width
    13mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Single ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Single ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.According to the manufacturer, this system on a chip has a package of 225-LFBGA, CSPBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq?-7000 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.Taking note of the fact that this SoC security combines Artix?-7 FPGA, 23K Logic Cells is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 54 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supply should be at least 0.95V.There are 225 terminations in total and that really benefits system on a chip.There is 800MHz clock frequency that is used in this SoC.

Single ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Clock Frequency: 800MHz

There are a lot of Xilinx Inc.
XC7Z007S-2CLG225I System On Chip (SoC) applications.

Defense
Industrial robot
Industrial AC-DC
POS Terminals
Communication interfaces ( I2C, SPI )
Functional safety for critical applications in the industrial sectors
DC-input BLDC motor drive
Body control module
CNC control
Keyboard
XC7Z007S-2CLG225I More Descriptions
Processors - Application Specialized XC7Z007S-2CLG225I
PSOC, ARM CORTEX-A9, 766MHZ, BGA-225
IC SOC CORTEX-A9 766MHZ 225BGA
Zynq-7000 All Programmable SoC Family
Psoc, Arm Cortex-A9, 766Mhz, Bga-225; Product Range:Zynq Family 7000S Series Microprocessors; Cpu Speed:766Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Bga; No. Of Pins:225Pins; Msl:-; Ic Case/Package:Bga Rohs Compliant: Yes |Amd Xilinx XC7Z007S-2CLG225I
Product Comparison
The three parts on the right have similar specifications to XC7Z007S-2CLG225I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Clock Frequency
    Connectivity
    Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    RoHS Status
    HTS Code
    Contact Plating
    ECCN Code
    Frequency
    Base Part Number
    Operating Supply Voltage
    Interface
    Memory Type
    Data Bus Width
    Core Architecture
    Speed Grade
    Radiation Hardening
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    View Compare
  • XC7Z007S-2CLG225I
    XC7Z007S-2CLG225I
    10 Weeks
    225-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e1
    yes
    Active
    3 (168 Hours)
    225
    Tin/Silver/Copper (Sn/Ag/Cu)
    CMOS
    BOTTOM
    BALL
    260
    1V
    0.8mm
    30
    S-PBGA-B225
    1.05V
    0.95V
    54
    766MHz
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    800MHz
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Artix™-7 FPGA, 23K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.5mm
    13mm
    13mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z012S-2CLG485I
    10 Weeks
    484-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    yes
    Active
    3 (168 Hours)
    485
    Matte Tin (Sn)
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    NOT SPECIFIED
    S-PBGA-B485
    1.05V
    0.95V
    150
    766MHz
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    800MHz
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Artix™-7 FPGA, 55K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    19mm
    ROHS3 Compliant
    8542.31.00.01
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FFG676E
    10 Weeks
    676-BBGA, FCBGA
    YES
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    -
    Active
    4 (72 Hours)
    676
    Tin/Silver/Copper (Sn/Ag/Cu)
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    30
    S-PBGA-B676
    1.05V
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.37mm
    27mm
    -
    ROHS3 Compliant
    8542.39.00.01
    Copper, Silver, Tin
    3A991.D
    800MHz
    XC7Z045
    1V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    ROMless
    32b
    ARM
    -2
    No
    -
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    -
    Active
    3 (168 Hours)
    676
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    NOT SPECIFIED
    S-PBGA-B676
    -
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    -
    Copper, Silver, Tin
    -
    667MHz
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    ARM
    1
    -
    Surface Mount
    1.05V
    950mV
    120 ps
    343800
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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